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684 SMT / PCB Technical Articles. Show: per page.

Technical Library articles

Security access design

Published:

Jul 29, 2009

Author:

Orchid Technologies Engineering and Consulting, Inc.

Company:

Orchid Technologies Engineering & Consulting, Inc.

Abstract:

Building Access and Security is critical to our nation's needs. Orchid's building access technology integrates precision automatic door motion control electronics with sophisticated communications technology to enable low-cost networked building ac...

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Published:

Jul 22, 2009

Author:

Endicott Interconnect Technologies, Inc.

Abstract:

This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate....

01005 Assembly, the AOI route to optimizing yield

Published:

Jul 15, 2009

Author:

Vi TECHNOLOGY

Abstract:

The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines....

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies.

Published:

Jul 09, 2009

Author:

Steve Stach, Austin American Technology

Abstract:

Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuit...

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Published:

Jul 01, 2009

Author:

ZESTRON America

Abstract:

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome...

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Published:

Jul 01, 2009

Author:

ZESTRON America

Abstract:

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome...

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Published:

Jul 01, 2009

Author:

ZESTRON America

Abstract:

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increas...

A New Angle on Printing

Published:

Jun 25, 2009

Author:

Assembléon Americas

Abstract:

Although blade contact angle is a critical stencil printing parameter, screen printers have so far been unable to vary it ‘on-the-fly’, in software. The recently released Assembléon/Yamaha YGP printer has changed this, and has made new application re...

The Call for Halogen-Free Electronic Assemblies

Published:

Jun 17, 2009

Author:

AIM

Abstract:

The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and...

Shock Reliability of Lead-Free Alloys � Effect of Micro-Additives

Published:

Jun 11, 2009

Author:

Cookson Electronics

Abstract:

The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders....

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684 SMT / PCB Technical Articles. Show: per page.







 
 
 
 
 
 
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