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| Library articles: All : Showing listings 591 through 600 out of 639 |
Reliability Evaluation of Fine Pitch Wire Bond PBGAs
Section: Papers and Articles
Credit/Source: Thomas R. Homa, IBM Corporation, Endicott, N.Y.
Added by: Mike 
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Flip Chip Packaging for the Year 2000
Section: Papers and Articles
Credit/Source: Ronald Kuracina, IBM Microelectronics, Endicott, New York
Added by: Mike
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Plasma Texturing of Soldermask Surfaces for PBGA Packaging
Section: Papers and Articles
Credit/Source: Ed Fey, Frank Egitto, Dave Questad, Son Tran, IBM Microelectronics, Endicott, N.Y.
Added by: Mike
|
Ultra Fine Pitch Wire Bond PBGAs
Section: Papers and Articles
Credit/Source: Mark J. Kuzawinski and Kim J. Blackwell, IBM Corporation, Endicott, N.Y.
Added by: Mike
|
Application Realities of Chip Scale Packaging
Section: Papers and Articles
Credit/Source: IBM Microelectronics
Added by: Mike
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Ultra Fine Pitch Wire Bonds Applications for the Future
Section: Papers and Articles
Credit/Source: Mark J. Kuzawinski, IBM Microelectronics, Endicott, New York
Added by: Mike
|
Wirebonding PBGA Manufacturing Challenges From Fine to Ultrafine Pitch
Section: Papers and Articles
Credit/Source: Sylvain Ouimet, Jean-Guy Quintal and Guy Robichaud, IBM Corporation, Bromont, Canada
Added by: Mike
|
The IBM 6x86 microprocessor databook
Section: Papers and Articles
Credit/Source: IBM
Added by: Mike
|
Semiconductor Contract Manufacturing Services Technical Summaries
Section: Papers and Articles
Credit/Source: IBM
Added by: Mike
|
Optimizing the Wave Soldering Process with Hot Nitrogen Knives
Section: Papers and Articles
Credit/Source: Chrys Shea, Siemens, & Gary Shipe, Air Products
Added by: Chrys
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