Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
624 SMT / PCB Technical Articles

Choosing the Right Valve for a Selective Robotic Conformal Coating Application Process

Oct 13, 2013 | Dr Lee Hitchens

When investigating the option of a selective conformal coating process it is crucial to consider the right robotic system and valve combination for the material and circuit board that you wish to coat. To fail to do this can lead to difficult process problems in the production line. This article reviews the various valves available and how they can be used with the typical conformal coating materials in the market and highlights some of the key considerations....

Publisher: SCH Technologies

SCH Technologies

SCH Technologies offers a range of conformal coating solutions including global subcontract conformal coating and parylene services, equipment & systems,conformal coatings, consultancy & training.

Barnsley, United Kingdom

Adhesives/Dispensing, Turnkey, Consultant, Distributor, Manufacturer's Rep

The Importance of Viscosity in Conformal Coating Process Control

Oct 13, 2013 | Dr Lee Hitchens

There are numerous factors which directly affect the conformal coating process to greater or lesser degrees. Those which have major impacts irrespective of the substrate / PCB and assemblies include choice of coating material and method of application. Whether conformal coating boards by dip, robot, batch spray or brush methods the viscosity of the coating is a critical factor in the overall process control....

Publisher: SCH Technologies

SCH Technologies

SCH Technologies offers a range of conformal coating solutions including global subcontract conformal coating and parylene services, equipment & systems,conformal coatings, consultancy & training.

Barnsley, United Kingdom

Adhesives/Dispensing, Turnkey, Consultant, Distributor, Manufacturer's Rep

Printed Circuit Board Technology Inspired Stretchable Circuits

Oct 10, 2013 | J. Vanfl eteren , M. Gonzalez , F. Bossuyt , Y.-Y. Hsu , T. Vervust , I. De Wolf , and M. Jablonski

In the past 15 years, stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections, and sensor circuit technologies. In the meantime, a wide variety of processes using many different materials have been explored in this new field. In the current contribution, we present an approach inspired by conventional rigid and flexible printed circuit board (PCB) technology....

Publisher: Centre for Microsystems Technology - Ghent University

Centre for Microsystems Technology - Ghent University

The CMST focuses on smart microsystems integration.

Gent-Zwijnaarde, Belgium

Training / Education

Pyrolysis of Printed Circuit Boards

Oct 03, 2013 | T. R. Mankhand, K. K. Singh, Sumit Kumar Gupta, Somnath Das

Printed Circuit Board (PCB) is an essential component of almost all electrical and electronic equipments. The rapid growth of the use of such equipments has contributed enormously to the generation of large quantity of waste PCBs. The WPCBs not only contain valuable metals but also a large variety of hazardous materials. Conventional treatments of such WPCBs have their own limitations. By pyrolysis of WPCBs, it is not only possible to obtain the organic part of it as a fuel or useful chemical but can make further processing to recover metals much easier and efficient. In the present work, a kinetic study on the low temperature pyrolysis of WPCBs using a thermogravimetric analyser has been attempted......

Publisher: Indian Institute of Technology ( Banaras Hindu University )

Indian Institute of Technology ( Banaras Hindu University )

A public engineering institution founded in 1919 as part of the Banaras Hindu University. It was designated an Indian Institute of Technology in 2012. IIT (BHU) has 13 departments and three inter-dis

Varanasi, India

Training / Education

Conformal Coating Process Characterization Considerations

Sep 25, 2013 | Brad Perkins, Nordson ASYMTEK

Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment....

Publisher: Nordson ASYMTEK

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

First Article – First Time

Sep 22, 2013 | Alexei Shkolnik

The PCB-assembly industry in constantly changing. Smaller footprints, new types of components and larger and more complex designs are accompanied by constant competitive pressures. As a result, electronics manufacturers need to continuously adapt their processes and make sure they exploit every opportunity for efficiency gains. This is the only way to improve quality and time to market and to increase profitability....

Publisher: Proventus Technologies

Proventus Technologies

Proventus has proven experience in creating software tools for the Electronic and Mechanic Manufacturing Industry in Israel and Canada.

Petah-Tikva, Israel

Software Manufacturer

Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any Layer Manufacturing Technologies.

Sep 19, 2013 | Gerhard Schmid, Martin Fischeneder, Gerhard Stoiber

The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation......

Publisher: AT&S

AT&S

AT&S is currently Europe’s largest printed circuit board manufacturer and one of the market leaders in high-end printed circuit board technology.

Leoben, Austria

Contract Manufacturer

Improving Product Reliability through HALT and HASS Testing

Sep 09, 2013 | Mark R. Chrusciel, Cincinnati Sub Zero

HALT & HASS technology uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages, which improves product reliability and customer confidence. HALT & HASS is used to uncover many of the weak links inherent to the design and fabrication process of a new product as well as during the production phase to find manufacturing defects that could cause product failures in the field....

Publisher: Cincinnati Sub-Zero Products, Inc.

Cincinnati Sub-Zero Products, Inc.

Cincinnati Sub-Zero (CSZ) offers a full range of standard and custom-designed Environmental Chambers providing our customers with solutions to meet their most demanding environmental testing requirements.

Cincinnati, Ohio, United States

Other, Test Services

Conformal Surface Plasmons Propagating on Ultrathin and Flexible Films

Sep 05, 2013 | Xiaopeng Shen,Tie Jun Cui,Diego Martin-Cano, Francisco J. Garcia-Vidal

Surface plasmon polaritons (SPPs) are localized surface electromagnetic waves that propagate along the interface between a metal and a dielectric. Owing to their inherent subwavelength confinement, SPPs have a strong potential to become building blocks of a type of photonic circuitry built up on 2D metal surfaces; however, SPPs are difficult to control on curved surfaces conformably and flexibly to produce advanced functional devices. Here we propose the concept of conformal surface plasmons (CSPs), surface plasmon waves that can propagate on ultrathin and flexible films to long distances in a wide broadband range from microwave to mid-infrared frequencies....

Publisher: Southeast University (SEU)

Southeast University (SEU)

Southeast University is one of only 32 universities directly administered by the Chinese Department of Education, which are considered the top class universities in China.

Nanjing, China

Training / Education

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Aug 29, 2013 | Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days... ...

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, United States

Manufacturer of Assembly Equipment

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