Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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  • PCB X-ray inspection
  • Aegis Industrial Software
  • PCB X-Ray Inspection
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  • high speed SMT pick and place - Mirae Mx400
696 SMT / PCB Technical Articles

Optimizing the Wave Soldering Process with Hot Nitrogen Knives

Apr 29, 1999 | Chrys Shea, Siemens, & Gary Shipe, Air Products

The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, United States

Manufacturer of Assembly Equipment

VOC-Free Wave Solder Flux Evaluation

Apr 26, 1999 | Chrys Shea, Siemens ICN

The goal of the flux evaluation was to identify one product that would meet the needs of all SICN's wave solder products and processes while producing high quality assemblies. At the outset of the evaluation, it was unclear whether a single flux chemistry could satisfy such a broad range of demands, particularly because SICN's utilization of less aggressive, low-impact chemicals....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, United States

Manufacturer of Assembly Equipment

The Characterization and Comparison of Spray Fluxers

Apr 26, 1999 | Chrys Shea & Tom Chinnici, Siemens Business Communication Systems, Inc., Originally published at Nepcon West '98

An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, United States

Manufacturer of Assembly Equipment

Intel Packaging Databook

Apr 15, 1999 | Intel Corporation

Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. IC assembly, performance characteristics, physical constants, detailed discussions of SMT, etc....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, United States

Manufacturer of Components

An Introduction to Solder Materials

Apr 15, 1999 | Brian Bauer, Rick Lathrop

Solder paste is a seemingly simple material that forms one of the foundations of the surface mount assembly operation. If the solder paste does not do its job correctly then first pass yield will be severely reduced. ...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, United States

Manufacturer of Assembly Material, Soldering

Speed Printing of SMT Adhesives

Apr 15, 1999 | Richard R. Lathrop Jr., Heraeus

High-speed printing techniques are revealed that break the speed barrier resulting from air entrapment in large apertures at fast squeegee speeds. Adhesive printability test results using conventional thickness stencils to achieve a significant range of d...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, United States

Manufacturer of Assembly Material, Soldering

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PCB Depaneling Systems

SMT Screen Printer with 3D solder paste inspection