Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. ...
manufacturers of electronic assemblies have been investigating all means for reducing defect rates with the ultimate goal to achieve a significant cost savings and increase the overall reliability of electronic assemblies.
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Many manufacturers have now completed the conversion to no clean solderpaste. Many factors governed this initial conversion, among those being cosmetics, solderability, and processability....
The use of fine pitch devices, those components with 25 mil center to center lead spacing or less, is becoming a common occurrence in today's electronic assembly. Currently, two major problems may be encountered...
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The most effective passivating agents for protecting bare copper boards are the heterocyclic nitrogen compounds. These modified azole complexes have been found to be the most effective of these oxidation inhibitors for bare copper boards....
This data sheet supplement includes test methods used to generate information on the Kester RHEOMET data sheets along with comments on the validity and relevance of those test performed....