Beginning in 1993 a small group of people at Intel began thinking seriously about a transition from 200mm manufacturing to the next wafer size. By early 1994, the industry reached consensus that the right size was 300mm. ...

This paper describes manufacturing operations design and analysis at Intel. ...

Semiconductor manufacturing is characterized by very complex process flows made up of individual process steps, many of which are built to very close tolerances. ...

Semiconductor device manufacturers face many difficult challenges as we enter the 21st century. Some are direct consequences of adherence to Gordon Moore's Law, which states that device complexity doubles about every 18 months. ...

Intel's traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing......

This paper describes the formal specification and verification of floating-point arithmetic hardware at the level of IEEE Standard 754. Floating-point correctness is a crucial problem: the functionality of Intel's floating-point hardware is....

With the advent of low-price, high-performance Intel� architecture workstations together with Microsoft* Windows NT* operating systems (referred to as IA-NT from here on) that support Microsoft productivity tools, the IA-NT workstation has become......

In many high-performance VLSI designs, including all recent Intel� microprocessors, datapath is implemented in a bit-sliced structure to simultaneously manipulate multiple bits of data. ...

Circuit design in deep sub-micron technologies requires that designers deal with numerous data, constraints, analysis, synthesis, and optimization tools. Although synthesis tools are widely used at Intel, new circuit technologies are evolving......

This paper shows how software architecture and data modeling techniques are used as core attributes of a CAD tool suite. ...