Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by IBM Corporation


Improvement of Organic Packaging Thermal Cycle Performance Measurement

Published:

November 1, 2006

Author:

Glenn O. Dearing, Paul J. Hart

Abstract:

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation....

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Company Information:

IBM Corporation

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Other, Software Manufacturer

  • Phone 800-IBM-4YOU

IBM Corporation website

Company Postings:

(4) technical library articles

(1) news release

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