Technical Articles From Siemens Process Industries and Drives
Read technical articles about electronics manufacturing added by Siemens Process Industries and Drives
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- Articles from Siemens Process Industries and Drives
7 technical articles added by Siemens Process Industries and Drives
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Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
Nov 20, 2023 | Konstantin Schmidt, Nils Thielen, Christian Voigt, Reinhardt Seidel, Jörg Franke, Yannik Milde, Jochen Bönig and Gunter Beitinger
The electronics production is prone to a multitude of possible failures along the production process. Therefore, the manufacturing process of surface-mounted electronics devices (SMD) includes visual quality inspection processes for defect detection. The detection of certain error patterns like solder voids and head in pillow defects require radioscopic inspection. These high-end inspection machines, like the X-ray inspection, rely on static checking routines, programmed manually by the expert user of the machine, to verify the quality. The utilization of the implicit knowledge of domain expert(s), based on soldering guidelines, allows the evaluation of the quality. The distinctive dependence on the individual qualification significantly influences false call rates of the inbuilt computer vision routines. In this contribution, we present a novel framework for the automatic solder joint classification based on Convolutional Neural Networks (CNN), flexibly reclassifying insufficient X-ray inspection results. We utilize existing deep learning network architectures for a region of interest detection on 2D grayscale images. The comparison with product-related meta-data ensures the presence of relevant areas and results in a subsequent classification based on a CNN. Subsequent data augmentation ensures sufficient input features. The results indicate a significant reduction of the false call rate compared to commercial X-ray machines, combined with reduced product-related optimization iterations....
Failure Mechanisms Of Electromechanical Relays On PCBAs: Part I
Sep 15, 2021 | Gert Vogel
Many printed circuit board assemblies (PCBAs) have relays that are soldered to the PCB. If such an electromechanical component fails, it can cause the whole device to fail, just like any other electronic component. The spectrum of root causes that lead to an increased contact resistance or a complete contact failure is totally different from what usually occurs in the electronics domain. This article provides a detailed analysis of these failures and the corresponding root causes, many of them self-centering....
Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.
Jan 21, 2009 | Gordon Christison
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology....
Simple, Effective Process Control in Wave Soldering
Jun 23, 1999 | Chrys Shea
This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time....
Optimizing the Wave Soldering Process with Hot Nitrogen Knives
Apr 29, 1999 | Chrys Shea, Siemens, & Gary Shipe, Air Products
The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests....
VOC-Free Wave Solder Flux Evaluation
Apr 26, 1999 | Chrys Shea, Siemens ICN
The goal of the flux evaluation was to identify one product that would meet the needs of all SICN's wave solder products and processes while producing high quality assemblies. At the outset of the evaluation, it was unclear whether a single flux chemistry could satisfy such a broad range of demands, particularly because SICN's utilization of less aggressive, low-impact chemicals....
The Characterization and Comparison of Spray Fluxers
Apr 26, 1999 | Chrys Shea & Tom Chinnici, Siemens Business Communication Systems, Inc., Originally published at Nepcon West '98
An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results....
