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Technical Library articles |
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Solder Volumes for Through-Hole Reflow-Compatible Connectors
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ... |
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Keeping Tin Solderable
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. ... |
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Eliminating Tin Whiskers -
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
Conventional wisdom says that tin plating should contain lead to prevent whiskering. ... |
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Specifying Current for the Real World
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
Practical current-carrying capacity is not an absolute, but an application-dependent condition.
... |
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Centro-Symmetric Reflective Optics
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
Centro-symmetrical reflective (CSR) optics is a flexible techonology for making a variety of devices for controlling the path of light in a fiber-optic network. ... |
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Introduction to Fiber Optic Networking
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
This document is presented as seven linked pages of varying lengths. ... |
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A Brief Overview of Reliability
Published: |
May 06, 1999 |
Author: |
AMP Incorporated |
Abstract: |
This paper briefly examines reliability in general and as it relates to connectors. ... |
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Digital Systems Design Checklist
Published: |
May 06, 1999 |
Author: |
Scott Schaeffer, AMP Incorporated |
Abstract: |
This paper defines a framework for a digital design checklist. The intention is to provide a starting point that the designer can add to and modify. ... |
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Line Defect Control to Maximize Yields
Published: |
May 06, 1999 |
Author: |
CTM/D2, Intel Corporation |
Abstract: |
This paper discusses line defect control through the use of defect monitors in semiconductor manufacturing. ... |
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Improving Throughput Across the Factory Life-Cycle
Published: |
May 06, 1999 |
Author: |
Karl G. Kempf, TMG/TME Decision Support Technology, Intel Corp. |
Abstract: |
A semiconductor factory goes through many phases in its life cycle including design, build, various ramps, and many levels of production. Maximizing the profitability and return on investment across this life-cycle is a critical component...... |
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