Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Submit & read papers and articles related to SMT, PCB & EMS electronics manufacturing.


823 SMT / PCB Technical Articles

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Demystifying Multimedia Conferencing Over the Internet Using the H.323 Set of Standards

Published:

May 07, 1999

Author:

Intel Corporation

Abstract:

The Telecommunication Sector of the International Telecommunication Union (ITU-T) has developed a set of standards for multimedia conferencing over packet-based networks. ...

Publisher:

Proving the IEEE Correctness of Iterative Floating-Point Square Root, Divide, and Remainder Algorithms

Published:

May 07, 1999

Author:

Intel Corp.

Abstract:

The work presented in this paper was initiated as part of a study on software alternatives to the hardware implementations of floating-point operations such as divide and square root. ...

Publisher:

Computer Vision Face Tracking For Use in a Perceptual User Interface

Published:

May 07, 1999

Author:

Intel Corp.

Abstract:

As a first step towards a perceptual user interface, a computer vision color tracking algorithm is developed and applied towards tracking human faces. ...

Publisher:

An Overview of Advanced Failure Analysis Techniques for Pentium� and Pentium� Pro Microprocessors

Published:

May 07, 1999

Author:

Intel

Abstract:

This paper discusses the evolution of FA techniques from one generation of microprocessors to another. ...

Publisher:

EUV Lithography�The Successor to Optical Lithography?

Published:

May 07, 1999

Author:

John E. Bjorkholm, Intel Corp.

Abstract:

This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometers (nm) to......

Publisher:

MOS Scaling: Transistor Challenges for the 21st Century

Published:

May 07, 1999

Author:

Intel Corp.

Abstract:

To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed....

Publisher:

The Quality and Reliability of Intel's Quarter Micron Process

Published:

May 07, 1999

Author:

http://www.intel.com/technology/itj/q31998/articles/art_2.htm

Abstract:

This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained....

Publisher:

Intel's 0.25 Micron, 2.0Volts Logic Process Technology

Published:

May 07, 1999

Author:

Technology Development Group, Intel Corp.

Abstract:

Process 856 is a 0.25um-generation logic technology currently in volume manufacturing, which has been optimized for high performance, yield, and density. ...

Publisher:

Why Wide Fine Pitch Pads?

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. ...

Publisher:

Heraeus Solder Paste Profile Testing

Published:

May 07, 1999

Author:

Heraeus

Abstract:

This test utilizes an 8 mil laser cut stencil which is contact printed onto a 2 inch square coupon of copper foil that has been oxidized @ 150� C for 1 hour. ...

Publisher:

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