Electronics Manufacturing Technical Articles

Advanced Laser Microfabrication in High Volume Manufacturing

Jan 16, 2023 | John Bickley

There is increased interest in the laser microfabrication of variable shape and size features for a wide variety of materials. Quality and throughput requirements continue to increase, with tighter tolerances regarding dimensional and positional specifications. Consequently, improved laser sources and manufacturing techniques, with advanced system integration and process control need to be developed to be able to address ever increasing industry requirements.

This paper discusses recent advances enabled by a new generation of IPG Photonics fiber lasers that are resulting in systems having greater flexibility, greater reliability and lower operating cost of ownership than their predecessors, and that are producing machining processing rates up to an order of magnitude faster. Examples are given of using high brightness, high pulse energy, pulsed fiber lasers known as quasi continuous wave (QCW) fiber lasers operating in the near infra red (1070 nm) with pulse durations in the micro to millisecond regime, as well as using green (532 nm) fiber lasers in the nanosecond regime. Applications include high speed drilling of ceramics such as alumina and AlN with sub-50um diameter holes machined at 3000, 750 and 300 holes per second in 100, 381 and 635 microns thick substrates, respectively; high speed cutting and scribing of alumina in 381 and 635 microns substrates, high quality cutting of up to 3 mm thick sapphire substrates, as well as high quality cutting & drilling of polymers from PEEK, to silicone, epoxy, and FR4 are presented. Laser machining techniques and their implementation in a new high-volume manufacturing platform are discussed.

Publisher: IPG Photonics World Headquarters

High Phosphorus ENIG – highest resistance against corrosive environment

Jan 10, 2023 | Sven Lamprecht and Petra Backus

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas....

Publisher: Atotech

Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold

Jan 10, 2023 | George Milad, Jon Bengston and Albin Gruenwald

Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly....

Publisher: Uyemura International Corporation

EFFECTS OF ENIG NICKEL CORROSION ON WETTING BALANCE TEST RESULTS AND INTERMETALLIC FORMATION

Jan 10, 2023 | Donald Gudeczauskas, George Milad

Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed....

Publisher: Uyemura International Corporation

BLACKPAD REVISITED

Jan 09, 2023 | M. Simard-Normandin, C. Banks

Since the implementation of lead-free soldering, solderability issues appear to have become more common. The higher soldering temperature releases volatiles creating solder voids. The higher temperature also increases board and component flexing. Surface mount components fall off boards and BGA (Ball Grid Array) balls crack cleanly at the intermetallic interface creating open circuits. Black pad is often found as the root cause of these issues. However, black pad is a catch-all expression used to describe a variety of problems. As common as it is, black pad is not always recognised. What does it look like? How can one differentiate black pad from other soldering defects? We present high resolution optical and SEM (Scanning Electron Microscopy) images of real-life soldering problems, demonstrating the difference between black pad issues, flexing issues and component issues, pointing at specific features identifying the syndrome.

Publisher: MuAnalysis

PCB/Substrate Finishing Overview

Jan 06, 2023 | John Swanson

PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG....

Publisher: MacDermid, Inc.

ACHIEVING A SUCCESSFUL ENIG FINISHED PCB UNDER REVISION A OF IPC 4552 MACDERMID ENTHONE

Jan 06, 2023 | Martin Bunce, Lenora Clark, John Swanson

The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad....

Publisher: MacDermid, Inc.

Hidden Head-In-Pillow soldering failures

Dec 23, 2022 | Bart Vandevelde , Geert Willems , Bart Allaert

One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured...

Publisher: IMEC

Characterize and Understand Functional Performance Of Cleaning QFN Packages on PCB Assemblies

Dec 19, 2022 | Mike Bixenman (Team Leader), KYZEN Corporation; Eric Camden, Foresite; Johnny CH Chen, Wistron; Qin Chen, Suzhou Eunow Company; Janet Cross, U.S. Army; Jeff Kautzer, GE Medical; Jason Keeping, Celestica; Milos Lazic, Indium Corporation; David Lober, KYZEN

Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness....

Publisher: iNEMI (International Electronics Manufacturing Initiative)

Approach to detecting latent defects of the printed circuit boards thin-filmed coatings

Dec 05, 2022 | Alexey Balastov, Boris Kovrigin, and Valery Lavrinovich

One of the main reasons for the space vehicles (SV) power supply systems failure is a secondary arc. In the statistics of fatal failures that can lead to the SV loss, the failure rate of the power supply systems is 9%, but despite this, there are no standard methods for diagnosing the onboard equipment for the arc stability, due to the relative novelty of the problem. The problem we encountered is associated with the need to switch power supply systems to the voltage levels that are much higher than the arc voltage in the space vacuum. From the point of view of the defects downing that can lead to arcing, the most vulnerable are the insulation coatings.Therefore, a significant part of the problem solution is concentrated in the development of the specific methods for these coatings diagnostics. In space technology, such diagnostics significance is increased due to the inability to provide necessary repairs or services in the outer space....

Publisher: Tomsk State University

Latent heat induced deformation of PCB substrate: Measurement and simulation

Dec 05, 2022 | Denis Froˇs *, Petr Veselý, Jan Zemen, Karel Duˇsek

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure....

Publisher: Czech Technical University in Prague

No-fault-found and intermittent failures in electronic products

Dec 05, 2022 | Haiyu Qi , Sanka Ganesan, Michael Pecht

This paper reviews the possible causes and effects for no-fault-found observations and intermittent fail- ures in electronic products and summarizes them into cause and effect diagrams. Several types of inter- mittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent failure case study is presented. The paper then discusses when no-fault-found observations should be considered as failures. Guidelines for assessment of intermittent failures are then provided in the discussion and conclusions....

Publisher: CALCE Center for Advanced Life Cycle Engineering

Windows Remote Arduino

Dec 01, 2022 | FS PCBA

PCB components or supplies that need to be prepared in advance Arduino Uno Rev3 The Arduino Uno is a rigid PCB microcontroller board based on the ATmega328P (datasheet). It has 14 digital input/output pins (6 of which can be used as PWM outputs), 6 analog inputs, a 16 MHz ceramic resonator (CSTCE16M0V53-R0), a USB connection, a power jack, an ICSP header and a reset button. It includes everything needed to support the microcontroller; just connect it to a computer with a USB cable or power it with an AC-to-DC adapter or battery and you're ready to go. You can tinker with the Uno without worrying about doing something wrong, worst case you can replace the chips for a few bucks and start over. "Uno," which means "Uno" in Italian, was used to mark the release of Arduino software (IDE) 1.0. The Uno board and Arduino software (IDE) version 1.0 is the reference version of the Arduino and has now evolved to newer versions. The Uno board is the first in a series of USB Arduino boards and is the reference model for the Arduino platform; see the Arduino Board Index for an exhaustive list of current, past, or obsolete boards. Arduino Uno Rev3 SparkFun Bluetooth PCB Modem - BlueSMiRF Silver BlueSMiRF Silver is the latest Bluetooth PCB wireless serial cable replacement! This version of the popular BlueSMiRF uses the RN-42 module, which has a somewhat smaller range than the RN-41 module used in BlueSMiRF Gold. These modems are used as serial (RX/TX) pipes. Any serial stream from 2400 to 115200bps is seamlessly passed from your computer to your target. The remote unit can be powered from 3.3V to 6V for easy battery connection. All signal pins on the remote unit are 3V-6V tolerant. No level translation is required. Do not connect this device directly to a serial port. If you need to connect it to a computer, you will need an RS232 to TTL converter circuit. MCL053MD MCL053MD is a 5mm HE red circular LED PCB component with red diffuser lens, through hole mount, round lens, 15mcd luminous intensity, 625nm peak wavelength, 45° viewing angle. This LED light is made with GaAsP on GaP. 85mW power consumption -40 to +85°C operating temperature range Multicomp Pro products are rated 4.6 out of 5 stars 12 Month Limited Warranty *See terms and conditions for details 96% of customers would recommend to a friend 14N9416-40.jpg (320×193) Male/Male Jumper Wires Manufacturer: ADAFRUIT Manufacturer Part No: 758 Newark Part No.: 88W2570 Technical Datasheet: 758 Datasheet 88W2570-40.jpg (200×200) RCC120610K0FKEA MFG_RCC1206.jpg (640×640) The start of a Windows remote Arduino PCBA project Program the Arduino First, let's program the Arduino. Download and install the Arduino software from the official Arduino website. Connect your Arduino device to your computer using USB. Start the Arduino application. Verify you have the correct Arduino board selected under Tools > Boards Verify you have the correct COM port selected under Tools > Ports In the Arduino IDE, navigate to File > Examples > Firmata > StandardFirmata Confirm that StandardFirmata will use the correct baud rate for your connection. (see note on baud rates below) Press "Upload" to deploy the StandardFirmata sketch to the Arduino device. Baud Rate StandardFirmata communicates with Bluetooth devices using a serial line or via USB. By default it uses a baud rate of 57,600 bps. Depending on the configuration of your Bluetooth device, you may need to modify this rate. It can be found in the setup method and looks like this: Firmata.begin(57600); Change the value to the correct baud rate. For USB, this value is configurable in the device and Windows Remote Arduino connection parameters. If you are using a bluetooth PCBA, the baud rate depends on the device you are using. Hardware Set Up You can always start with a USB, WiFi or Ethernet connection, but let's cover the simple connection of a Bluetooth PCBA device and LED, we will use the Windows Remote Arduino library to turn the LED on and off via Bluetooth! Connect the power and ground rails on the rigid PCB to the 5V and GND pins on the Arduino respectively. Power connections are easily tracked using color-coded wires (red and black). power and ground rails Plug the Bluetooth device onto the rigid PCB and connect the VCC and GND pins to the power and ground rails on the rigid PCB respectively. Plug the Bluetooth device onto the rigid PCB Connect the TX-0 pin on the Bluetooth device to the RX pin on the Arduino. Likewise, connect the RX-1 pin on the Bluetooth device to the TX pin on the Arduino. The TX-0 pin is interconnected with the Arduino's RX pin. Note that the yellow wire in the picture goes from the Bluetooth device's transmit pin to the Arduino's receive pin, and the orange wire does the opposite. This step is critical to establishing serial communication between the Bluetooth device and the Arduino, allowing messages transmitted from one device to be received by the other. The yellow wire is connected to the bluetooth PCB Establish serial communication between Bluetooth device and Arduino Before making this connection, make sure your code is uploaded to the Arduino. The Arduino Uno uses the same serial (TX and RX) pins to flash the device, this prevents any code being uploaded to it while another device is connected to those serial pins. Add an LED to the rigid PCBA. Note that the longer (or bent) leg is the anode (positive) and the shorter leg is the cathode (negative). Add an LED to the rigid PCBA. Connect the cathode of the LED to the ground rail of the rigid PCB using a 330Ω resistor. A 330Ω resistor is striped orange, orange, brown, gold as shown. 330Ω resistor connected to rigid PCB Connect the anode of the LED to any digital I/O pin on the Arduino. We use pin 13 in our example. The anode of the LED is connected to the Arduino Your FS PCBA setup is now ready! It should look similar to the setup shown in the image below. FS PCBA FS PCBA Project Code Arduino sketching Install Arduio Firmata Library: Step 1.PNG (589×298) Step 2.PNG (838×373) Go to Sketch Menu/Include Libraries/Manage Libraries and search for "Firmata" and install the latest version of the library. Now open and upload the "StandardFirmata" example from File/Examples/Firmata/StandardFirmata. It is done on the Arduino side. Now we will see the application for Windows Universal Platform. Windows Universal Platform App Download the example repository here. If you'd rather create your own electronics PCB fabrication project, follow the project setup guide here. Now that we're all set, let's get into some code! Create your project I set up a project called FS PCBA RemoteBlinky following the steps in the setup guide. In the screenshot below, you'll see the code-behind file, MainPage.xaml.cs, which simply creates a Bluetooth connection object and passes it to the RemoteDevice class in the constructor. You'll see that I specified my device name in this example. You can also enumerate available devices by calling the static .listAvailableDevicesAsync() function on the BluetoothSerial (and USBSerial) class before constructing the object. project00.png (1012×657) Notes for USB flex PCBA: USBSerial has many options for specifying your device. In the constructor, you can provide the device's VID and PID, just the VID, or a DeviceInformation object (obtained from the listAvailableDevicesAsync function above). Likewise, BluetoothSerial allows you to provide a device ID (as a string), a device name (also a string), or a DeviceInformation object. You can get the VID and PID combination of a USB device by following these steps: Open Device Manager from Control Panel or by pressing the Windows + Pause keys together and selecting the Device Manager link on the left. Expand the Ports (COM and LPT) menu Right click on your Arduino device and select properties On the Details tab, select Hardware ID from the drop-down menu. You may see multiple entries in the Value box, but any entry will have a matching PID and VID. These entries have the format "USB\VID_****&PID_****", where **** is the numeric ID value. USBSerial usb = new USBSerial( "VID_2341", "PID_0043" ); Guaranteed to work only with the following hardware devices: vidpid.png (408×455) Next, I'll add a callback function to the RemoteDevice object's DeviceReady event. This function is automatically called when the Bluetooth Flex PCB device is connected and all necessary settings have been initialized. You'll notice that I haven't implemented anything in that function at this point. Finally, call .begin() on the connection object to tell it to connect. Flex USB PCBA code considerations: The parameters of the .begin() function don't matter for bluetooth flex PCBA, but you have to use the same baud rate on Arduino and UsbSerial object (first parameter). Also, the second parameter must be "SerialConfig.8N1". The rest of the example works exactly the same no matter which connection type you use. project01.png (1003×651) Jump to the MainPage.xaml file and create a few buttons that turn the LEDs on and off. You'll notice that I've added the button callback to the Click event and set the IsEnabled property to false, FS Tech will explain why below! project02.png (1017×366) I implemented three functions in this step. First, the OnDeviceReady function now enables the button on the UI thread! This ensures that the button is only enabled when the Bluetooth connection is ready, as this usually takes a few seconds to happen. I also set up .digitalWrite() calls in the button callbacks OnButton_Click and OffButton_Click project04.png (1141×730) Flex PCBA Build and Deploy! Once connected, your button will be enabled and you can turn the LED on and off at will! Here's a screenshot of this basic example running on Windows Phone 10. screenshot.png (480×854) I really hope you enjoy duplicating this project and using it as a baseline for an incredible new set of PCBA projects! You can quickly go from PCB to PCBA with PCB assembly to get it done in no time. https://www.fs-pcba.com/...

Publisher: FS Technology

Effect of Multiple Reflow Cycles on Intermetallic Compound Creation

Nov 29, 2022 | Václav Wirth, Karel Rendl, and František Steiner

This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 size chip resistors were made from SAC 305 or SnBi solder alloy. Samples were reflowed one to six times with one of the two different soldering profiles for each soldering alloys. The thickness and composition of IMC layers were measured and observed with a scanning electron microscope. The growing of IMC layers thickness was observed. The results are presented depending on greater value of heating factor and number of reflow cycles. The shear forces for the components were measured and the fracture interfaces were inspected.

Publisher: University of West Bohemia

The Effect Of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Nov 07, 2022 | Richard Coyle, Dave Hillman, Michael Barnes, David Heller, Charmaine Johnson, Richard Popowich, Richard Parker, Keith Howell, Joerg Trodler, Adam Murling

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies....

Publisher: Nokia Bell Labs

Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components

Oct 31, 2022 | Arvind Srinivasan Karthikeyan, Sa'd Hamasha, Michael Meilunas, and Fred Dimock

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time....

Publisher: Auburn University

Lead-Free and Mixed Assembly Solder Joint Reliability Trends

Oct 31, 2022 | Jean-Paul Clech, Ph.D.

This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste....

Publisher: EPSI Inc.

Surfaces of mixed formulation solder alloys at melting

Oct 31, 2022 | M. J. Bozack, J. C. Suhling, Y. Zhang, Z. Cai, and P. Lall

Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]...

Publisher: Auburn University

Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Oct 31, 2022 | Anupam Choubey, Michael Osterman, and Michael Pecht

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad....

Publisher: CALCE Center for Advanced Life Cycle Engineering

00338005-01 SMT Spare Parts Snap Switch Changer S 826B For Siemens Pick And Place Machine

Oct 31, 2022 | Germany

Model: IENENS PL EA Servo Motor Usage: Siemens Pick And Place Machine Description: Drive Module SERVO Wight: 2kg Packing: Paper Case Product Description: Motor High Light: 00338005-01 SMT Spare Parts, Snap Switch Changer SMT Spare Parts, SIEMENS Spare Parts Snap Switch Changer...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

0032254403 A700 Vacuum Nozzle Type 418 SIEMENS AG Pip 418 Komplett Vectra

Oct 31, 2022 | Germany

Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00341941S01 SMT Spare Parts Oben Stripping Device Plate 12*16mm Feeder

Oct 31, 2022 | Germany

Model: STRIPPING DEVICE PLATE Type: High-speed Chip Mounter Brand: SIEMENS SIPLACE ASM QUALITY: 100% Tested Usage: SIPLACE SMT Placement Machine HIGH LIGHT: Surface Mount Components, Smt Machine Part High Light: 00341941S01 SMT Spare Parts, 12*16mm SMT Spare Parts, 00341941S01...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00343010-01 SMT Spare Parts SIEMENS PL EA MCH Filter G1/2 Modulair 112

Oct 31, 2022 | Germany

Type: Filter Cup Model: Siemens Placement Machine Certification: CE，ROHS Trademark: Siemens Brief Description: Feeder Fixing Screws Wight: 1kg High Light: 00343010-01 SMT Spare Parts, ROHS SMT Spare Parts, SIEMENS PL EA MCH Filter...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00344065-03 KST-75-UP Siemens PCB Camera ALLIED Vision Technologies GmbH M60S

Oct 31, 2022 | Germany

Product Name: ALLIED Vision Technologies GmbH M60S Processing Customization: No Quality: 100% Tested Automatic Manual: Automatic Brand: Siemens AG Custom Processing: Yes High Light: 00344065-03, 00344065-03 Siemens PCB Camera, KST-75-UP Siemens PCB Camera...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00344065-03 KST-75-UP Siemens PCB Camera ALLIED Vision Technologies GmbH M60S

Oct 31, 2022 | Germany

Product Name: ALLIED Vision Technologies GmbH M60S Processing Customization: No Quality: 100% Tested Automatic Manual: Automatic Brand: Siemens AG Custom Processing: Yes High Light: 00344065-03, 00344065-03 Siemens PCB Camera, KST-75-UP Siemens PCB Camera...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00345186 27856240 0020 5283 pick and place parts L&A Ea Mch Fuehrungswagen Kwve

Oct 31, 2022 | Germany

Warranty: 3 Months Precision: High Precision Certification: CE，ROHS Wight: 1kg Automatic Grade: Automatic Trademark: Ultra High-speed Chip Mounter High Light: 00345186, 00345186 smt pick and place parts, 00345186 SMT Spare Parts...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Samsung Board J9060343a Stepping Feeder Power Board Feeder Power Board

Oct 31, 2022 | Korea

Alias: Feeder Power Board Brand: MITSUBOSHI/Samsung Applicable Machinery: Samsung Placement Machine Selection Principle: Economy, Applicability Warranty: 3 Month Quality: Top Quality High Light: J9060343a, J9060343a Stepping Feeder Board, J9060343a Samsung Board...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Yamaha Mounter Accessories 6604098 Class I Laser Product CyberOptics Unit Laser

Oct 31, 2022 | japan

Delivery Time: 1-2 Days Attributes: Original New Material: Metal Shipping Ways: DHL, FedEx, TNT, UPS, By Sea,DDP Dedicated Line Color: Black Certification: ISO...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Siemens Piece 0319827S02 SMT Spare Parts Smt Placement Equipment

Oct 31, 2022 | Germany

Quality: 100% Tested Precision: High Precision Color: Sliver Transport Package: Wooden Case Specification: HS50 Certification: ISO, CE...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Siemens Asm Pickup Window 12x16 Smt Spare Parts 00322753S04 00328503

Oct 31, 2022 | Germany

Model/Specification: 12*16MM Common Name: Press Cover/GUIDE Suitable Fo: Siemens Feeder Parts Material: Ceramic Wight: 55g Quality: 100% Tested High Light: 12x16 Smt Spare Parts, 00328503, 00322753S04...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

46191201 Cutter Housing Assy Universal Axial Distribution Head Mechanism

Oct 31, 2022 | CHINA

Model Name: CUTTER HOUSING ASSY Patch Speed: 10000 (grains/hour) Applicable Model: Plug-in Machine Accessories Category: Industrial Equipment Weight: About 500g Automatic Manual: Automatic...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

MMMA3ACN2A SMT Spare Parts AC Servo Motor SM411Z-Axis Motor Brand New

Oct 31, 2022 | japan

Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Samsung Pneumatic SMT Spare Parts SM24mm Cylinder J67011042A

Oct 31, 2022 | Korea

Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

104132101501 SMT Spare Parts AI Automatic Plug In Machine Accessories

Oct 31, 2022 | japan

Brand Name panasonic Model 104132101501 Origin JAPAN Minimum order quantity 1PCS Price negotiable...

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Original Panasonic SMT Spare Parts 104691107604 NSC CHUCK 10469S0007

Oct 31, 2022 | japan

Material: Iron Model Name: NSC CHUCK Top Quality: 180g Automatic / Manual: Automatic Specification: Original New，copy New Shipping Method: FedEx, DHL, Etc....

Publisher: Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

ASSESSMENT OF ACCRUED THERMO-MECHANICAL DAMAGE IN LEADFREE PARTS DURING FIELD-EXPOSURE TO MULTIPLE ENVIRONMENTS

Oct 11, 2022 | Pradeep Lall, Ph.D., Rahul Vaidya and Vikrant More and Kai Goebel, Ph.D.

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantiication of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments....

Publisher: Auburn University

MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES

Oct 11, 2022 | John McMahon and Brian Gray

The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness....

Publisher: Celestica Corporation

LEAD-FREE FLUX TECHNOLOGY AND INFLUENCE ON CLEANING

Oct 11, 2022 | Ning-Cheng Lee, Ph.D.

Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the features listed above, corresponding desired chemical structures can be deduced, and the impact of those structures on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue....

Publisher: Indium Corporation

Counterfeit Materials Prevention

Oct 04, 2022 | Lockheed Martin Corporation

Counterfeiting is growing in exponential proportions with respect to the types of: • Products being counterfeited • Industries affected • Potential consequences caused by counterfeits If this threat is not adequately addressed, counterfeit items have the potential to seriously compromise the safety and operational effectiveness of our products. The objective of this training is to raise awareness of: • The risks and impacts of counterfeit parts infiltrating the supply chain. • Best practices to eliminate or mitigate those risks • Lockheed Martin counterfeit prevention requirements for suppliers...

Publisher: Lockheed Martin Corporation

Methods Used In The Detection Of Counterfeit Electronic Components

Oct 04, 2022 | Harold "Woody" Hewett

In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing....

Publisher: Electro-Comp Tape and Reel Services, LLC

Dispensing Thermally Conductive Materials

Sep 29, 2022 | Scheugenpflug

Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils....

Publisher: Scheugenpflug Inc.

Avoidance of Ceramic-Substrate-Based LED Chip Cracking Induced by PCB Bending or Flexing

Sep 25, 2022 | Cree Lighting

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock....

Publisher: Cree Lighting

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Sep 25, 2022 | Alexander Teverovsky

Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed....

Publisher: NASA Office Of Safety And Mission Assurance

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

Sep 25, 2022 | M. J. Heffes, H. F. Nied

This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle for nearby interfacial cracks. Simplified twolayer periodic symmetry models were developed to investigate these interactions. Comparison of flip chip results using different solder material models showed that viscoplastic models yielded lower stress and fracture parameters than time independent elastic-plastic simulations. It was also found that adding second level attachment greatly increases the magnitude of the solder strain and fracture parameters. As expected, the viscoplastic and temperature dependent elastic-plastic results exhibited greater similarity to each other than results based solely on linear elastic properties. !DOI: 10.1115/1.1649242"

Publisher: Lehigh University

ElectronicWaste, an Environmental Problem Exported to Developing Countries: The GOOD, the BAD and the UGLY

Sep 21, 2022 | Samuel Abalansa, Badr El Mahrad, John Icely and Alice Newton

Electronic waste (e-waste) is a rapidly developing environmental problem particularly for the most developed countries. There are technological solutions for processing it, but these are costly, and the cheaper option for most developed countries has been to export most of the waste to less developed countries. There are various laws and policies for regulating the processing of e-waste at different governance scales such as the international Basel Convention, the regional Bamoko Convention, and various national laws. However, many of the regulations are not fully implemented and there is substantial financial pressure to maintain the jobs created for processing e-waste. Mexico, Brazil, Ghana Nigeria, India, and China have been selected for a more detailed study of the transboundary movements of e-waste. This includes a systematic review of existing literature, the application of the Driver, Pressure, State, Impact, Response (DPSIR) framework for analysing complex problems associated with social ecological systems, and the application of the Life Cycle Assessment (LCA) for evaluating the environmental impact of electronic devices from their manufacture through to their final disposal. Japan, Italy, Switzerland, and Norway have been selected for the LCA to show how e-waste is diverted to developing countries, as there is not sufficient data available for the assessment from the selected developing countries. GOOD, BAD and UGLY outcomes have been identified from this study: the GOOD is the creation of jobs and the use of e-waste as a source of raw materials; the BAD is the exacerbation of the already poor environmental conditions in developing countries; the UGLY is the negative impact on the health of workers processing e-waste due to a wide range of toxic components in this waste. There are a number of management options that are available to reduce the impact of the BAD and the UGLY, such as adopting the concept of a circular economy, urban mining, reducing loopholes and improving existing policies and regulations, as well as reducing the disparity in income between the top and bottom of the management hierarchy for e-waste disposal. The overarching message is a request for developed countries to help developing countries in the fight against e-waste, rather than exporting their environmental problems to these poorer regions....

Publisher: Murray Foundation

Handling of Highly-Moisture Sensitive Components - An Analysis of Low-Humidity Containment and Baking Schedules

Sep 12, 2022 | R. L. Shook and J. P. Goodelle

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device....

Publisher: Alcatel-Lucent

Innovative process for sealing contours protects sensitive components

Sep 08, 2022 | Scheugenpflug

Liquid seals in the automotive industry have to meet high functional quality standards and have to be applied in the shortest possible time in view of the high volume of workpieces. This market environment gives rise to innovations that guarantee maximum speed and quality from initial design to final results....

Publisher: Scheugenpflug Inc.

Stencil Cleaning Handbook

Aug 17, 2022 | Mike Konrad

Back in the "good old days," stencil cleaning was effortless and effective. CFC-based solvents were sprayed or wiped onto a stencil with apertures hundreds of times larger than modern-day components. The stencil cleaning process was not considered a value-added procedure; instead it was the cleaning of a production tool. How times have changed. The late-1980s ushered in the end of most of the popular solvents, and the machines that consumed them. Assemblers turned to alternative cleaning agents, including IPAs and other solvents....

Publisher: Aqueous Technologies Corporation

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Aug 08, 2022 | Reid Henry

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing....

Publisher: Hentec Industries, Inc. (RPS Automation)

Resource-efficient adhesion and potting technologies in electronics manufacturing

Aug 02, 2022 | Scheugenpflug

Saving resources in electronics manufacturing is not an end in itself. It is closely linked with reducing costs and gaining a competitive advantage. However, innovative adhesion and potting technologies in combination with highly functional adhesives and potting media make a significant contribution to the ideal union between economic performance and a reduced ecological footprint....

Publisher: Scheugenpflug Inc.