Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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812 SMT / PCB Technical Articles

Larger Packages Fuel Thermal Strategies

May 06, 1999 | Christopher Chapman, Aavid Thermal Products, Inc.

The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat to the board than leaded devices, the style of BGA packages has a large influence on the ability to transfer heat through other pathways, such as a top-mounted heat sink. Physical characteristics of the BGA further constrain the thermal designer. It takes forethought in board design to successfully accommodate devices that require significant heat dissipation. Multiple solutions exist, however, for BGA packages of all types....

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Components

How To Size Heat Sinks For Semiconductors

May 06, 1999 | Jeffery Schindler, Aavid Thermal Products, Inc.

As microprocessor speeds increase, their power needs rise proportionally. This also puts higher demands on the voltage regulator that feeds the processor chip. In spite of the increased power, the regulator chip tends to remain the same size.....

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Components

Beat the Heat in Notebooks With Software

May 06, 1999 | Christopher L. Chapman, Aavid Thermal Products, Inc.

Pentium-class portables present significant packaging problems. The heat generated inside a notebook not only reduces microprocessor reliability, but the reliability of peripheries such as hard drives and video chips. Although the processor is the primary heat-generating source, it isn’t always the component least tolerant of temperature......

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Components

As Cool as a Cucumber: Managing the Heat Produced by IC Developments

May 06, 1999 | Christopher A. Soule

Many of us tend to think of semiconductors as low power, cool devices. But as the number of transistors in an integrated circuit increases, so does power consumption increases and the need to dissipate the resulting heat load. Microprocessors, in particular, consume more and more power with increase in speed and complexity. ...

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Components

Augmented-Fin-Air Cooled Heat Sinks

May 06, 1999 | Christopher A. Soule

Augmented-Fin Air-Cooled Heat Sinks Achieve Higher Performance without Significant Rise in Static Pressure Drop....

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Components

Augmentation Improves Thermal Performance of Air Cooled Heat Sinks.

May 06, 1999 | Christopher A. Soule, Aavid Thermal Products,Inc.

Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ......

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Components

Optimizing the Wave Soldering Process with Hot Nitrogen Knives

Apr 29, 1999 | Chrys Shea, Siemens, & Gary Shipe, Air Products

The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, USA

Manufacturer of Assembly Equipment

VOC-Free Wave Solder Flux Evaluation

Apr 26, 1999 | Chrys Shea, Siemens ICN

The goal of the flux evaluation was to identify one product that would meet the needs of all SICN's wave solder products and processes while producing high quality assemblies. At the outset of the evaluation, it was unclear whether a single flux chemistry could satisfy such a broad range of demands, particularly because SICN's utilization of less aggressive, low-impact chemicals....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, USA

Manufacturer of Assembly Equipment

The Characterization and Comparison of Spray Fluxers

Apr 26, 1999 | Chrys Shea & Tom Chinnici, Siemens Business Communication Systems, Inc., Originally published at Nepcon West '98

An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, USA

Manufacturer of Assembly Equipment

Intel Packaging Databook

Apr 15, 1999 | Intel Corporation

Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. IC assembly, performance characteristics, physical constants, detailed discussions of SMT, etc....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

An Introduction to Solder Materials

Apr 15, 1999 | Brian Bauer, Rick Lathrop

Solder paste is a seemingly simple material that forms one of the foundations of the surface mount assembly operation. If the solder paste does not do its job correctly then first pass yield will be severely reduced. ...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer of Assembly Material, Soldering

Speed Printing of SMT Adhesives

Apr 15, 1999 | Richard R. Lathrop Jr., Heraeus

High-speed printing techniques are revealed that break the speed barrier resulting from air entrapment in large apertures at fast squeegee speeds. Adhesive printability test results using conventional thickness stencils to achieve a significant range of d...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer of Assembly Material, Soldering

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