Aug 05, 1999 | Dwight Miller (Sandia National Laboratories)
This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity....
Aug 05, 1999 | Deborah Franke
This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report....
Aug 05, 1999 | Goodall, Randy
In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards....
Aug 05, 1999 | Alexander, Robert
This document defines a set of standard test structures with which to benchmark the electrostatic discharge (ESD) robustness of CMOS technologies. The test structures are intended to be used to evaluate the elements of an integrated circuit in the high current and voltage ranges characteristic of ESD events. Test structures are given for resistors, diodes, MOS devices, interconnects, silicon control rectifiers, and parasitic devices. The document explains the implementation strategy and the method of tabulating ESD robustness for various technologies....
Aug 05, 1999 | Barpoulis, Dino
This document is an update to the 1994 Quality and Reliability Roadmap issued in support of the 1994 National Technology Roadmap for Semiconductors. This report revisits the challenges, constraints, priorities, and research needs pertaining to quality and reliability issues. It also provides key project proposals that must be implemented to address concerns about reliability attainment and defect learning. An expanded section on test-to-test, diagnostics, and failure analysis; an edited version of the Product Analysis Forum Roadmap; and an appendix containing a draft report highlighting reliability issues is included....
Aug 05, 1999 | Mark Stephens, Dennis Johnson, John Soward, Jim Ammenheuser
This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment......
Aug 05, 1999 | Steven A. Eastman
This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument....
Aug 05, 1999 | Victoria J. Pruett, SEMI/SEMATECH; Julian Serda, Advanced Micro Devices; Darin Shifley, Applied Materials, Inc.
This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on installing, operating, controlling, and integrating process equipment....
Aug 05, 1999 | John R. Miller, JME, Inc. & David A. Evans, Evans Company
Test data was recently presented for a hybrid electrolytic/ electrochemical capacitor having sintered tantalum anodes and RuO2 cathodes. A 50-V, 18-mF capacitor of this design had electrical performance that was comparable to an advanced aluminum electrolytic capacitor but with only one-tenth the volume and just one-half the mass...
Publisher: Evans Findings
Evans is the world's largest producer of deep drawn tantalum parts. Evans produces precision high volume drawn shells, metal stampings, eyelets and ferrules. Capabilities include In-House Engineering, Tool Design and Construction.
East Providence, Rhode Island, USA
Jul 21, 1999 | Barry Ritchie, Jamie Serensen
Thermal management is a growing challenge in the electronics industry. As the overall size of electronic devices grows smaller, the enclosed electronic assemblies operate at higher frequencies and generate more heat....
Publisher: Henkel Electronic Materials
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Irvine, California, USA