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684 SMT / PCB Technical Articles. Show: per page.

Technical Library articles

THE IMPORTANCE OF HALIDES IN NO-CLEAN SOLDER PASTES

Published:

May 07, 1999

Author:

Heraeus Inc., Cermalloy Division

Abstract:

This article explores the history of bromine exclusion in solder fluxes, presents theories about the benefits that bromine can give to flux activity, and describes the development work at Heraeus which led to a high reliability, good wetting... ...

Printing of SMT-Adhesives Technical Bulletin

Published:

May 07, 1999

Author:

Heraeus

Abstract:

SMT adhesives are applied on PCB�s by dispensing (90 % of all manufacturers use this technique at the moment), printing and pin-transfer techniques...

Quantifying the Printability of SMT Adhesives

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Several application methods of printing SMT attachment adhesives are discussed...

THE EVOLUTION OF THICK FILM

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Thick Film materials are evolving into passive elements of integrated components. The technology is producing less expensive, smaller, higher density, more reliable and better performing circuits and networks....

No Clean Solder Paste Benchmarking from a Materials Suppliers Viewpoint

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Performance tradeoffs are revealed and discussed in quest of the ultimate no clean solder paste ...

Solving Problems Associated with Secondary Fixing Requirements

Published:

May 07, 1999

Author:

AMP Incorporated

Abstract:

Intensified global competition underscores the need to bring domestic safety and performance requirements in line with international standards. ...

Increase FDDI Reliability with Bypass Switches

Published:

May 07, 1999

Author:

AMP Incorporated

Abstract:

An FDDI bypass switch placed at strategic locations in the ring allows only the device at fault to be removed from the network. As a result, the integrity of the ring is preserved. ...

Laser Polishing of Nickel Underplating

Published:

May 07, 1999

Author:

AMP Incorporated

Abstract:

The surface topography affects its mating friction, corrosion resistance, the amount of precious metal required during plating, and its electrical properties. ...

New Heating Method Yields Better Solder Joints

Published:

May 07, 1999

Author:

AMP Incorporated

Abstract:

A new soldering technology provides constant temperatures even when thermal loads and application time vary. This means that one variable of the process is brought under very tight control. ...

Stereolithography and Simultaneous Engineering Speed Products to Market

Published:

May 07, 1999

Author:

AMP Incorporated

Abstract:

By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. ...

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684 SMT / PCB Technical Articles. Show: per page.







 
 
 
 
 
 
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