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684 SMT / PCB Technical Articles. Show: per page.

Technical Library articles

Computer Vision Face Tracking For Use in a Perceptual User Interface

Published:

May 07, 1999

Author:

Intel Corp.

Abstract:

As a first step towards a perceptual user interface, a computer vision color tracking algorithm is developed and applied towards tracking human faces. ...

An Overview of Advanced Failure Analysis Techniques for Pentium� and Pentium� Pro Microprocessors

Published:

May 07, 1999

Author:

Intel

Abstract:

This paper discusses the evolution of FA techniques from one generation of microprocessors to another. ...

EUV Lithography�The Successor to Optical Lithography?

Published:

May 07, 1999

Author:

John E. Bjorkholm, Intel Corp.

Abstract:

This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometers (nm) to......

MOS Scaling: Transistor Challenges for the 21st Century

Published:

May 07, 1999

Author:

Intel Corp.

Abstract:

To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed....

The Quality and Reliability of Intel's Quarter Micron Process

Published:

May 07, 1999

Author:

http://www.intel.com/technology/itj/q31998/articles/art_2.htm

Abstract:

This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained....

Intel's 0.25 Micron, 2.0Volts Logic Process Technology

Published:

May 07, 1999

Author:

Technology Development Group, Intel Corp.

Abstract:

Process 856 is a 0.25um-generation logic technology currently in volume manufacturing, which has been optimized for high performance, yield, and density. ...

Why Wide Fine Pitch Pads?

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. ...

Heraeus Solder Paste Profile Testing

Published:

May 07, 1999

Author:

Heraeus

Abstract:

This test utilizes an 8 mil laser cut stencil which is contact printed onto a 2 inch square coupon of copper foil that has been oxidized @ 150� C for 1 hour. ...

Power Considerations in Small Geometry Thick Film Resistors

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Small geometry resistors must be used where hybrid circuits try to compete in new, high density design applications. ...

SUCCESS WITH TODAY'S NO CLEAN SOLDER PASTES

Published:

May 07, 1999

Author:

Heraeus

Abstract:

Today's no-clean solder pastes offer many advantages that were not possible with products from the early days of no-clean. These new pastes open the process window and allow users to gain the advantages of no-clean, while minimizing headaches. ...

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684 SMT / PCB Technical Articles. Show: per page.







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