Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Submit & read papers and articles related to SMT, PCB & EMS electronics manufacturing.


828 SMT / PCB Technical Articles

per page

Solderpaste and Viscosity

Published:

May 07, 1999

Author:

Eric Slezak, Kester Solder Co.

Abstract:

Viscosity and solderpaste is one of the most mis-understood aspects of this new and very important part of ...

Publisher:

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

Published:

May 07, 1999

Author:

Kurt Rajewski

Abstract:

Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. ...

Publisher:

Kester

Kester

Itasca, Illinois, United States

categories: Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

  • Phone
  • Fax
  • Email

Soldering Electronic Assemblies

Published:

May 07, 1999

Author:

Dennis F. Bernier, Kester Solder

Abstract:

This paper discusses the basic principles of soldering and what controls are necessary to achieve high quality and productivity....

Publisher:

Solder Balls & Low Solids Fluxes

Published:

May 07, 1999

Author:

Kester Solder

Abstract:

What follows are some thoughts and comments on a few questions concerning solder balls. ...

Publisher:

SOLDERING TO GOLD OVER NICKEL SURFACES

Published:

May 07, 1999

Author:

Dennis Bernier, Kester Solder Company

Abstract:

There are many things that can go wrong when soldering to gold plate over nickel surfaces. ...

Publisher:

Semiconductor Component Lead Tinning and Solderability

Published:

May 07, 1999

Author:

Steve Santangelo, Kester Solder Co.

Abstract:

manufacturers of electronic assemblies have been investigating all means for reducing defect rates with the ultimate goal to achieve a significant cost savings and increase the overall reliability of electronic assemblies. ...

Publisher:

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

Published:

May 07, 1999

Author:

Merlin Kister, Kester Solder

Abstract:

Many manufacturers have now completed the conversion to no clean solderpaste. Many factors governed this initial conversion, among those being cosmetics, solderability, and processability....

Publisher:

Reliable Interconnection of Fine Pitch Devices Using Kester R-229-25 Solderpaste

Published:

May 07, 1999

Author:

Kester Solder

Abstract:

The use of fine pitch devices, those components with 25 mil center to center lead spacing or less, is becoming a common occurrence in today's electronic assembly. Currently, two major problems may be encountered... ...

Publisher:

A Reaction Mechanism and Process Application for Copper Protective Coatings

Published:

May 07, 1999

Author:

T.R. Gibbs, Kester Solder Division

Abstract:

The most effective passivating agents for protecting bare copper boards are the heterocyclic nitrogen compounds. These modified azole complexes have been found to be the most effective of these oxidation inhibitors for bare copper boards....

Publisher:

Solder Paste

Published:

May 07, 1999

Author:

Kester Solder

Abstract:

This data sheet supplement includes test methods used to generate information on the Kester RHEOMET data sheets along with comments on the validity and relevance of those test performed....

Publisher:

Articles per page:

automated test equipment for PCB test
NC-560-LF No clean Solder Paste
Now Online

510
Visitors

2
Members

Featured Companies
 

SMT Screen Printer with 3D solder paste inspection