Jun 11, 2015 | B. Gumpert
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.
Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements...
Publisher: Lockheed Martin Corporation
Jun 04, 2015 | David Pinsky, Elizabeth Lambert
Integrators and designers of high-reliability systems exert little or no control over component-level plating processes that affect the propensity for tin whiskering. Challenges of how to assure long-term reliability, while continuing to use COTS parts plated with pure tin, continue to arise.
An integrated, quantitative, standardized methodology is proposed whereby mitigation levels can be selected that are appropriate for specific applications of pure tin for given end-uses. A system of hardware end-use classification is proposed, together with recommended appropriate risk mitigation approaches. An updated version of the application-specific risk assessment algorithm is presented together with recommended thresholds for acceptability within the context of the hardware classifications....
May 28, 2015 | Brent Fischthal, Sr. Marketing Manager, Products & Solutions Michael Cieslinski, Engineering Manager Panasonic Factory Solutions Company of America.
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization.
This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow....
PFSA develops and supports innovative manufacturing automation equipment, processes and solutions around the core of electronic assembly, microelectronic, software and circuit manufacturing
Rolling Meadows, Illinois, USA
May 27, 2015 | Rob Boyd, Senior Product Manager, Schleuniger. Inc.
It goes without saying that manufacturing companies want the highest possible quality at the lowest possible cost. These days, everyone is trying to do more with less in order to stay relevant in a competitive environment....
Publisher: Schleuniger, Inc.
May 21, 2015 | Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers....
The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.
College Park, Maryland, USA
May 14, 2015 | Hardeep Heer, Ryan Wong
The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via....
Publisher: Firan Technology Group
May 11, 2015 | Peter van den Eijnden, MD JTAG Technologies.
Originating from the last millenium, almost three decades ago, the introduction of surface mount packaging triggered a wave of changes throughout many aspects of electronics production. A small number of talented, innovative test engineers from various big players of the industry started to attend meetings to discuss the impact of that change of technology on their future test concepts for modern assemblies. The Joint Test Action Group was born....
Publisher: JTAG Technologies B. V.
Apr 30, 2015 | Elaine Liew, Mitsui Copper Foil Malaysia, Shah Alam Malaysia Taka-aki Okubo, Toshio Sudo, Shibaura Institute of Technology, Tokyo Japan Toshihiro Hosoi, Hiroaki Tsuyoshi, Fujio Kuwako, Mitsui Kinzoku Co., Ltd, Japan.
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated....
Publisher: Mitsui Kinzoku Group
Apr 29, 2015 | Dr. Subodh Kulkarni
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects....
Publisher: CyberOptics Corporation
Apr 29, 2015 | Sean Langbridge
Statistical Appearance Modelling technology enables an AOI system to “learn real world variation” based on operator interaction with inspection task results. This provides an accurate statistical description of normal variation in a product. With modelling technology, the user does not have to anticipate potential defects as the system will “flag” anything outside the “normal production range”. And, since the system is programmed with real production variation, it is sensitive to small subtle changes enabling reliable defect detection. Autonomous prediction of process variation enables an AOI system to be set up from a single PCB with production-ready performance. Setup time can be < 15 minutes from data input to first PCB inspection making it an ideal solution for NPI and first-off verification....
Publisher: CyberOptics Corporation