Assembly And Reliability Issues Associated With Leadless Chip Scale Packages
Published: |
October 2, 2006 |
Author: |
Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY |
Abstract: |
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Universal Instruments Corporation »
- Oct 30, 2014 - Solder Joint Reliability Under Realistic Service Conditions
- Jan 23, 2014 - Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
- Mar 04, 2013 - Process Issues For Fine Pitch CSP Rework and Scavenging
- Nov 29, 2007 - Optimizing Flip Chip Substrate Layout for Assembly
- Sep 27, 2007 - The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards
- See all SMT / PCB technical articles from Universal Instruments Corporation »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Assembly And Reliability Issues Associated With Leadless Chip Scale Packages article has been viewed 514 times
