Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Kester


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  • Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Published:

November 15, 2007

Author:

Peter Biocca, Carlos Rivas

Abstract:

At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes....

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Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(14) technical library articles

(47) news releases

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Feb 13, 2009 -

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Jan 15, 2009 -

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Jul 01, 2008 -

Lead-Free Reliability - Building It Right The First Time

Jan 03, 2008 -

Developing a Reliable Lead-free SMT Process

May 07, 1999 -

Manufacturing Considerations When Implementing Voc-Free Flux Technology

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SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

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Soldering to Gold Over Nickel Surfaces

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  • Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level
Metcal soldering rework

Reflow Oven