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Technical Library articles |
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Security access design
Published: |
Jul 29, 2009 |
Author: |
Orchid Technologies Engineering and Consulting, Inc. |
Company: |
Orchid Technologies Engineering & Consulting, Inc.
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Abstract: |
Building Access and Security is critical to our nation's needs. Orchid's building access technology integrates precision automatic door motion control electronics with sophisticated communications technology to enable low-cost networked building ac... |
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Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications
Published: |
Jul 22, 2009 |
Author: |
Endicott Interconnect Technologies, Inc. |
Abstract: |
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate.... |
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01005 Assembly, the AOI route to optimizing yield
Published: |
Jul 15, 2009 |
Author: |
Vi TECHNOLOGY |
Abstract: |
The increasing demand for smaller & smaller portable
electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines.... |
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Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies.
Published: |
Jul 09, 2009 |
Author: |
Steve Stach, Austin American Technology |
Abstract: |
Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuit... |
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Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
Published: |
Jul 01, 2009 |
Author: |
ZESTRON America
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Abstract: |
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome... |
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Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
Published: |
Jul 01, 2009 |
Author: |
ZESTRON America
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Abstract: |
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome... |
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Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
Published: |
Jul 01, 2009 |
Author: |
ZESTRON America |
Abstract: |
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have
demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to
further increas... |
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A New Angle on Printing
Published: |
Jun 25, 2009 |
Author: |
Assembléon Americas |
Abstract: |
Although blade contact angle is a critical stencil printing parameter, screen printers have so far been unable to vary it ‘on-the-fly’, in software. The recently released Assembléon/Yamaha YGP printer has changed this, and has made new application re... |
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The Call for Halogen-Free Electronic Assemblies
Published: |
Jun 17, 2009 |
Author: |
AIM |
Abstract: |
The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and... |
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Shock Reliability of Lead-Free Alloys � Effect of Micro-Additives
Published: |
Jun 11, 2009 |
Author: |
Cookson Electronics |
Abstract: |
The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders.... |
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