Technical Articles

Dec 14, 2012

Rosa Croughwell and John McNeill, Worcester Polytechnic Institute

This paper examines the potential failure mechanisms that can damage modern lowvoltage CMOS devices and their relationship to electrical testing. Failure mechanisms such as electrostatic discharge (ESD), CMOS latch-up, and transistor gate oxide degradation can occur as a result of electrical over-voltage stress (EOS). In this paper, EOS due to electrical testing is examined and an experiment is conducted using pulsed voltage waveforms corresponding to conditions encountered during in-circuit electrical testing. Experimental results indicate a correlation between amplitude and duration of the pulse waveform and device degradation due to one or more of the failure mechanisms....

Mar 04, 2010

Mario Scalzo Senior Technical Support Engineer CSMTPE, Six Sigma Black Belt, Indium

While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine p...

Feb 25, 2010

Cadence

With the recent global economic slowdown, system companies are facing shrinking markets and prospects with less available budget for purchasing new or the latest electronic products. Given the recent pre-downturn health of the global electronic syst...

Feb 18, 2010

Best Inc

This paper describes a new rework process for leadless devices where the devices can be manually placed without relying on capital equipment....

Feb 10, 2010

HumiSeal Europe

...

Feb 03, 2010

OCM Manufacturing

This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto-market and support their cost-per...

Jan 19, 2010

Microscan Systems, Inc.

Learn how TTC solutions help manufacturers cut cost, cut waste, automate critical manufacturing processes, and increase yields—all critical elements in today’s economic environment....

Jan 13, 2010

BEST Inc

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires...

Jan 06, 2010

Henkel / Ablestik Laboratories

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA)....

Dec 23, 2009

APS Novastar

Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ...