Developing a Reliable Lead-free SMT Process

Published:

January 3, 2008

Author:

Peter Biocca, Senior Development Engineer, Kester.

Abstract:

Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C....

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Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

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