Electronics Manufacturing Technical Articles

May 31, 2012

Markus Leitgeb, Christopher Michael Ryder

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such ...

May 23, 2012

YaJun Gu, Ye Qin, ZhiJun Wang, David Wei, Andrew Ho, Stephen Chen, Zhen (Jane) Feng Ph. D., Murad Kurwa

first published in the 2012 IPC APEX EXPO technical conference proceedings. BIST (build-in self test ) is the technique of designing additional hardware and software features into integrated circuits to allow them to perform self-testing, i.e., testing of...

May 17, 2012

Cathy Iler, Nikki Johnson, Peter Robinson

First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more...

May 10, 2012

Cherie Chen, Jeffrey ChangBing Lee, Graver Chang, Jandel Lin, Casa Hsieh, Jesse Liao, Jerry Huang

First published in the 2012 IPC APEX EXPO technical conference proceedings. Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In thi...

May 03, 2012

Anthony J. Suto

First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec...

Apr 26, 2012

Paul Reid

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva...

Apr 19, 2012

Michael Ford, Valor Division of Mentor Graphics Corp.

Presented at IPC Apex 2012. Working through the New Product Introduction (NPI) flow between product design and manufacturing is usually a challenging process, with both parties being experts in their own fields and inextricably linked in the flow of g...

Apr 12, 2012

Robert Dervaes, V.P. Technology

Surface mount technology (SMT) started in the 1960s and became more common in the 1980s. It is the dominant technology in use today. Through-hole technology is still in use, and will be for the foreseeable future, but the drive towards miniaturization of ...

Apr 09, 2012

FCT Assembly

As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasi...

Apr 05, 2012

L.G. Barajas, A. Kansal, A. Saxena, M. Egerstedt, A. Goldstein, E.W. Kamen

In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob...