Developing a Reliable Lead-free SMT Process
Published: |
January 3, 2008 |
Author: |
Peter Biocca, Senior Development Engineer, Kester. |
Abstract: |
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.... |
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