BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages
Published: |
February 1, 2007 |
Author: |
Ray Cirimele, Best, Inc |
Abstract: |
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.... |
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