Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools

845 SMT / PCB Assembly Related Technical Articles

Technical Considerations for Controlling ESD in Electronics Manufacturing

Aug 18, 2011 | Microscan

Overview of ESD, Associated Risks and Prevention Measures...

Publisher: Microscan

Microscan

Microscan focuses on technologies of automatic identification, machine vision, and illumination with application solutions ranging from basic barcode reading up to complex machine vision inspection, gauging, and measurement.

Renton, Washington, USA

Inspection

Detection of Bare PCB Defects by Image Subtraction Method using Machine Vision

Aug 11, 2011 | Ajay Pal Singh Chauhan, Sharat Chandra Bhardwaj

(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar...

Publisher: Sant Longowal Institute of Engineering and Technology (SLIET)

Sant Longowal Institute of Engineering and Technology (SLIET)

Sant Longowal Institute of Engineering and Technology is an autonomous body, fully funded by Government of India and controlled by SLIET Society.

Distt. Sangrur, Punjab, India

School

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Aug 04, 2011 | William Edward Swaim

This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and ...

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

School

Air Flow Measurement in Electronic Systems

Jul 28, 2011 | Advanced Thermal Solutions, inc.

Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF...

Publisher: Advanced Thermal Solutions, Inc

Advanced Thermal Solutions, Inc

A leading engineering and manufacturing company supplying a wide range of heat sinks and laboratory-quality thermal instrumentation, together with thermal design consulting.

Norwood, Massachusetts, USA

Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line

Jul 21, 2011 | Eric Klaver, Senior Product Manager

In high-volume production, it is the price of the end product that matters. Purchasing decisions for production equipment therefore usually boil down to price divided by output modified by some efficiency factor....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Developments in Fine Line Resist Stripping

Jul 14, 2011 | R. Massey, N. Wood, J. Huang

In this paper, the concept for the next generation of resist stripper solutions is introduced, with specific emphasis upon development of new solutions targeted at the ever demanding fine line applications. The novel formulation used minimises the initial...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions

Jul 07, 2011 | E.Boni, D. Montanari, L. Caliari, F. Bregoli, L. Barbieri, F. Bergamaschi

The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components...

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville, South Carolina, USA

Manufacturer of Assembly Equipment

Quantitative Evaluation of New SMT Stencil Materials

Jun 29, 2011 | Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address...

Publisher: Shea Engineering Services

Shea Engineering Services

We work with electronics industry suppliers to provide top quality technical documentation for their products. Services include: ghost writing, presentation creation and training program development.

Burlington, New Jersey, USA

Service Provider

Back to Basics – Why Clean?

Jun 28, 2011 | ZESTRON

ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Cleaning, Test Services, Training Provider

A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

Jun 23, 2011 | Jasbir Bath, Gordon Clark, Tim Jensen, Renee Michalkiewicz, Brian Toleno

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free solde...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Use of Non Etching Adhesion Promoters in Advanced PCB Applications

Jun 16, 2011 | Roger Massey, Adrian Zee

Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume ...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

Defect freeQFN Assembly

Jun 09, 2011 | Brian J. Leach

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and...

Publisher: AccuSpec Electronics, LLC

AccuSpec Electronics, LLC

Highly specialized, difficult to build electronic assemblies. Medium to low volume.

McKean, Pennsylvania, USA

Manufacturer of Assembled PCBs, Assembly, Contract Manufacturer

Warpage Measurement of PCB With 3D Metrology

Jun 09, 2011 | Craig Leising

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla...

Publisher: NANOVEA

NANOVEA

From the Irvine, CA office Nanovea began designing and manufacturing instruments after years of experience in providing solutions for profilometry, mechanical and tribology applications.

Irvine, California, USA

Inspection, Test Services, OEM

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Jun 02, 2011 | Edward Wyrwas, Lloyd Condra, Avshalom Hava

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Package Converter Compliments Chip Obsolescence

May 26, 2011 | Ila Pal

The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde...

Publisher: Ironwood Electronics

Ironwood Electronics

Ironwood Electronics, an ISO9001/2000 company, offers a wide selection of high performance adapters and sockets for all the various SMT IC Packages. Fast, high quality quick turn custom projects are o

Burnsville, Minnesota, USA

Design

Improve Margins By Reducing Rework - A Benchmark Comparison

May 19, 2011 | Sjef v. Gastel, Manager of Advanced Development, Assembléon

Electronic equipment manufacturers know that rework and scrap cost them money, but rarely know just how much. Calculating it is relatively straightforward knowing the production line’s First Pass Yield (FPY), though....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Total Loss: How to Qualify Circuit Boards

May 12, 2011 | Don DeGroot; CCNi, Peter Pupalaikis; LeCroy, Brian Shumaker; DVT Solutions, LLC

We clarify the role of signal loss measurements, aka Total Loss, in specifying and qualifying circuit board materials for high-speed electronic design. We then demonstrate the NIST Multiline measurement technique in particular by characterizing test line...

Publisher: Connected Community Networks, Inc.

Connected Community Networks, Inc.

CCN provides impedance, loss, and s-parameter test systems for PCB production testing and design. We also provide test services to support products or customers needing traceable dielectric constant and transmission line testing.

Longmont, Colorado, USA

Test Services

Manufacturing Substrates with Embedded Passives

May 05, 2011 | R. N. Das, K. I. Papathomas J. M. Lauffer, S. Rosser, M. D. Poliks, V. R. Markovich

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v...

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Matrix maintenance in PXI with BIRST

Apr 21, 2011 | David Owen, Business Development Manager.

Switching systems, and in particular matrices are a key part of many tests systems, they allow a single core set of test equipment to be connected to the UUT, saving the cost of duplicating test equipment. That places the switching matrix in a very vulner...

Publisher: Pickering Interfaces Ltd.

Pickering Interfaces Ltd.

Manufacturer of commercial and custom switching systems used in the electronics test market and for imbedded switch systems in OEM equipment.

Essex, United Kingdom

Manufacturer of Components

Soldering And Handling Recommendations For Large Size MLC Capacitors

Apr 14, 2011 | Holy Stone Tech Paper

Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E...

Publisher: HolyStone International

HolyStone International

Designer and manufacturer of quality Multilayer Ceramic Capacitors and Ceramic Based RF Components.

Murrieta, California, USA

OEM

Voiding Control for QFN Assembly

Apr 07, 2011 | Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes.

Mar 30, 2011 | Kenneth Lee, Mustafa Özkök, Stefan Schmitz

The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques lik...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation

Mar 24, 2011 | Nansen Chen, Hongchin Lin

In this paper, a PCB layout technique is proposed to maintain ideal return paths for high-speed traces routing. Our goal is to implement and verify the digital LCD-TV in 2-layer PCB including the high-speed memory interfaces with less electromagnetic radi...

Publisher: MediaTek Inc.

MediaTek Inc.

MediaTek is a market leader and pioneer in cutting-edge SOC system solutions for wireless communications, high-definition digital TV, optical storage, and high-definition DVD products.

Hsinchu City, Taiwan

Subcontractor

Method of Modeling Differential Vias

Mar 17, 2011 | Lambert Simonovich, Dr. Eric Bogatin, Dr. Yazi Cao,

Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines o...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Backplane Architecture High-Level Design

Mar 16, 2011 | Lambert Simonovich

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane ...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Practical Fiber Weave Effect Modeling

Mar 16, 2011 | Lambert Simonovich

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Mar 10, 2011 | Neil Poole, Ph.D. and Brian Toleno, Ph.D.

History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead...

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

A New (Better) Approach to Tin Whisker Mitigation

Mar 03, 2011 | Craig Hillman, Gregg Kittlesen, and Randy Schueller

Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures (see nepp.nasa.gov/whisker/ for a list longer than you need). But, with all of this knowledge, the industry is still struggling on how to predict and prevent these "Nefarious Needles of Pain"....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Dross and the Selective Soldering Process

Feb 24, 2011 | Alan Cable

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must ...

Publisher: ACE Production Technologies

ACE Production Technologies

Manufacturer of Selective Soldering Machines, Lead Tinning Machines and related products.

Spokane Valley, Washington, USA

Soldering, Selective Soldering

Ground Pours - To Pour Or Not To Pour?

Feb 17, 2011 | Barry Olney

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Service Provider

Novel Transmission Line for 40 GHz PCB Applications

Feb 10, 2011 | Jamal S. Izadian, Ph.D. - RFCONNEXT, Inc., Julian Ferry, Justin McAllister - Samtec, Inc.

In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz....

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA

Subcontractor

0201 and 01005 Adoption in Industry

Feb 03, 2011 | DfR Solutions

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Dispelling 10 Myths About Nitrogen Reflow

Jan 27, 2011 | Dr. Andy Mackie

In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Development of Ultra-Multilayer Printed Circuit Board

Jan 20, 2011 | Yasuyuki Shinbo

This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases"....

Publisher: OKI Printed Circuits Co., Ltd.

OKI Printed Circuits Co., Ltd.

OKI Printed Circuits is engaged in design, manufacturing and sales of high-end multi-layer printed circuit boards.

Tokyo, Japan

Contract Manufacturer

PCB Stack-Up

Jan 20, 2011 | Henry Ott Consultants

PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo...

Publisher: Henry Ott Consultants

Henry Ott Consultants

A consulting and training organization specializing in the field of Electromagnetic Compatibility (EMC) and Signal Integrity (SI).

Livingston, New Jersey, USA

Consultant, Training Provider

Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)

Jan 13, 2011 | Terry Munson

The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin ...

Publisher: Foresite Inc.

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, USA

Cleaning, Test Services, Consultant, Service Provider

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Jan 06, 2011 | Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar

The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ...

Publisher: KIC Thermal

KIC Thermal

KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.

San Diego, California, USA

Software Manufacturer

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Dec 22, 2010 | Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Heat Management in Printed Circuit Boards

Dec 16, 2010 | Jakob Dieterle

This report discusses the significance of heat management in the design of printed circuit boards (PCB). After an introduction into the basics of PCBs the crucial mechanisms of heat transfer are discussed with regard to significance and typical design par...

Publisher: Lund University, The Faculty of Engineering

Lund University, The Faculty of Engineering

The Faculty of Engineering at Lund University is among the leading engineering faculties in Europe, with more than 7000 undergraduates and 800 postgraduates.

Lund, Sweden

School

3D ICs With TSVs - Design Challenges And Requirements

Dec 09, 2010 | Cadence

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int...

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Design

Multilayer PCB Stackup Planning

Dec 02, 2010 | Barry Olney

Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Service Provider

Dynamic Imaging Technology - Improved Solution for 3D Solder Paste Inspection (SPI) Technology

Dec 02, 2010 | Lynn Parker

The purpose of this white paper is to provide an overview of solder paste inspection (SPI) and to introduce dynamic image technology which is an improved solution for SPI optical inspection. Dynamic imaging measures surface profiles of solder paste for pr...

Publisher: TRI - Test Research, Inc.

TRI - Test Research, Inc.

The leading brand in the global automated inspection and testing equipment market. AOI, AXI, In-Circuit Testers, Board Testers, Solder-Paste Inspection, Manufacturing Defects Analyzers & Integrated Circuit Testers.

Taipei, Taiwan

Inspection

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Nov 24, 2010 | Bob Wettermann

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap...

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Soldering, IPC Standards Certification Center, Service Provider, Training Provider

A High Performance and Cost Effective Molded Array Package Substrate

Nov 18, 2010 | Philip Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa

In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is...

Publisher: EoPlex Technologies, Inc.

EoPlex Technologies, Inc.

Advanced materials company that builds small devices to generate and manage energy for various manufacturing components.

Redwood City, California, USA

Subcontractor

Net Ties and How to Use Them

Nov 16, 2010 | Chris Carlson

The Net Tie is a component type which allows for shorting together various nets in a design. The graphic for the symbol can be as simple as two component pins representing a virtual component between nets or as complex as mutipul pins (as many as desired)...

Publisher: Altium

Altium

Altium provides electronics design solutions that help designers create the next generation of electronic products.

La Jolla, California, USA

Software Manufacturer

Assembling the Next Electronic Equipment Generations.

Nov 12, 2010 | Sjef v. Gastel, Manager of Advanced Development, Assembléon

Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyo...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

Nov 06, 2010 | Tsun-kit Chin

An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on ...

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA

Subcontractor

Conductive Adhesives: TheWay Forward

Nov 04, 2010 | Dr. Ken Gilleo

Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab...

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, USA

Manufacturer of Assembly Material

Organic Optical Waveguide Fabrication in a Manufacturing Environment

Oct 28, 2010 | Benson Chan, How Lin, Chase Carver, Jianzhuang Huang, Jessie Berry

Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven...

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

High Voltage Chip Resistors

Oct 21, 2010 | F.M. Collins, W.M. Mathias

Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab...

Publisher: Ohmcraft

Ohmcraft

Ohmcraft is the leader in high-performance resistor design and manufacturing.

Honeoye Falls, New York, USA

Contract Manufacturer

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