Electronics Manufacturing Technical Articles
Technical Articles posted by TT Electronics
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TT Electronics Technical Articles
TT Electronics has 1 articles posted.
Assembly and Rework of Lead Free Package on Package Technology
Published: |
Mar 22, 2012 |
Author: |
Raymond G. Clark, Joseph D. Poole, TT Electronics - IMS |
Abstract: |
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha... |
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