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Technical Library articles |
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Computer Vision Face Tracking For Use in a Perceptual User Interface
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
As a first step towards a perceptual user interface, a computer vision color tracking algorithm is developed and applied towards tracking human faces. ... |
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An Overview of Advanced Failure Analysis Techniques for Pentium� and Pentium� Pro Microprocessors
Published: |
May 07, 1999 |
Author: |
Intel |
Abstract: |
This paper discusses the evolution of FA techniques from one generation of microprocessors to another.
... |
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EUV Lithography�The Successor to Optical Lithography?
Published: |
May 07, 1999 |
Author: |
John E. Bjorkholm, Intel Corp. |
Abstract: |
This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometers (nm) to...... |
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MOS Scaling: Transistor Challenges for the 21st Century
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.... |
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The Quality and Reliability of Intel's Quarter Micron Process
Published: |
May 07, 1999 |
Author: |
http://www.intel.com/technology/itj/q31998/articles/art_2.htm |
Abstract: |
This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained.... |
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Intel's 0.25 Micron, 2.0Volts Logic Process Technology
Published: |
May 07, 1999 |
Author: |
Technology Development Group, Intel Corp. |
Abstract: |
Process 856 is a 0.25um-generation logic technology currently in volume manufacturing, which has been optimized for high performance, yield, and density. ... |
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Why Wide Fine Pitch Pads?
Published: |
May 07, 1999 |
Author: |
Heraeus |
Abstract: |
Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. ... |
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Heraeus Solder Paste Profile Testing
Published: |
May 07, 1999 |
Author: |
Heraeus |
Abstract: |
This test utilizes an 8 mil laser cut stencil which is contact printed onto a 2 inch square coupon of copper foil that has been oxidized @ 150� C for 1 hour. ... |
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Power Considerations in Small Geometry Thick Film Resistors
Published: |
May 07, 1999 |
Author: |
Heraeus |
Abstract: |
Small geometry resistors must be used where hybrid circuits try to compete in new, high density design applications. ... |
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SUCCESS WITH TODAY'S NO CLEAN SOLDER PASTES
Published: |
May 07, 1999 |
Author: |
Heraeus |
Abstract: |
Today's no-clean solder pastes offer many advantages that were not possible with products from the early days of no-clean. These new pastes open the process window and allow users to gain the advantages of no-clean, while minimizing headaches. ... |
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