Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools

868 SMT / PCB Assembly Related Technical Articles

You, too, can do 0402!

May 16, 2005 | Bill Shaw, Articulation LLC

Low cost techniques for building prototype and low volume SMT printed circuit boards....

Publisher: Articulation LLC

Articulation LLC

Manufacturer and distributor of a low-cost prototype SMT reflow oven controller.

Westbrook, Connecticut, USA

No-Residue Technology Chemistry and Physics

Sep 02, 2004 | Patrick O. Bruneel Technical Advisor - Interflux USA, Inc.

The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering....

Publisher: Interflux USA, Inc.

Interflux USA, Inc.

Interflux USA, Inc. Mfg. and Distribution of high quality solders, fluxes and solder paste. Specialized in No-Residue soldering.

Dallas, Texas, USA

Manufacturer of Assembly Material, Cleaning, Repair/Rework, Soldering, Service Provider

Cost Analysis of Printed Circuit Boards

May 23, 2004 | By Gold Phoenix's North America Service and Tech Center

This is an article written by our company's experts to help our customers to make informed decision on PC boards purchasing. It introduces the materials that are used in the PCB manufacturing and the cost analysis of different materials....

Publisher: Gold Phoenix PCB Co, Ltd

Gold Phoenix PCB Co, Ltd

We are a PCB manufacturer located in China and right now we have set up our office in Ontario, Canada. We can produce high-quality PCBs up to 24 layers and we accept orders for prototypes as well as large volumes, both with very competitive prices.

Kingston, Ontario, Canada

Manufacturer of Assembly Equipment, Manufacturer of Components, Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Contract Manufacturer

0201 Placement - Only With The Right Team and Tools!

Sep 17, 2003 | P.Gerits / A.Mandos

It appears very logical that the successor of the 0402 size SMD would be the 0201. Curves showing the life-cycle of a body size, from introduction to most used to only for special cases, are very similar for the 1206, 0805, 0603 and 0402. So there is reason to expect that the same will happen with the 0201. Until now there is only little evidence for this, but most technologies come later than expected but faster than expected!...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing

May 05, 2003 | By Alden Johnson, Cookson Electronics Equipment, Franklin,Mass.

The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Equipment Impacts of Lead Free Wave Soldering

Apr 18, 2003 | Jim Morris, Advanced Development Manager, Cookson Electronics Equipment & Matthew J. O'Keefe, Ph.D., Associate Professor of Metallurgical Engineering, University of Missouri

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Wave & Reflow Soldering Troubleshooting Chart

Mar 07, 2002 | Speedline Technologies

Electrovert problems & solutions reflow & wave soldering....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

Line Balancing The Route To Profit in Electronics Manufacturing

Oct 25, 2001 | Paul Gerits, Anton Mandos

The electronics business has been a rather heated, if not over-heated, environment for many years. This has lead to a forgiving climate regarding inefficiencies, as resources have not been stretched and getting products out has been top priority. It might now be time to invest in some reflection on the strategies and tactics applied to the production environment in order to be prepared for the ‘heat’ of the future. Focusing investment in the right resources, and not sub-optimising, is the way to go....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Odd or SMD?

Aug 17, 2001 | Paul Gerits, Anton Mandos

Odd or SMD? At one time it was clear. An SMD component was placed on the surface of a PCB and all others were defined as 'odds' or 'specials'. This article discribes the changes and how equipment manufactorers react on it....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Effective Supply Chain Management

May 23, 2001 | R. Michael Donovan

The complexities of getting material ordered, manufactured and delivered overload most supply chain management (SCM) systems. The fact is, most systems are just not up to handling all the variables up and down the supply chain......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Successful ERP Implementation The First Time

May 23, 2001 | R. Michael Donovan

It’s not pretty out there. Companies have spent fortunes on ERP software and implementation only to find that business performance has not improved at all. These large investments and negative ROIs have created a whirlpool of controversy, rampant company politics and even a number of lawsuits. The trade press has reported many negative ERP stories, and even annual reports have pointed the finger at ERP for lower-than-expected earnings. For some, this has created a higher level of fear about making a big ERP mistake......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Demand-based Flow Manufacturing for High Velocity Order-to-Delivery Performance

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan writes that manufacturers need to become more nimble and much faster in their order-to-delivery process. Mike discusses the implications of push vs. pull, IT tools as enablers and potential benefits from Demand-based Flow Manufacturing. ...

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Customer Service Improvement: It's Mission Critical To Your Future

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Performance Measurement: Connecting Strategy, Operations and Actions

May 23, 2001 | R. Michael Donovan

Management consultant R. Michael Donovan outlines the problems and opportunities of performance measurement as an "enabling force" for improving overall business performance......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Inventory Efficiency In The Supply Chain

May 23, 2001 | R. Michael Donovan

Lowering inventories is one of the quickest ways to decrease working capital needs. Performance measurements, such as the old standby ROA (return on assets) and the newer EVA (economic value added), as well as other measures that gauge how efficiently capital is used, have become more common organizational drivers. In fact, many an executive’s bonus depends, at least in part, on how efficiently capital is used....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

e-Supply Chain Management: Prerequisites To Success.

May 23, 2001 | R. Michael Donovan

The supply chain is made up of all the activities that are required to deliver products to the customer - from designing product to receiving orders, procuring materials, marketing, manufacturing, logistics, customer service, receiving payment and so on. Anyone, anything, anywhere that influences a product’s time-to-market, price, quality, information exchange, delivery, among other activities is part of the supply chain....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits

May 03, 2001 | Michael E. Riddle, ASC International

In this age of global competition, world class electronics manufacturers understand that increasing profit margins is accomplished not by increasing price or lowering the quality of components and workmanship, but by increasing production yields. Post-solder inspection ensures that your customers receive good product, but by separating the good boards from the bad boards you only measure yield, not improve it. A yield (and profit) improvement strategy consists of making measurements at critical stages, as early as possible in the assembly process, and adjusting the process parameters to achieve optimal performance....

Publisher: ASC International

ASC International

Supplier of Optical Based Inspection and Measurement Equipment.

Medina, Minnesota, USA

Inspection

Tau White Paper

Apr 24, 2001 | Mentor Graphics

Board-level circuits today routinely run at speeds of 100 MHz or more and are composed of dozens of complex interacting VLSI components. To design such circuits in a timely and correct manner it is necessary to pay close attention to circuit timing early in the design cycle. At fast clock speeds, managing component and interconnect propagation delay becomes a key aspect of circuit design. It is imperative that the critical paths on a circuit and the slack available for interconnect delay consumption be identified early, and drive subsequent stages in the design flow....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Micro Vias in Board Station

Apr 24, 2001 | Mentor Graphics

This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

FSM Cookbook

Apr 24, 2001 | Mentor Graphics

Tau models describe the timing and functional information of component interfaces. Timing information specifies the delay in placing values on output signals and the timing constraints (set-up/hold, pulse-width) on input signals of a component. Functional information, through a finite state machine (FSM), specifies when output signal values change, when input signal values are latched, and how output values are determined as a function of input values....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Autorouting Techniques for Mulitchip Modules

Apr 24, 2001 | John Cofield, Advanced Packaging Product Manager, Mentor Graphics Corporation

Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the technology. While the design process is very much the same, MCM manufacturing processes vary dramatically. MCM routing requirements are dictated by the manufacturing process and types of components. Components mounted on MCM substrates are predominantly, if not exclusively, bare chips. As a result, the component body and I/O pins are no longer constrained to industry standard pin counts and form factors as are packaged components......

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Quick Study Guide to Dummy Components

Nov 13, 2000 | TopLine Dummy Components

Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Dummy Components Part Numbering System

Nov 13, 2000 | TopLine Dummy Components

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Quick Guide to Daisy Chain

Nov 13, 2000 | TopLine

Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

SMD Nomenclature - in Plain English

Nov 13, 2000 | TopLine Dummy Components

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Stencil Cleaner Meets Stringent EPA Rules

Jul 14, 2000 | Chuck Currie

The acronym "EPA" has cast almost as much fear in the hearts of industry as the letters "IRS." The Environmental Protection Agency has a plan to improve its image and actually help manufacturers attain their goals and ISO 14001 requirements....

Publisher: Smart Sonic Stencil Cleaning Systems

Smart Sonic Stencil Cleaning Systems

SMT Screen, Stencil & Pallet Cleaning Equipment and Chemistry. An EPA Verified safe and effective process.

Canoga Park, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection, Screen Printing

Reflow Profiling: The Benefits of Implementing a Ramp-to-Spike Profile

Jun 27, 2000 | David Suraski

This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Environmentally Certified Technologies: A Case Study

Jun 21, 2000 | William C. Schreiber

There was once a time when precision cleaning required minimal thought. Just about anything that was dirty could be placed inside a vapor degreaser and emerge clean and dry in a matter of minutes. Today, precision cleaning decisions are seemingly endless with ever-changing environmental regulations, user safety issues and product compatibility concerns. Technologies range from spray-in-atmosphere to ultrasonics to spray under immersion using aqueous, solvent or semiaqueous chemistries. Which method works and with what chemistry? Will the process be safe or even allowed by the regulating agencies?...

Publisher: Smart Sonic Stencil Cleaning Systems

Smart Sonic Stencil Cleaning Systems

SMT Screen, Stencil & Pallet Cleaning Equipment and Chemistry. An EPA Verified safe and effective process.

Canoga Park, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection, Screen Printing

Dam and Fill Encapsulation for Microelectronic Packages

Aug 27, 1999 | Steven J. Adamson and Christian Q. Ness

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

Considerations in Dispensing Conformal Coatings

Aug 27, 1999 | John P. Byers and Christopher E. Havlik

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

Conductive Adhesive Dispensing, Process Considerations

Aug 27, 1999 | Alan Lewis and Alec Babiarz.

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

An Air-Assisted "Airless" Conformal Coating Process

Aug 27, 1999 | Steven Felstein, Joan Lum

A need to move beyond aerosol sprays and dipping leads to a development that answers tough requirements for controlled coverage, low waste, and environmental restrictions....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

Parasitic Extraction for Deep Submicron and Ultra-deep Submicron Designs

Aug 09, 1999 | Cadence Design Systems, Inc.

Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs....

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Design

Alternatives to HASL: Users Guide for Surface Finishes

Aug 09, 1999 | Dan T. Parquet and David W. Boggs, Merix

A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate....

Publisher: Viasystems Group, Inc.

Viasystems Group, Inc.

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Contract Manufacturer

Introducing the OSP Process as an Alternative to HASL

Aug 09, 1999 | David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem

Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements....

Publisher: Viasystems Group, Inc.

Viasystems Group, Inc.

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Contract Manufacturer

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Aug 05, 1999 | Dwight Miller (Sandia National Laboratories)

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Facility Fluids Metrics and Test Methods

Aug 05, 1999 | Deborah Franke

This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Silicon Test Wafer Specification for 180 nm Technology

Aug 05, 1999 | Goodall, Randy

In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Test Structures for Benchmarking the Electrostatic Discharge (ESD) Robustness of CMOS Technologies

Aug 05, 1999 | Alexander, Robert

This document defines a set of standard test structures with which to benchmark the electrostatic discharge (ESD) robustness of CMOS technologies. The test structures are intended to be used to evaluate the elements of an integrated circuit in the high current and voltage ranges characteristic of ESD events. Test structures are given for resistors, diodes, MOS devices, interconnects, silicon control rectifiers, and parasitic devices. The document explains the implementation strategy and the method of tabulating ESD robustness for various technologies....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Overview of Quality and Reliability Issues in the National Technology Roadmap for Semiconductors

Aug 05, 1999 | Barpoulis, Dino

This document is an update to the 1994 Quality and Reliability Roadmap issued in support of the 1994 National Technology Roadmap for Semiconductors. This report revisits the challenges, constraints, priorities, and research needs pertaining to quality and reliability issues. It also provides key project proposals that must be implemented to address concerns about reliability attainment and defect learning. An expanded section on test-to-test, diagnostics, and failure analysis; an edited version of the Product Analysis Forum Roadmap; and an appendix containing a draft report highlighting reliability issues is included....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Guide for the Design of Semiconductor Equipment to Meet Voltage Sag Immunity Standards

Aug 05, 1999 | Mark Stephens, Dennis Johnson, John Soward, Jim Ammenheuser

This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment......

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Evaluating Automated Wafer Measurement Instruments

Aug 05, 1999 | Steven A. Eastman

This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Guidelines for Manufacturing Equipment Reference Manuals

Aug 05, 1999 | Victoria J. Pruett, SEMI/SEMATECH; Julian Serda, Advanced Micro Devices; Darin Shifley, Applied Materials, Inc.

This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on installing, operating, controlling, and integrating process equipment....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Properties and Performance Of Hybrid Aluminium Electrolytic / Electrochemical Capacitors

Aug 05, 1999 | John R. Miller, JME, Inc. & David A. Evans, Evans Company

Test data was recently presented for a hybrid electrolytic/ electrochemical capacitor having sintered tantalum anodes and RuO2 cathodes. A 50-V, 18-mF capacitor of this design had electrical performance that was comparable to an advanced aluminum electrolytic capacitor but with only one-tenth the volume and just one-half the mass...

Publisher: Evans Findings

Evans Findings

Evans is the world's largest producer of deep drawn tantalum parts. Evans produces precision high volume drawn shells, metal stampings, eyelets and ferrules. Capabilities include In-House Engineering, Tool Design and Construction.

East Providence, Rhode Island, USA

Component Preparation

Thermal Management of Hybrid Electronic Devices

Jul 21, 1999 | Barry Ritchie, Jamie Serensen

Thermal management is a growing challenge in the electronics industry. As the overall size of electronic devices grows smaller, the enclosed electronic assemblies operate at higher frequencies and generate more heat....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

The Effect of Solder Mask And Surface Mount Adhesive Types on a PCB Manufacturing Process.

Jul 21, 1999 | James A. Serenson Jr., Steven Marongelli

A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion......

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

Reliability Considerations of Electrically Conductive Adhesives.

Jul 21, 1999 | Darryl J. Small

Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. The goal is a conductive polymer that exhibits similar reliability and performance to traditional solder while offering the benefits of a polymer structure such as low temperature processing and good thermal stability as well as the ability to bond a variety of substrates....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

Effects of Tg and CTE on Semiconductor Encapsulants

Jul 21, 1999 | Dr. Mark M. Konarski

As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

Pre-Compliance Testing the Conducted Line Emissions of DC Supplied Circuits

Jul 20, 1999 | Paul Lee, Director of Engineering, Murata Power Solutions

It's quite common for a power supply (PSU) designer to work with a circuit designer to realize a system design compliant with international EMC regulations. PSU designers will be well aware of the requirement of the power supply to provide clean DC voltage and not disturb the AC mains voltage. However, they may not have any idea of the noise that can potentially be introduced to the mains through the PSU by the target circuit. Likewise, the circuit designers (digital or analogue) may not know what attenuation the PSU will provide....

Publisher: Murata Manufacturing Co., Ltd.

Murata Manufacturing Co., Ltd.

Murata is a leading company involved in the manufacturing of ceramic electronic components with an overwhelming share worldwide in ceramic filters, high frequency parts, and sensors.

Kyoto, Japan

Manufacturer of Components, Components/Substrates

Parallel SmartSpice: Fast and Accurate Circuit Simulation Finally Available

Jul 20, 1999 | Dr. Mounir Hahad

Circuit simulation is a necessary everyday tool to circuit designers who need to constantly verify and debug their circuits during the design process. As engineers face larger, more complex designs and tighter project schedules, fast SPICE simulation with no loss in accuracy has become a necessity. Simulation indeed accounts for a large portion of the time spent in the design and optimization of a new circuit......

Publisher: Silvaco

Silvaco

Silvaco is a supplier of TCAD software and a major supplier of EDA software for circuit simulation and design of analog, mixed-signal and RF integrated circuits.

Santa Clara, California, USA

Software Manufacturer

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