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684 SMT / PCB Technical Articles. Show: per page.

Technical Library articles

Solder Volumes for Through-Hole Reflow-Compatible Connectors

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ...

Keeping Tin Solderable

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. ...

Eliminating Tin Whiskers -

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

Conventional wisdom says that tin plating should contain lead to prevent whiskering. ...

Specifying Current for the Real World

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

Practical current-carrying capacity is not an absolute, but an application-dependent condition. ...

Centro-Symmetric Reflective Optics

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

Centro-symmetrical reflective (CSR) optics is a flexible techonology for making a variety of devices for controlling the path of light in a fiber-optic network. ...

Introduction to Fiber Optic Networking

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

This document is presented as seven linked pages of varying lengths. ...

A Brief Overview of Reliability

Published:

May 06, 1999

Author:

AMP Incorporated

Abstract:

This paper briefly examines reliability in general and as it relates to connectors. ...

Digital Systems Design Checklist

Published:

May 06, 1999

Author:

Scott Schaeffer, AMP Incorporated

Abstract:

This paper defines a framework for a digital design checklist. The intention is to provide a starting point that the designer can add to and modify. ...

Line Defect Control to Maximize Yields

Published:

May 06, 1999

Author:

CTM/D2, Intel Corporation

Abstract:

This paper discusses line defect control through the use of defect monitors in semiconductor manufacturing. ...

Improving Throughput Across the Factory Life-Cycle

Published:

May 06, 1999

Author:

Karl G. Kempf, TMG/TME Decision Support Technology, Intel Corp.

Abstract:

A semiconductor factory goes through many phases in its life cycle including design, build, various ramps, and many levels of production. Maximizing the profitability and return on investment across this life-cycle is a critical component......

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684 SMT / PCB Technical Articles. Show: per page.







 
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