Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools

860 SMT / PCB Assembly Related Technical Articles

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

Nov 16, 2011 | Dave Becker

Flexible Circuits are proven, reliable interconnect solutions for many of today's electronic packages. This article gives some general guidelines in terms of "dos" and "don'ts" that will help the engineer or designer make better decisions when using flex...

Publisher: All Flex Flexible Circuits, LLC

All Flex Flexible Circuits, LLC

Flexible circuit manufacturing and assembly. 20 years experience.

Northfield, Minnesota, USA

Manufacturer of Assembly Material, Manufacturer of Assembled PCBs, Contract Manufacturer

PCB Dynamic Coplanarity At Elevated Temperatures

Nov 10, 2011 | John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman

With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity ...

Publisher: iNEMI (International Electronics Manufacturing Initiative)

iNEMI (International Electronics Manufacturing Initiative)

iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.

Herndon, Virginia, USA

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

Nov 03, 2011 | Anupam Seth, Diego Klabjan, Placid M. Ferreira

This paper presents the development of a novel vehicle-routing-based algorithm for optimizing component pick-up and placement on a collect-and-place type machine in printed circuit board manufacturing. We present a two-phase heuristic that produces soluti...

Publisher: Mechanical Science and Engineering at UIUC

Mechanical Science and Engineering at UIUC

The Department of Mechanical Science and Engineering offers top-ranked degree programs in engineering mechanics, mechanical engineering, and theoretical and applied mechanics.

Urbana, Illinois, USA

School

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Oct 27, 2011 | Cheryl Tulkoff, Greg Caswell

Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Modelling of Thermal Stresses in Printed Circuit Boards

Oct 20, 2011 | Oldŕich Šuba, Libuše Sýkorová, Štépán Šanda, Michal Stanék

Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters....

Publisher: Tomas Bata University

Tomas Bata University

TBU follows the forty-year tradition of the Faculty of Technology, which was founded in Zlín in 1969 and since than has educated hundreds of highly-qualified professionals.

Zlin, Czech Republic

School

Are Separate Solder Flip-Chip Bonders Still Required?

Oct 13, 2011 | Eric Klaver, Senior Product Manager, Assembléon. Patrick Huberts, Product Manager Semicon Market.

Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placement are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

Oct 06, 2011 | M. Brizoux, A. Grivon, W. C. Maia Filho; Thales Corporate Services. J. Stahr, M. Morianz; AT&S. Hemant Shah, Ed Hickey; Cadence Design Systems Inc.

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...)

This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization....

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Design

Criminal Prosecution - Who can be held liable for the sale of counterfeit parts?

Sep 26, 2011 | Kristal Snider, Vice President; ERAI Inc.

On September 14, 2010, the late Shannon Wren, owner of VisionTech Components ("VisionTech"), and Stephanie McCloskey, VisionTech's Administrative Manager, were arrested during the execution of search and seizure warrants issued against the pair by the United States government after evidence connected them to the sale of counterfeit parts to the U.S. Navy, defense contractors and others. A ten-count indictment charged McCloskey with conspiracy, aiding and abetting in violation of Title 18 United States Code, Sections 371 and 2; trafficking in counterfeit goods, in violation of Title 18 United States Code, Section 2320; and mail fraud, in violation of Title 18 United States Code, Section 1341. McCloskey pled guilty to conspiracy and aiding and abetting for her role in the scheme....

Publisher: ERAI Inc.

ERAI Inc.

ERAI is an information services organization that monitors, investigates and reports issues that are affecting the electronics supply chain.

Naples, Florida, USA

Publication or Online Resource

Best and Simplest Recovery Solution for Missing Data

Sep 26, 2011 | USB Recovery

How to repair flash drive documents when missing due to malicious software installations? Company presents drive recovery software to restore digital files and compressed folders from accidently formatted usb removable media drives....

Publisher: USB Drive Recovery

USB Drive Recovery

www.usbdriverecovery.com is award winning software development company website that offers reliable and ultimate usb recovery software to fulfill customer’s need in shortest time at relevant prices.

City, California, USA

Software Manufacturer

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Sep 22, 2011 | Ruben Burga, Dr. Mohammed Saad

The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens)....

Publisher: IRphotonics

IRphotonics

IRphotonics is a leader in the design, manufacture, and marketing of Infrared-based materials and systems.

Hamden, Connecticut, USA

OEM

Near Term Solutions For 3D Packaging Of High Performance DRAM

Sep 15, 2011 | Vern Solberg, Wael Zohni

The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new generations of processors to reach their performance potential many manufacturers have developed interface formats to enable greater memory bandwidth. To ensure that the memory functions are able to support the increased signal speed, package developers are relying more and more on innovative 3D package assembly techniques and process refinement....

Publisher: Invensas Corporation

Invensas Corporation

Invensas is focused on the development of cutting-edge enabling technologies in advanced semiconductor packaging for advanced mobility and storage products.

San Jose, California, USA

OEM

Anisotropic Conductive Adhesive Bonding - A High Quality Interconnection Technique

Sep 08, 2011 | Miyachi Europe GmbH

Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly used for connecting displays to pcb’s using anisotropic conductive adhesive and flex foils. For successful implementation there are a few basic constraints. If these are followed, display connection is a simple and reliable process, giving top quality connections. Heat-Sealing can be done in any factory and can be introduced in a few months, from start of design to mass productions...

Publisher: MIYACHI EUROPE GmbH

MIYACHI EUROPE GmbH

MIYACHI Europe Corporation is part of the Miyachi Group and provides proven technologies with a long tradition as market leader in micro-connection also well-known as PECO, EAPRO and UNITEK.

Puchheim, Germany

OEM

Manufacturers Use Technology to Help Weather the Economic Downturn.

Sep 02, 2011 | Alison Falco, president; Dynamic Systems Inc.

Too often the manufacturers will implement technology for financial reporting purposes but overlook efficiencies that can generate cash flow and reduce costs on the manufacturing floor. Accurate information that provides a business owner or manager the ability to make immediate decisions about his/her operation resulting in a boost to profitability is crucial during an economic downturn. If revenue is down and the market mood does not permit price increases, then profitability can only be realized by reducing costs. So you must ask yourself "What prevents me from 100% efficiency?"...

Publisher: Dynamic Systems, Inc.

Dynamic Systems, Inc.

Barcode Data Collection Systems includes Inventory, Job Costing, Tool Management, Time Clock, Document Tracking http://www.a-barcode.com/solutions/?gallerytag=i-manufacturing

Redmond, Washington, USA

Software Manufacturer

Scavenging

Sep 01, 2011 | Harold Hyman

Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons....

Publisher: VJ Electronix

VJ Electronix

Rework and X-ray Inspection solutions for a variety of applications. VJ integrates proven industrial X-ray expertise with advanced SRT automation and NIS X-ray electronics inspection expertise.

Chelmsford, Massachusetts, USA

Manufacturer of Assembly Equipment, Assembly, Inspection, Repair/Rework, Soldering

Alternative Pb-Free Alloys

Aug 25, 2011 | Dr. Randy Schueller

While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about the high reflow temperatures of SAC or relies on ODM, it is im...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Technical Considerations for Controlling ESD in Electronics Manufacturing

Aug 18, 2011 | Microscan

Overview of ESD, Associated Risks and Prevention Measures...

Publisher: Microscan

Microscan

Microscan focuses on technologies of automatic identification, machine vision, and illumination with application solutions ranging from basic barcode reading up to complex machine vision inspection, gauging, and measurement.

Renton, Washington, USA

Inspection

Detection of Bare PCB Defects by Image Subtraction Method using Machine Vision

Aug 11, 2011 | Ajay Pal Singh Chauhan, Sharat Chandra Bhardwaj

(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar...

Publisher: Sant Longowal Institute of Engineering and Technology (SLIET)

Sant Longowal Institute of Engineering and Technology (SLIET)

Sant Longowal Institute of Engineering and Technology is an autonomous body, fully funded by Government of India and controlled by SLIET Society.

Distt. Sangrur, Punjab, India

School

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Aug 04, 2011 | William Edward Swaim

This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and ...

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

School

Air Flow Measurement in Electronic Systems

Jul 28, 2011 | Advanced Thermal Solutions, inc.

Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF...

Publisher: Advanced Thermal Solutions, Inc

Advanced Thermal Solutions, Inc

A leading engineering and manufacturing company supplying a wide range of heat sinks and laboratory-quality thermal instrumentation, together with thermal design consulting.

Norwood, Massachusetts, USA

Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line

Jul 21, 2011 | Eric Klaver, Senior Product Manager

In high-volume production, it is the price of the end product that matters. Purchasing decisions for production equipment therefore usually boil down to price divided by output modified by some efficiency factor....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Developments in Fine Line Resist Stripping

Jul 14, 2011 | R. Massey, N. Wood, J. Huang

In this paper, the concept for the next generation of resist stripper solutions is introduced, with specific emphasis upon development of new solutions targeted at the ever demanding fine line applications. The novel formulation used minimises the initial...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions

Jul 07, 2011 | E.Boni, D. Montanari, L. Caliari, F. Bregoli, L. Barbieri, F. Bergamaschi

The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components...

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville, South Carolina, USA

Manufacturer of Assembly Equipment

Quantitative Evaluation of New SMT Stencil Materials

Jun 29, 2011 | Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address...

Publisher: Shea Engineering Services

Shea Engineering Services

We work with electronics industry suppliers to provide top quality technical documentation for their products. Services include: ghost writing, presentation creation and training program development.

Burlington, New Jersey, USA

Service Provider

Back to Basics – Why Clean?

Jun 28, 2011 | ZESTRON

ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Cleaning, Test Services, Training Provider

A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

Jun 23, 2011 | Jasbir Bath, Gordon Clark, Tim Jensen, Renee Michalkiewicz, Brian Toleno

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free solde...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Use of Non Etching Adhesion Promoters in Advanced PCB Applications

Jun 16, 2011 | Roger Massey, Adrian Zee

Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume ...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

Defect freeQFN Assembly

Jun 09, 2011 | Brian J. Leach

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and...

Publisher: AccuSpec Electronics, LLC

AccuSpec Electronics, LLC

Highly specialized, difficult to build electronic assemblies. Medium to low volume.

McKean, Pennsylvania, USA

Manufacturer of Assembled PCBs, Assembly, Contract Manufacturer

Warpage Measurement of PCB With 3D Metrology

Jun 09, 2011 | Craig Leising

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla...

Publisher: NANOVEA

NANOVEA

From the Irvine, CA office Nanovea began designing and manufacturing instruments after years of experience in providing solutions for profilometry, mechanical and tribology applications.

Irvine, California, USA

Inspection, Test Services, OEM

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Jun 02, 2011 | Edward Wyrwas, Lloyd Condra, Avshalom Hava

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Package Converter Compliments Chip Obsolescence

May 26, 2011 | Ila Pal

The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde...

Publisher: Ironwood Electronics

Ironwood Electronics

Ironwood Electronics, an ISO9001/2000 company, offers a wide selection of high performance adapters and sockets for all the various SMT IC Packages. Fast, high quality quick turn custom projects are o

Burnsville, Minnesota, USA

Design

Improve Margins By Reducing Rework - A Benchmark Comparison

May 19, 2011 | Sjef v. Gastel, Manager of Advanced Development, Assembléon

Electronic equipment manufacturers know that rework and scrap cost them money, but rarely know just how much. Calculating it is relatively straightforward knowing the production line’s First Pass Yield (FPY), though....

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

Total Loss: How to Qualify Circuit Boards

May 12, 2011 | Don DeGroot; CCNi, Peter Pupalaikis; LeCroy, Brian Shumaker; DVT Solutions, LLC

We clarify the role of signal loss measurements, aka Total Loss, in specifying and qualifying circuit board materials for high-speed electronic design. We then demonstrate the NIST Multiline measurement technique in particular by characterizing test line...

Publisher: Connected Community Networks, Inc.

Connected Community Networks, Inc.

CCN provides impedance, loss, and s-parameter test systems for PCB production testing and design. We also provide test services to support products or customers needing traceable dielectric constant and transmission line testing.

Longmont, Colorado, USA

Test Services

Manufacturing Substrates with Embedded Passives

May 05, 2011 | R. N. Das, K. I. Papathomas J. M. Lauffer, S. Rosser, M. D. Poliks, V. R. Markovich

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v...

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Matrix maintenance in PXI with BIRST

Apr 21, 2011 | David Owen, Business Development Manager.

Switching systems, and in particular matrices are a key part of many tests systems, they allow a single core set of test equipment to be connected to the UUT, saving the cost of duplicating test equipment. That places the switching matrix in a very vulner...

Publisher: Pickering Interfaces Ltd.

Pickering Interfaces Ltd.

Manufacturer of commercial and custom switching systems used in the electronics test market and for imbedded switch systems in OEM equipment.

Essex, United Kingdom

Manufacturer of Components

Soldering And Handling Recommendations For Large Size MLC Capacitors

Apr 14, 2011 | Holy Stone Tech Paper

Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E...

Publisher: HolyStone International

HolyStone International

Designer and manufacturer of quality Multilayer Ceramic Capacitors and Ceramic Based RF Components.

Murrieta, California, USA

OEM

Voiding Control for QFN Assembly

Apr 07, 2011 | Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes.

Mar 30, 2011 | Kenneth Lee, Mustafa Özkök, Stefan Schmitz

The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques lik...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation

Mar 24, 2011 | Nansen Chen, Hongchin Lin

In this paper, a PCB layout technique is proposed to maintain ideal return paths for high-speed traces routing. Our goal is to implement and verify the digital LCD-TV in 2-layer PCB including the high-speed memory interfaces with less electromagnetic radi...

Publisher: MediaTek Inc.

MediaTek Inc.

MediaTek is a market leader and pioneer in cutting-edge SOC system solutions for wireless communications, high-definition digital TV, optical storage, and high-definition DVD products.

Hsinchu City, Taiwan

Subcontractor

Method of Modeling Differential Vias

Mar 17, 2011 | Lambert Simonovich, Dr. Eric Bogatin, Dr. Yazi Cao,

Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines o...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Backplane Architecture High-Level Design

Mar 16, 2011 | Lambert Simonovich

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane ...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Practical Fiber Weave Effect Modeling

Mar 16, 2011 | Lambert Simonovich

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Mar 10, 2011 | Neil Poole, Ph.D. and Brian Toleno, Ph.D.

History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead...

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

A New (Better) Approach to Tin Whisker Mitigation

Mar 03, 2011 | Craig Hillman, Gregg Kittlesen, and Randy Schueller

Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures (see nepp.nasa.gov/whisker/ for a list longer than you need). But, with all of this knowledge, the industry is still struggling on how to predict and prevent these "Nefarious Needles of Pain"....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Dross and the Selective Soldering Process

Feb 24, 2011 | Alan Cable

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must ...

Publisher: ACE Production Technologies

ACE Production Technologies

Manufacturer of Selective Soldering Machines, Lead Tinning Machines and related products.

Spokane Valley, Washington, USA

Soldering, Selective Soldering

Ground Pours - To Pour Or Not To Pour?

Feb 17, 2011 | Barry Olney

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Service Provider

Novel Transmission Line for 40 GHz PCB Applications

Feb 10, 2011 | Jamal S. Izadian, Ph.D. - RFCONNEXT, Inc., Julian Ferry, Justin McAllister - Samtec, Inc.

In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz....

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA

Subcontractor

0201 and 01005 Adoption in Industry

Feb 03, 2011 | DfR Solutions

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Dispelling 10 Myths About Nitrogen Reflow

Jan 27, 2011 | Dr. Andy Mackie

In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Development of Ultra-Multilayer Printed Circuit Board

Jan 20, 2011 | Yasuyuki Shinbo

This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases"....

Publisher: OKI Printed Circuits Co., Ltd.

OKI Printed Circuits Co., Ltd.

OKI Printed Circuits is engaged in design, manufacturing and sales of high-end multi-layer printed circuit boards.

Tokyo, Japan

Contract Manufacturer

PCB Stack-Up

Jan 20, 2011 | Henry Ott Consultants

PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo...

Publisher: Henry Ott Consultants

Henry Ott Consultants

A consulting and training organization specializing in the field of Electromagnetic Compatibility (EMC) and Signal Integrity (SI).

Livingston, New Jersey, USA

Consultant, Training Provider

per page.

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HeatShield Gel- thermal PCB shield during reflow

Precision Auger Dispense Pump