The present problem with cooling microprocessors is a relatively new issue -- about 4 years old. It stems from the collision of two conflicting trends -- end-user desire for more powerful microprocessors to run the next generation software, and......

The market's demand for increasingly powerful products, in smaller and smaller packaging, creates a cooling problem. Integrated circuit (IC) lifetime is dependent upon its operating temperature, creating a trade-off situation: either you enlarge... ...

Various cooling methods are available for keeping electronic devices within their operating temperature specifications. ...

Today's competitive environment has created many challenges in the packaging of electronic designs. Advancements in electronics packaging now require the design engineer to optimize the electrical, mechanical, and thermal performance of the system.....

The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat......

As microprocessor speeds increase, their power needs rise proportionally. This also puts higher demands on the voltage regulator that feeds the processor chip. In spite of the increased power, the regulator chip tends to remain the same size.....

Computational fluid dynamics software can help you solve system-level thermal packaging problems. ...

Computational fluid dynamics software can help you solve system-level thermal packaging problems. ...

Many of us tend to think of semiconductors as low power, cool devices. But as the number of transistors in an integrated circuit increases, so does power consumption increases and the need to dissipate the resulting heat load. Microprocessors......

-------------------------------------------------------------------------------- AUGMENTED-FIN AIR-COOLED HEAT SINKS ACHIEVE HIGHER PERFORMANCE WITHOUT SIGNIFICANT RISE IN STATIC PRESSURE DROP ...