Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools
841 SMT / PCB Technical Articles

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Mar 08, 2007 | Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Feb 01, 2007 | Ronald D. Schaeffer, Chief Executive Officer, Photomachining.

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Feb 01, 2007 | Ray Cirimele, Best, Inc

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

Surface Insulation Resistance (SIR) Testing

Feb 01, 2007 | Roy Johnson, Senior Staff Engineer AG Communication Systems.

Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

BGA Thermal Shock Testing

Feb 01, 2007 | Roy Johnson Senior Staff Engineer AG Communication Systems.

The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

StencilQuick™ Lead-Free Solder Paste Rework Study

Jan 31, 2007 | Ray Cirimele, BEST Inc

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber. ...

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

Reflow Profiling Guide

Jan 31, 2007 | John Viviari, EFD, Inc.

This paper explains the solder paste reflow process and the best practices to follow when developing your profile....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

Auger Valve Dispensing

Jan 31, 2007 | John Viviari, EFD, Inc.

This white paper is suitable for both new and experienced users. It is a practical education in the use and misuse of auger valves for solder paste dispensing....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

Air Powered Dispensing

Jan 31, 2007 | John Viviari, EFD, Inc.

Air-powered dispensing systems use controlled pulses of air pressure to dispense solder paste from syringe reservoirs in uniform amounts. In this paper, EFD explains the most critical variables affecting air-powered dispensing of solder pastes and shows how to manage those variables to your advantage....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

HASL - What a Hassle, or Hasl'd Again

Jan 24, 2007 | Earl Moon

This article updates one I wrote for Printed Circuit Fabrication Magazine in December 1991. Actually, this article trashes that - and about time. I was much too kind then talking about how to control the HASL process....

Breakthrough in Molecular Design Could Unleash the Full Speed of the Internet

Jan 17, 2007 | Cherie Winner, WSU News Service

Researchers at Washington State University have created design guidelines for new molecules that could enhance the speed of internet communications and other optical technologies....

Publisher: Washington State Magazine

Washington State Magazine

WSM is published by the Board of Regents of Washington State University.

Pullman, Washington, USA

School

Printed Circuit Board Failure Analysis

Jan 10, 2007 | Earl Moon

As with all other F/A processes, PCB's occasionally need a little help from them. The following, just as the component process in Section previous, has been condensed from so many involvements over the past 35 years, I cannot remember - nor should I because they all could have been prevented with DFM/CE. However, the information presented, coupled with good DFM/CE and PCB process management provides an insight to the beast....

Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution

Jan 03, 2007 | John Vivari / EFD Inc.

Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

First Principles of Solder Reflow

Dec 18, 2006 | John Vivari / EFD Inc.

Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and should be sought after. They feel if the solder supplier gives them a tidy drawing on a piece of paper with times and temperatures that it will magically solve all their reflow problems. This is, unfortunately, an often incorrect assumption....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

"High Reliability Products" What does it really take - A Test Perspective

Dec 04, 2006 | Subahu D. Desai

This paper will explore how test can be an integral part of manufacturing to assure High Reliability Products. We will discuss how test parameters and test techniques are effective in finding time zero vs. time dependent defects. Understanding of manufacturing processes in terms defect levels as well as defect types is very critical in defining test parameters, new test techniques and test alternatives. This ultimately can improve the yield, quality, and reliability. We will discuss the types of defects, time zero vs. time dependent defects, test parameters and effectiveness and new test techniques to find time dependent defects....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Nov 14, 2006 | David Alcoe, Kim Blackwell and Irving Memis, Endicott NY

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ...

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Nov 01, 2006 | Glenn O. Dearing, Paul J. Hart

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation....

Publisher: IBM Corporation

IBM Corporation

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Other, Software Manufacturer

Tombstone Troubleshooting

Oct 26, 2006 | Michael Forti, Applications/Process Engineer, EFD

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Those that claim otherwise are either uninformed or trying to sell you something. Rather than limiting your view to a single solution, EFD recommends you heed all of the studies. Like pieces of a puzzle, each study does not reveal the whole picture, but looked at all together, the picture is clear....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

Oct 02, 2006 | Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs....

Publisher: Universal Instruments Corporation

Universal Instruments Corporation

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

Conklin, New York, USA

Manufacturer of Assembly Equipment, Pick and Place

Evaluating Soldering Irons for Lead Free Assembly -A Quantitative Approach

Sep 06, 2006 | Purnanand G. Samant, Srikanth Poranki, & Daryl Santos, Ph.D,

Transition to lead free solder stations in electronics packaging has raised issues regarding process, metallurgy and reliability m assemblies. In regards to soldering, lead has been used for thousands of years in a wide range of applications. Conventional eutectic or near eutectic tin-lead solder compositions have been used for virtually all soldering applications in electronics assembly for the last 50 years, In the electronics assembly process, a majority of commercial rework applications and some low density board assembly processes require hand soldering stations (...) This paper describes an attempt to quantify both qualitative and quantitative data that can aid in the evaluation of lead free soldering irons....

Publisher: T.J. Watson School of Engineering and Applied Science

T.J. Watson School of Engineering and Applied Science

A world-class institution, Binghamton University offers students a broad, interdisciplinary education with an international perspective and one of the most vibrant research programs in the nation.

Binghamton, New York, USA

School

Design For Test Considerations For PCB Design

Jul 14, 2006 | Zulki Khan, president and founder, Nexlogic, Inc.

The perennial question in electronics design and manufacture is: "How do I design a printed circuit board (PCB) so that it can be properly tested?" To achieve this objective, there are a number of design-for-test (DFT) considerations and techniques. Some are major, others, minor. However, the total contributes to a highly effective PCB design so that testing procedures applied to a given design result in high 90 percent plus test coverage....

Publisher: NexLogic Tech, Inc.

NexLogic Tech, Inc.

Nexlogic is a premier provider for all PCB Design, PCB Layout, PCB Fabrication, PCB Assembly, Contract Manufacturing and RoHS and Lead Free (Pb- Free) compliant services.

San Jose, California, USA

Manufacturer of Assembled PCBs, Assembly, Design, Repair/Rework, Contract Manufacturer

Testing To Eliminate Reliability Defects From Electronic Packages

Jun 29, 2006 | Irving Memis, Consultant, Endicott Interconnect Technologies

Electronic Packaging is a critical part of all electronic devices and can be a source of the reliability problems experienced by systems using those devices. In many cases, the packaging defects are intermittent in nature and difficult to detect. This paper describes a tester that has been used for 20 years on commercial products and has proven to be extremely effective in detecting these defects prior to component assembly....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Wave Solder Parameter Chart

May 13, 2006 | Kantesh Doss

This Excel Spreadsheet calculates the Wave Solder Contact Time automatically with given main Solder Wave width and Conveyor Speed. There is one chart where conveyor speed is expressed in meters/min and in another where it is expressed in feet/minute....

Publisher: Jabil Circuit, Inc.

Jabil Circuit, Inc.

An electronic product solutions company providing comprehensive electronics design, manufacturing and product management services.

St. Petersburg, Florida, USA

Design, Service Provider

You, too, can do 0402!

May 16, 2005 | Bill Shaw, Articulation LLC

Low cost techniques for building prototype and low volume SMT printed circuit boards....

Publisher: Articulation LLC

Articulation LLC

Manufacturer and distributor of a low-cost prototype SMT reflow oven controller.

Westbrook, Connecticut, USA

No-Residue Technology Chemistry and Physics

Sep 02, 2004 | Patrick O. Bruneel Technical Advisor - Interflux USA, Inc.

The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering....

Publisher: Interflux USA, Inc.

Interflux USA, Inc.

Interflux USA, Inc. Mfg. and Distribution of high quality solders, fluxes and solder paste. Specialized in No-Residue soldering.

Dallas, Texas, USA

Manufacturer of Assembly Material, Cleaning, Repair/Rework, Soldering, Service Provider

Cost Analysis of Printed Circuit Boards

May 23, 2004 | By Gold Phoenix's North America Service and Tech Center

This is an article written by our company's experts to help our customers to make informed decision on PC boards purchasing. It introduces the materials that are used in the PCB manufacturing and the cost analysis of different materials....

Publisher: Gold Phoenix PCB Co, Ltd

Gold Phoenix PCB Co, Ltd

We are a PCB manufacturer located in China and right now we have set up our office in Ontario, Canada. We can produce high-quality PCBs up to 24 layers and we accept orders for prototypes as well as large volumes, both with very competitive prices.

Kingston, Ontario, Canada

Manufacturer of Assembly Equipment, Manufacturer of Components, Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Contract Manufacturer

0201 Placement - Only With The Right Team and Tools!

Sep 17, 2003 | P.Gerits / A.Mandos

It appears very logical that the successor of the 0402 size SMD would be the 0201. Curves showing the life-cycle of a body size, from introduction to most used to only for special cases, are very similar for the 1206, 0805, 0603 and 0402. So there is reason to expect that the same will happen with the 0201. Until now there is only little evidence for this, but most technologies come later than expected but faster than expected!...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing

May 05, 2003 | By Alden Johnson, Cookson Electronics Equipment, Franklin,Mass.

The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Equipment Impacts of Lead Free Wave Soldering

Apr 18, 2003 | Jim Morris, Advanced Development Manager, Cookson Electronics Equipment & Matthew J. O'Keefe, Ph.D., Associate Professor of Metallurgical Engineering, University of Missouri

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Wave & Reflow Soldering Troubleshooting Chart

Mar 07, 2002 | Speedline Technologies

Electrovert problems & solutions reflow & wave soldering....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

Line Balancing The Route To Profit in Electronics Manufacturing

Oct 25, 2001 | Paul Gerits, Anton Mandos

The electronics business has been a rather heated, if not over-heated, environment for many years. This has lead to a forgiving climate regarding inefficiencies, as resources have not been stretched and getting products out has been top priority. It might now be time to invest in some reflection on the strategies and tactics applied to the production environment in order to be prepared for the ‘heat’ of the future. Focusing investment in the right resources, and not sub-optimising, is the way to go....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Odd or SMD?

Aug 17, 2001 | Paul Gerits, Anton Mandos

Odd or SMD? At one time it was clear. An SMD component was placed on the surface of a PCB and all others were defined as 'odds' or 'specials'. This article discribes the changes and how equipment manufactorers react on it....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Effective Supply Chain Management

May 23, 2001 | R. Michael Donovan

The complexities of getting material ordered, manufactured and delivered overload most supply chain management (SCM) systems. The fact is, most systems are just not up to handling all the variables up and down the supply chain......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Successful ERP Implementation The First Time

May 23, 2001 | R. Michael Donovan

It’s not pretty out there. Companies have spent fortunes on ERP software and implementation only to find that business performance has not improved at all. These large investments and negative ROIs have created a whirlpool of controversy, rampant company politics and even a number of lawsuits. The trade press has reported many negative ERP stories, and even annual reports have pointed the finger at ERP for lower-than-expected earnings. For some, this has created a higher level of fear about making a big ERP mistake......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Demand-based Flow Manufacturing for High Velocity Order-to-Delivery Performance

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan writes that manufacturers need to become more nimble and much faster in their order-to-delivery process. Mike discusses the implications of push vs. pull, IT tools as enablers and potential benefits from Demand-based Flow Manufacturing. ...

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Customer Service Improvement: It's Mission Critical To Your Future

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Performance Measurement: Connecting Strategy, Operations and Actions

May 23, 2001 | R. Michael Donovan

Management consultant R. Michael Donovan outlines the problems and opportunities of performance measurement as an "enabling force" for improving overall business performance......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Inventory Efficiency In The Supply Chain

May 23, 2001 | R. Michael Donovan

Lowering inventories is one of the quickest ways to decrease working capital needs. Performance measurements, such as the old standby ROA (return on assets) and the newer EVA (economic value added), as well as other measures that gauge how efficiently capital is used, have become more common organizational drivers. In fact, many an executive’s bonus depends, at least in part, on how efficiently capital is used....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

e-Supply Chain Management: Prerequisites To Success.

May 23, 2001 | R. Michael Donovan

The supply chain is made up of all the activities that are required to deliver products to the customer - from designing product to receiving orders, procuring materials, marketing, manufacturing, logistics, customer service, receiving payment and so on. Anyone, anything, anywhere that influences a product’s time-to-market, price, quality, information exchange, delivery, among other activities is part of the supply chain....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits

May 03, 2001 | Michael E. Riddle, ASC International

In this age of global competition, world class electronics manufacturers understand that increasing profit margins is accomplished not by increasing price or lowering the quality of components and workmanship, but by increasing production yields. Post-solder inspection ensures that your customers receive good product, but by separating the good boards from the bad boards you only measure yield, not improve it. A yield (and profit) improvement strategy consists of making measurements at critical stages, as early as possible in the assembly process, and adjusting the process parameters to achieve optimal performance....

Publisher: ASC International

ASC International

Supplier of Optical Based Inspection and Measurement Equipment.

Medina, Minnesota, USA

Inspection

Tau White Paper

Apr 24, 2001 | Mentor Graphics

Board-level circuits today routinely run at speeds of 100 MHz or more and are composed of dozens of complex interacting VLSI components. To design such circuits in a timely and correct manner it is necessary to pay close attention to circuit timing early in the design cycle. At fast clock speeds, managing component and interconnect propagation delay becomes a key aspect of circuit design. It is imperative that the critical paths on a circuit and the slack available for interconnect delay consumption be identified early, and drive subsequent stages in the design flow....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Micro Vias in Board Station

Apr 24, 2001 | Mentor Graphics

This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

FSM Cookbook

Apr 24, 2001 | Mentor Graphics

Tau models describe the timing and functional information of component interfaces. Timing information specifies the delay in placing values on output signals and the timing constraints (set-up/hold, pulse-width) on input signals of a component. Functional information, through a finite state machine (FSM), specifies when output signal values change, when input signal values are latched, and how output values are determined as a function of input values....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Autorouting Techniques for Mulitchip Modules

Apr 24, 2001 | John Cofield, Advanced Packaging Product Manager, Mentor Graphics Corporation

Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the technology. While the design process is very much the same, MCM manufacturing processes vary dramatically. MCM routing requirements are dictated by the manufacturing process and types of components. Components mounted on MCM substrates are predominantly, if not exclusively, bare chips. As a result, the component body and I/O pins are no longer constrained to industry standard pin counts and form factors as are packaged components......

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Quick Study Guide to Dummy Components

Nov 13, 2000 | TopLine Dummy Components

Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Dummy Components Part Numbering System

Nov 13, 2000 | TopLine Dummy Components

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Quick Guide to Daisy Chain

Nov 13, 2000 | TopLine

Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

SMD Nomenclature - in Plain English

Nov 13, 2000 | TopLine Dummy Components

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Stencil Cleaner Meets Stringent EPA Rules

Jul 14, 2000 | Chuck Currie

The acronym "EPA" has cast almost as much fear in the hearts of industry as the letters "IRS." The Environmental Protection Agency has a plan to improve its image and actually help manufacturers attain their goals and ISO 14001 requirements....

Publisher: Smart Sonic Stencil Cleaning Systems

Smart Sonic Stencil Cleaning Systems

SMT Screen, Stencil & Pallet Cleaning Equipment and Chemistry. An EPA Verified safe and effective process.

Canoga Park, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection, Screen Printing

Reflow Profiling: The Benefits of Implementing a Ramp-to-Spike Profile

Jun 27, 2000 | David Suraski

This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

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