Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools
825 SMT / PCB Technical Articles

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Nov 01, 2006 | Glenn O. Dearing, Paul J. Hart

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation....

Publisher: IBM Corporation

IBM Corporation

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Other, Software Manufacturer

Tombstone Troubleshooting

Oct 26, 2006 | Michael Forti, Applications/Process Engineer, EFD

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Those that claim otherwise are either uninformed or trying to sell you something. Rather than limiting your view to a single solution, EFD recommends you heed all of the studies. Like pieces of a puzzle, each study does not reveal the whole picture, but looked at all together, the picture is clear....

Publisher: Nordson EFD

Nordson EFD

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

East Providence, Rhode Island, USA

Adhesives/Dispensing

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

Oct 02, 2006 | Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs....

Publisher: Universal Instruments Corporation

Universal Instruments Corporation

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

Conklin, New York, USA

Manufacturer of Assembly Equipment, Pick and Place

Evaluating Soldering Irons for Lead Free Assembly -A Quantitative Approach

Sep 06, 2006 | Purnanand G. Samant, Srikanth Poranki, & Daryl Santos, Ph.D,

Transition to lead free solder stations in electronics packaging has raised issues regarding process, metallurgy and reliability m assemblies. In regards to soldering, lead has been used for thousands of years in a wide range of applications. Conventional eutectic or near eutectic tin-lead solder compositions have been used for virtually all soldering applications in electronics assembly for the last 50 years, In the electronics assembly process, a majority of commercial rework applications and some low density board assembly processes require hand soldering stations (...) This paper describes an attempt to quantify both qualitative and quantitative data that can aid in the evaluation of lead free soldering irons....

Publisher: T.J. Watson School of Engineering and Applied Science

T.J. Watson School of Engineering and Applied Science

A world-class institution, Binghamton University offers students a broad, interdisciplinary education with an international perspective and one of the most vibrant research programs in the nation.

Binghamton, New York, USA

School

Design For Test Considerations For PCB Design

Jul 14, 2006 | Zulki Khan, president and founder, Nexlogic, Inc.

The perennial question in electronics design and manufacture is: "How do I design a printed circuit board (PCB) so that it can be properly tested?" To achieve this objective, there are a number of design-for-test (DFT) considerations and techniques. Some are major, others, minor. However, the total contributes to a highly effective PCB design so that testing procedures applied to a given design result in high 90 percent plus test coverage....

Publisher: NexLogic Tech, Inc.

NexLogic Tech, Inc.

Nexlogic is a premier provider for all PCB Design, PCB Layout, PCB Fabrication, PCB Assembly, Contract Manufacturing and RoHS and Lead Free (Pb- Free) compliant services.

San Jose, California, USA

Manufacturer of Assembled PCBs, Assembly, Design, Repair/Rework, Contract Manufacturer

Testing To Eliminate Reliability Defects From Electronic Packages

Jun 29, 2006 | Irving Memis, Consultant, Endicott Interconnect Technologies

Electronic Packaging is a critical part of all electronic devices and can be a source of the reliability problems experienced by systems using those devices. In many cases, the packaging defects are intermittent in nature and difficult to detect. This paper describes a tester that has been used for 20 years on commercial products and has proven to be extremely effective in detecting these defects prior to component assembly....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Wave Solder Parameter Chart

May 13, 2006 | Kantesh Doss

This Excel Spreadsheet calculates the Wave Solder Contact Time automatically with given main Solder Wave width and Conveyor Speed. There is one chart where conveyor speed is expressed in meters/min and in another where it is expressed in feet/minute....

Publisher: Jabil Circuit, Inc.

Jabil Circuit, Inc.

An electronic product solutions company providing comprehensive electronics design, manufacturing and product management services.

St. Petersburg, Florida, USA

Design, Service Provider

You, too, can do 0402!

May 16, 2005 | Bill Shaw, Articulation LLC

Low cost techniques for building prototype and low volume SMT printed circuit boards....

Publisher: Articulation LLC

Articulation LLC

Manufacturer and distributor of a low-cost prototype SMT reflow oven controller.

Westbrook, Connecticut, USA

No-Residue Technology Chemistry and Physics

Sep 02, 2004 | Patrick O. Bruneel Technical Advisor - Interflux USA, Inc.

The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering....

Publisher: Interflux USA, Inc.

Interflux USA, Inc.

Interflux USA, Inc. Mfg. and Distribution of high quality solders, fluxes and solder paste. Specialized in No-Residue soldering.

Dallas, Texas, USA

Manufacturer of Assembly Material, Cleaning, Repair/Rework, Soldering, Service Provider

Cost Analysis of Printed Circuit Boards

May 23, 2004 | By Gold Phoenix's North America Service and Tech Center

This is an article written by our company's experts to help our customers to make informed decision on PC boards purchasing. It introduces the materials that are used in the PCB manufacturing and the cost analysis of different materials....

Publisher: Gold Phoenix PCB Co, Ltd

Gold Phoenix PCB Co, Ltd

We are a PCB manufacturer located in China and right now we have set up our office in Ontario, Canada. We can produce high-quality PCBs up to 24 layers and we accept orders for prototypes as well as large volumes, both with very competitive prices.

Kingston, Ontario, Canada

Manufacturer of Assembly Equipment, Manufacturer of Components, Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Contract Manufacturer

0201 Placement - Only With The Right Team and Tools!

Sep 17, 2003 | P.Gerits / A.Mandos

It appears very logical that the successor of the 0402 size SMD would be the 0201. Curves showing the life-cycle of a body size, from introduction to most used to only for special cases, are very similar for the 1206, 0805, 0603 and 0402. So there is reason to expect that the same will happen with the 0201. Until now there is only little evidence for this, but most technologies come later than expected but faster than expected!...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing

May 05, 2003 | By Alden Johnson, Cookson Electronics Equipment, Franklin,Mass.

The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Equipment Impacts of Lead Free Wave Soldering

Apr 18, 2003 | Jim Morris, Advanced Development Manager, Cookson Electronics Equipment & Matthew J. O'Keefe, Ph.D., Associate Professor of Metallurgical Engineering, University of Missouri

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Wave & Reflow Soldering Troubleshooting Chart

Mar 07, 2002 | Speedline Technologies

Electrovert problems & solutions reflow & wave soldering....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

Line Balancing The Route To Profit in Electronics Manufacturing

Oct 25, 2001 | Paul Gerits, Anton Mandos

The electronics business has been a rather heated, if not over-heated, environment for many years. This has lead to a forgiving climate regarding inefficiencies, as resources have not been stretched and getting products out has been top priority. It might now be time to invest in some reflection on the strategies and tactics applied to the production environment in order to be prepared for the ‘heat’ of the future. Focusing investment in the right resources, and not sub-optimising, is the way to go....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Odd or SMD?

Aug 17, 2001 | Paul Gerits, Anton Mandos

Odd or SMD? At one time it was clear. An SMD component was placed on the surface of a PCB and all others were defined as 'odds' or 'specials'. This article discribes the changes and how equipment manufactorers react on it....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Effective Supply Chain Management

May 23, 2001 | R. Michael Donovan

The complexities of getting material ordered, manufactured and delivered overload most supply chain management (SCM) systems. The fact is, most systems are just not up to handling all the variables up and down the supply chain......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Successful ERP Implementation The First Time

May 23, 2001 | R. Michael Donovan

It’s not pretty out there. Companies have spent fortunes on ERP software and implementation only to find that business performance has not improved at all. These large investments and negative ROIs have created a whirlpool of controversy, rampant company politics and even a number of lawsuits. The trade press has reported many negative ERP stories, and even annual reports have pointed the finger at ERP for lower-than-expected earnings. For some, this has created a higher level of fear about making a big ERP mistake......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Demand-based Flow Manufacturing for High Velocity Order-to-Delivery Performance

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan writes that manufacturers need to become more nimble and much faster in their order-to-delivery process. Mike discusses the implications of push vs. pull, IT tools as enablers and potential benefits from Demand-based Flow Manufacturing. ...

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Customer Service Improvement: It's Mission Critical To Your Future

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Performance Measurement: Connecting Strategy, Operations and Actions

May 23, 2001 | R. Michael Donovan

Management consultant R. Michael Donovan outlines the problems and opportunities of performance measurement as an "enabling force" for improving overall business performance......

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Inventory Efficiency In The Supply Chain

May 23, 2001 | R. Michael Donovan

Lowering inventories is one of the quickest ways to decrease working capital needs. Performance measurements, such as the old standby ROA (return on assets) and the newer EVA (economic value added), as well as other measures that gauge how efficiently capital is used, have become more common organizational drivers. In fact, many an executive’s bonus depends, at least in part, on how efficiently capital is used....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

e-Supply Chain Management: Prerequisites To Success.

May 23, 2001 | R. Michael Donovan

The supply chain is made up of all the activities that are required to deliver products to the customer - from designing product to receiving orders, procuring materials, marketing, manufacturing, logistics, customer service, receiving payment and so on. Anyone, anything, anywhere that influences a product’s time-to-market, price, quality, information exchange, delivery, among other activities is part of the supply chain....

Publisher: R. Michael Donovan & Co., Inc.

R. Michael Donovan & Co., Inc.

An international management consulting and education firm that provides manufacturers with business performance improvement services on a focused, enterprise-wide, or entire supply chain basis.

Framingham, Massachusetts, USA

Other, Consultant

Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits

May 03, 2001 | Michael E. Riddle, ASC International

In this age of global competition, world class electronics manufacturers understand that increasing profit margins is accomplished not by increasing price or lowering the quality of components and workmanship, but by increasing production yields. Post-solder inspection ensures that your customers receive good product, but by separating the good boards from the bad boards you only measure yield, not improve it. A yield (and profit) improvement strategy consists of making measurements at critical stages, as early as possible in the assembly process, and adjusting the process parameters to achieve optimal performance....

Publisher: ASC International

ASC International

Supplier of Optical Based Inspection and Measurement Equipment.

Medina, Minnesota, USA

Inspection

Tau White Paper

Apr 24, 2001 | Mentor Graphics

Board-level circuits today routinely run at speeds of 100 MHz or more and are composed of dozens of complex interacting VLSI components. To design such circuits in a timely and correct manner it is necessary to pay close attention to circuit timing early in the design cycle. At fast clock speeds, managing component and interconnect propagation delay becomes a key aspect of circuit design. It is imperative that the critical paths on a circuit and the slack available for interconnect delay consumption be identified early, and drive subsequent stages in the design flow....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Micro Vias in Board Station

Apr 24, 2001 | Mentor Graphics

This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

FSM Cookbook

Apr 24, 2001 | Mentor Graphics

Tau models describe the timing and functional information of component interfaces. Timing information specifies the delay in placing values on output signals and the timing constraints (set-up/hold, pulse-width) on input signals of a component. Functional information, through a finite state machine (FSM), specifies when output signal values change, when input signal values are latched, and how output values are determined as a function of input values....

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Autorouting Techniques for Mulitchip Modules

Apr 24, 2001 | John Cofield, Advanced Packaging Product Manager, Mentor Graphics Corporation

Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the technology. While the design process is very much the same, MCM manufacturing processes vary dramatically. MCM routing requirements are dictated by the manufacturing process and types of components. Components mounted on MCM substrates are predominantly, if not exclusively, bare chips. As a result, the component body and I/O pins are no longer constrained to industry standard pin counts and form factors as are packaged components......

Publisher: Mentor Graphics

Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Design, Software Manufacturer

Quick Study Guide to Dummy Components

Nov 13, 2000 | TopLine Dummy Components

Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Dummy Components Part Numbering System

Nov 13, 2000 | TopLine Dummy Components

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Quick Guide to Daisy Chain

Nov 13, 2000 | TopLine

Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

SMD Nomenclature - in Plain English

Nov 13, 2000 | TopLine Dummy Components

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included....

Publisher: TopLine Dummy Components

TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Garden Grove, California, USA

Manufacturer of Components

Stencil Cleaner Meets Stringent EPA Rules

Jul 14, 2000 | Chuck Currie

The acronym "EPA" has cast almost as much fear in the hearts of industry as the letters "IRS." The Environmental Protection Agency has a plan to improve its image and actually help manufacturers attain their goals and ISO 14001 requirements....

Publisher: Smart Sonic Stencil Cleaning Systems

Smart Sonic Stencil Cleaning Systems

SMT Screen, Stencil & Pallet Cleaning Equipment and Chemistry. An EPA Verified safe and effective process.

Canoga Park, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection, Screen Printing

Reflow Profiling: The Benefits of Implementing a Ramp-to-Spike Profile

Jun 27, 2000 | David Suraski

This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Environmentally Certified Technologies: A Case Study

Jun 21, 2000 | William C. Schreiber

There was once a time when precision cleaning required minimal thought. Just about anything that was dirty could be placed inside a vapor degreaser and emerge clean and dry in a matter of minutes. Today, precision cleaning decisions are seemingly endless with ever-changing environmental regulations, user safety issues and product compatibility concerns. Technologies range from spray-in-atmosphere to ultrasonics to spray under immersion using aqueous, solvent or semiaqueous chemistries. Which method works and with what chemistry? Will the process be safe or even allowed by the regulating agencies?...

Publisher: Smart Sonic Stencil Cleaning Systems

Smart Sonic Stencil Cleaning Systems

SMT Screen, Stencil & Pallet Cleaning Equipment and Chemistry. An EPA Verified safe and effective process.

Canoga Park, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection, Screen Printing

Dam and Fill Encapsulation for Microelectronic Packages

Aug 27, 1999 | Steven J. Adamson and Christian Q. Ness

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

Considerations in Dispensing Conformal Coatings

Aug 27, 1999 | John P. Byers and Christopher E. Havlik

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

Conductive Adhesive Dispensing, Process Considerations

Aug 27, 1999 | Alan Lewis and Alec Babiarz.

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

An Air-Assisted "Airless" Conformal Coating Process

Aug 27, 1999 | Steven Felstein, Joan Lum

A need to move beyond aerosol sprays and dipping leads to a development that answers tough requirements for controlled coverage, low waste, and environmental restrictions....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

Parasitic Extraction for Deep Submicron and Ultra-deep Submicron Designs

Aug 09, 1999 | Cadence Design Systems, Inc.

Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs....

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Design

Alternatives to HASL: Users Guide for Surface Finishes

Aug 09, 1999 | Dan T. Parquet and David W. Boggs, Merix

A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate....

Publisher: Viasystems Group, Inc.

Viasystems Group, Inc.

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Contract Manufacturer

Introducing the OSP Process as an Alternative to HASL

Aug 09, 1999 | David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem

Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements....

Publisher: Viasystems Group, Inc.

Viasystems Group, Inc.

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Contract Manufacturer

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Aug 05, 1999 | Dwight Miller (Sandia National Laboratories)

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Facility Fluids Metrics and Test Methods

Aug 05, 1999 | Deborah Franke

This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Silicon Test Wafer Specification for 180 nm Technology

Aug 05, 1999 | Goodall, Randy

In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Test Structures for Benchmarking the Electrostatic Discharge (ESD) Robustness of CMOS Technologies

Aug 05, 1999 | Alexander, Robert

This document defines a set of standard test structures with which to benchmark the electrostatic discharge (ESD) robustness of CMOS technologies. The test structures are intended to be used to evaluate the elements of an integrated circuit in the high current and voltage ranges characteristic of ESD events. Test structures are given for resistors, diodes, MOS devices, interconnects, silicon control rectifiers, and parasitic devices. The document explains the implementation strategy and the method of tabulating ESD robustness for various technologies....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Overview of Quality and Reliability Issues in the National Technology Roadmap for Semiconductors

Aug 05, 1999 | Barpoulis, Dino

This document is an update to the 1994 Quality and Reliability Roadmap issued in support of the 1994 National Technology Roadmap for Semiconductors. This report revisits the challenges, constraints, priorities, and research needs pertaining to quality and reliability issues. It also provides key project proposals that must be implemented to address concerns about reliability attainment and defect learning. An expanded section on test-to-test, diagnostics, and failure analysis; an edited version of the Product Analysis Forum Roadmap; and an appendix containing a draft report highlighting reliability issues is included....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Guide for the Design of Semiconductor Equipment to Meet Voltage Sag Immunity Standards

Aug 05, 1999 | Mark Stephens, Dennis Johnson, John Soward, Jim Ammenheuser

This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment......

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Evaluating Automated Wafer Measurement Instruments

Aug 05, 1999 | Steven A. Eastman

This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

Guidelines for Manufacturing Equipment Reference Manuals

Aug 05, 1999 | Victoria J. Pruett, SEMI/SEMATECH; Julian Serda, Advanced Micro Devices; Darin Shifley, Applied Materials, Inc.

This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on installing, operating, controlling, and integrating process equipment....

Publisher: SEMATECH

SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Association, Non-Profit

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ii-feed SMT Intelligent Feeder

Capillary Underfill process