Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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620 SMT / PCB Technical Articles

Conformal Coating Process Characterization Considerations

Sep 25, 2013 | Brad Perkins, Nordson ASYMTEK

Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

First Article – First Time

Sep 22, 2013 | Alexei Shkolnik

The PCB-assembly industry in constantly changing. Smaller footprints, new types of components and larger and more complex designs are accompanied by constant competitive pressures. As a result, electronics manufacturers need to continuously adapt their processes and make sure they exploit every opportunity for efficiency gains. This is the only way to improve quality and time to market and to increase profitability....

Publisher: Proventus Technologies

Proventus Technologies

Proventus has proven experience in creating software tools for the Electronic and Mechanic Manufacturing Industry in Israel and Canada.

Petah-Tikva, Israel

Software Manufacturer

Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any Layer Manufacturing Technologies.

Sep 19, 2013 | Gerhard Schmid, Martin Fischeneder, Gerhard Stoiber

The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation......

Publisher: AT&S

AT&S

AT&S is currently Europe’s largest printed circuit board manufacturer and one of the market leaders in high-end printed circuit board technology.

Leoben, Austria

Contract Manufacturer

Improving Product Reliability through HALT and HASS Testing

Sep 09, 2013 | Mark R. Chrusciel, Cincinnati Sub Zero

HALT & HASS technology uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages, which improves product reliability and customer confidence. HALT & HASS is used to uncover many of the weak links inherent to the design and fabrication process of a new product as well as during the production phase to find manufacturing defects that could cause product failures in the field....

Publisher: Cincinnati Sub-Zero Products, Inc.

Cincinnati Sub-Zero Products, Inc.

Cincinnati Sub-Zero (CSZ) offers a full range of standard and custom-designed Environmental Chambers providing our customers with solutions to meet their most demanding environmental testing requirements.

Cincinnati, Ohio, United States

Other, Test Services

Conformal Surface Plasmons Propagating on Ultrathin and Flexible Films

Sep 05, 2013 | Xiaopeng Shen,Tie Jun Cui,Diego Martin-Cano, Francisco J. Garcia-Vidal

Surface plasmon polaritons (SPPs) are localized surface electromagnetic waves that propagate along the interface between a metal and a dielectric. Owing to their inherent subwavelength confinement, SPPs have a strong potential to become building blocks of a type of photonic circuitry built up on 2D metal surfaces; however, SPPs are difficult to control on curved surfaces conformably and flexibly to produce advanced functional devices. Here we propose the concept of conformal surface plasmons (CSPs), surface plasmon waves that can propagate on ultrathin and flexible films to long distances in a wide broadband range from microwave to mid-infrared frequencies....

Publisher: Southeast University (SEU)

Southeast University (SEU)

Southeast University is one of only 32 universities directly administered by the Chinese Department of Education, which are considered the top class universities in China.

Nanjing, China

Training / Education

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Aug 29, 2013 | Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days... ...

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, United States

Manufacturer of Assembly Equipment

Whisker Growth In Tin Alloys On Glass-Epoxy Laminate Studied By Scanning ION Microscopy and Energy-Dispersive X-Ray Spectroscopy

Aug 22, 2013 | A. Czerwinski, A. Skwarek, M. Płuska, J. Ratajczak, K. Witek

Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn. In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth....

Publisher: The Institute of Electron Technology (ITE)

The Institute of Electron Technology (ITE)

A major Polish research centre with the primary focus on semiconductor micro- and nanotechnology.

Warsaw, Poland

Association, Non-Profit, Training / Education

A Printed Circuit Board Inspection System With Defect Classification Capability

Aug 15, 2013 | I. Ibrahim, S. Bakar, M. Mokji, J. Mukred, Z. Yusof, Z. Ibrahim, K. Khalil, M. Mohamad

An automated visual PCB inspection is an approach used to counter difficulties occurred in human’s manual inspection that can eliminates subjective aspects and then provides fast, quantitative, and dimensional assessments. In this study, referential approach has been implemented on template and defective PCB images to detect numerous defects on bare PCBs before etching process, since etching usually contributes most destructive defects found on PCBs. The PCB inspection system is then improved by incorporating a geometrical image registration, minimum thresholding technique and median filtering in order to solve alignment and uneven illumination problem. Finally, defect classification operation is employed in order to identify the source for six types of defects namely, missing hole, pin hole, underetch, short-circuit, mousebite, and open-circuit....

Publisher: Universiti Teknologi Malaysia

Universiti Teknologi Malaysia

The FKE was established in late 1974. Since 1st June 1995, the faculty commences operation at the main campus of the University in Skudai, Johor until today.

Johor, Malaysia

Training / Education

Crimp Force Monitoring – The Recipe for Success

Aug 13, 2013 | Gustavo Garcia-Cota, Crimping Product Manager, Schleuniger, Inc.

One of the common issues I’ve noticed when visiting shops that use crimp force monitors (CFMs) is that the CFMs are usually turned off, regardless of the brand, because engineers and operators are not using them properly. Why, with all of their benefits, are CFMs not being used regularly by employees? One of the biggest problems is the lack of understanding of the variables affecting the CFM’s ability to detect variations. Crimp quality detection is similar to baking a cake. There are a lot of ingredients and if one ingredient is missing or of bad quality, you likely are not going to achieve your desired result. This article will go back through the basics of a crimp quality detection system and discuss what ingredients or variables you need to consider before switching off that CFM. ...

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment

Automatic PCB Defect Detection Using Image Substraction Method

Aug 08, 2013 | Sonal Kaushik, Javed Ashraf

In this project Machine Vision PCB Inspection System is applied at the first step of manufacturing, i.e., the making of bare PCB. We first compare a PCB standard image with a PCB image, using a simple subtraction algorithm that can highlight the main problem-regions. We have also seen the effect of noise in a PCB image that at what level this method is suitable to detect the faulty image. Our focus is to detect defects on printed circuit boards & to see the effect of noise. Typical defects that can be detected are over etchings (opens), under-etchings (shorts), holes etc......

Publisher: Al-Falah School of Engineering and Technology

Al-Falah School of Engineering and Technology

AFSET, established in 1997, is endeavor of Al-Falah Charitable Trust in keeping with the approach for professional education training and guidance.

New Delhi, India

Training / Education

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