Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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723 SMT / PCB Technical Articles

Why Wide Fine Pitch Pads?

May 07, 1999 | Rick Lathrop, Heraeus SMT Technical Services

Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. In fact it seems that the finer the pitch the more difficult or narrower the process window becomes. Besides the pitch of the leads being less on fine pitch devices narrower pad width on the board is typical. With fine pitch designs the board fabrication process is also stressed in that the strip of mask between the pads is designed narrower, the alignment of the mask to copper becomes more critical...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer of Assembly Material, Soldering

Stereolithography and Simultaneous Engineering Speed Products to Market

May 07, 1999 | AMP Incorporated

Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?...

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer of Components

Solder Volumes for Through-Hole Reflow-Compatible Connectors

May 06, 1999 | AMP Incorporated

The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ...

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer of Components

Keeping Tin Solderable

May 06, 1999 | AMP Incorporated

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself......

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer of Components

Specifying Current for the Real World

May 06, 1999 | TE Connectivity

To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating. ...

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer of Components

Manufacturing Operations System Design and Analysis

May 06, 1999 | C. Hilton, Manufacturing Strategic Support, Technology and Manufacturing Engineering, Intel Corp.

This paper describes manufacturing operations design and analysis at Intel. The complexities and forces of both the market and the manufacturing process combine to make the development of improved semiconductor fabrication manufacturing strategies (like lot dispatching, micro and macro scheduling policies, labor utilization, layout, etc.) particularly important......

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

The Evolution of Intel's Copy EXACTLY! Technology Transfer Method

May 06, 1999 | Chris J. McDonald , Intel SEMATECH

Semiconductor manufacturing is characterized by very complex process flows made up of individual process steps, many of which are built to very close tolerances. Furthermore, there are complex interactions in these process flows, whereby each process step can affect many other steps, and each final device parameter might be determined by the results from many inputs......

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

21st Century Semiconductor Manufacturing Capabilities

May 06, 1999 | Eugene S. Meieran, Intel Corp.

Semiconductor device manufacturers face many difficult challenges as we enter the 21st century. Some are direct consequences of adherence to Gordon Moore's Law, which states that device complexity doubles about every 18 months. Feature size reduction, increased wafer diameter, increased chip size, ultra-clean processing, and defect reduction among others are manifestations that have a direct bearing on the cost and quality of products, factory flexibility in responding to changing technology or business conditions, and on the timelines of product delivery to the ultimate customer....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

Defect-Based Test: A Key Enabler for Successful Migration to structural test

May 06, 1999 | Sanjay Sengupta, Sandip Kundu, Sreejit Chakravart, Praveen Parvathal, Rajesh Galivanche, George Kosonocky, Mike Rodgers, TM Mak; MPG Test Technology, Intel Corp.

ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

Challenges of CAD Development for Datapath Design

May 06, 1999 | Tim Chan, Amit Chowdhary, Bharat Krishna, Artour Levin, Gary Meeker, Naresh Sehga

In many high-performance VLSI designs, including all recent Intel microprocessors, datapath is implemented in a bit-sliced structure to simultaneously manipulate multiple bits of data. The circuit and layout of such structures are largely kept the same for each bit slice to achieve maximal performance, higher designer productivity, and better layout density. There are very few tools available to automate the design of a general datapath structure, most of which is done manually......

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

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