Laser Solder Reflow: A Process Solution Part II
Published: |
September 13, 2007 |
Author: |
John Vivari; EFD, Inc., Alex Kasman, Leister Technologies USA |
Abstract: |
With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space. Where technique comes in is choosing where and for how long to apply that light along with the application of accessory equipment to optimize solder paste reflow. This presentation covers the specifics of how to determine which process choices are the right process choices based on the needs of your product to maximize yield and throughput.... |
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