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Technical Library articles |
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Ultra Fine Pitch Wire Bonds Applications for the Future
Published: |
May 05, 1999 |
Author: |
Mark J. Kuzawinski, IBM Microelectronics, Endicott, New York |
Abstract: |
This paper will explore the relationship between new silicon technologies and the requirements for advanced, fine pitch packaging. IBM's ultra fine pitch PBGA substrate will be shown as one example of how the industry requirements for very dense ...... |
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Wirebonding PBGA Manufacturing Challenges From Fine to Ultrafine Pitch
Published: |
May 05, 1999 |
Author: |
Sylvain Ouimet, Jean-Guy Quintal and Guy Robichaud, IBM Corporation, Bromont, Canada |
Abstract: |
In the past few years, pressures to reduce cost and increase the number of I/O's have brought the Packaging Industry into focus. The dominant packaging technique is wirebonding, but is presently being challenged by Flip Chip connections between ...... |
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The IBM 6x86 microprocessor databook
Published: |
May 05, 1999 |
Author: |
IBM |
Abstract: |
The databook provides all of the technical data you need to design with the IBM 6x86� microprocessor including timing diagrams, pinouts, power requirements, and more.... |
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Semiconductor Contract Manufacturing Services Technical Summaries
Published: |
May 05, 1999 |
Author: |
IBM |
Abstract: |
Technical summaries from IBM in PDF format.... |
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Optimizing the Wave Soldering Process with Hot Nitrogen Knives
Published: |
Apr 29, 1999 |
Author: |
Chrys Shea, Siemens, & Gary Shipe, Air Products |
Abstract: |
The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests. Originally p... |
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VOC-Free Wave Solder FLux Evaluation
Published: |
Apr 26, 1999 |
Author: |
Chrys Shea, Siemens ICN |
Abstract: |
Documents the flux qualification process used in Sept, 1998 to identify new fluxes for hard-to-solder boards.No fancy stuff like in-house SIR tests, just the basics - does it solder? does it make solder balls? and which flux was the best?... |
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The Characterization and Comparison of Spray Fluxers
Published: |
Apr 26, 1999 |
Author: |
Chrys Shea & Tom Chinnici, Siemens Business Communication Systems, Inc., Originally published at Nepcon West '98 |
Abstract: |
An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results.... |
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Intel Packaging Databook
Published: |
Apr 15, 1999 |
Author: |
Intel Corporation |
Abstract: |
Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. IC assembly, performance characteristics, physical constants, detailed discussions of SMT, et... |
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A common sense guide for understanding placement rate
Published: |
Apr 15, 1999 |
Author: |
Contact Systems |
Abstract: |
This article will give useful advice on how to determine a machine's realistic placement rate. And it will show that in the real world, some machines perform closer to their advertised rates than others.... |
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An Introduction to Solder Materials
Published: |
Apr 15, 1999 |
Author: |
By Brian Bauer and Rick Lathrop, Haraeus |
Abstract: |
Solder paste is a seemingly simple material that forms one of the foundations of the surface mount assembly operation. If the solder paste does not do its job correctly then first pass yield will be severely reduced. ... |
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