Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ......

Ball grid arrays (BGAs) are emerging as the package of choice for high pin count, high clock frequency integrated circuits and high density printed wiring boards. The electrical, thermal, and mechanical characteristics of this package give ......

Multi-Chip Modules on Laminate (MCM-L) are the fastest growing component of the overall MCM market with over 16 million units being produced world wide in 1997. MCM-Ls are projected to comprise almost 70% of all MCMs produced by 2001. ...

As MPU performance increases the need for higher speed both on and off chip, more I/O, greater I/O density, higher power and better power distribution flip chip packaging of MPU's is becoming the standard....

This paper will define the factors in the MicroBGA design and the PWB design that would require an SLC solution. Recognition of this need early in the development cycle can improve the cycle time for a satisfactory design and allow the product ......

This presentation will cover the testing history of a 1S0P 60m wire bond cavity substrate with a 1 mm 672 count BGA pitch. We are qualifying both a 60m in-line and a 60m stagger die pad arrangement. ...

This paper will review the development of Flip Chip Packaging (Ceramic and Plastic), highlighting key challenges, difficulties, and accomplishments. Topics will include a discussion of technical advances in Flip Chip packaging, a status on where ......

Adhesion of encapsulants to soldermasks can be improved by altering the surface topography of the soldermask as well as its surface chemistry by aggressive plasma etching....

A plastic ball grid array is being developed that will support the industry requirement of 60 mm off-die effective pitch. This is a PDF file which requires the Adobe Acrobat Reader....

Chip packaging technology has significantly evolved over the past several decades to meet demands for higher I/O, I/O density, and power dissipation. The foremost cause for this growth has been the need to keep pace with ever increasing levels of ......