Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Kester


Developing a Reliable Lead-free SMT Process

Published:

January 3, 2008

Author:

Peter Biocca, Senior Development Engineer, Kester.

Abstract:

Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C....

  • Download Developing a Reliable Lead-free SMT Process article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(13) technical library articles

(38) news releases

More SMT / PCB technical articles from Kester

Dec 29, 2016 -

Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities

Oct 23, 2012 -

Lead-free SMT Soldering Defects How to Prevent Them

Feb 13, 2009 -

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Jan 15, 2009 -

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Jul 01, 2008 -

Lead-Free Reliability - Building It Right The First Time

Nov 15, 2007 -

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

May 07, 1999 -

Manufacturing Considerations When Implementing Voc-Free Flux Technology

May 07, 1999 -

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

May 07, 1999 -

Soldering to Gold Over Nickel Surfaces

May 07, 1999 -

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

Developing a Reliable Lead-free SMT Process article has been viewed 1606 times

Lead Free Wave Solder - 1 Click SMT

 Reflow System