Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1750 SMT / PCB Assembly Related Technical Articles

FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES

Oct 14, 2020 | John Timmerman, Maria Salamon

Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques. Specifically, they use less material and space and are more amenable to automation than existing solutions. The thermal and mechanical properties of these materials are well understood but little work has been done to characterize and understand their toughness and fracture behavior. This paper presents the effects of filler loading as well as matrix composition on the fracture toughness of thermally conductive silicone adhesives. It was observed that the fracture toughness of these materials increased significantly with initial filler loading, and that the mechanical properties and fracture toughness depended on the molecular architecture of the matrix used....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer

Keep Your Business Going Even In the Lockdown Through A CRM Solution

Oct 08, 2020 | Anchal Solanki

You are afraid of losing your business during this global COVID-19 crisis. But now, you got a ray of light to bring back your firm on track without breaking the bank. You must be thinking that how CRM software can provide you the juices that you require to sustain your business....

Publisher: FinCRM Technologies

FinCRM Technologies

FinCRM holds expertise in providing Customer Relationship Management (CRM) software and Full Stack Office Management solutions.

Pune, India

Consultant / Service Provider

Optimized Stress Testing for Flexible Hybrid Electronics Designs

Oct 08, 2020 | Hang Gao, Ganapati Bhat, Umit Y. Ogras, and Sule Ozev

Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations...

Publisher: Arizona State University

Arizona State University

Continued strength Our faculty, students and staff have redoubled their collaborative efforts to strengthen, grow and broaden the programs in the School of Electrical, Computer and Energy Engineering. The school's continued streng

Tempe, Arizona, USA

Research Institute / Laboratory / School

Design and Integration of aWireless Stretchable Multimodal Sensor Network in a Composite Wing

Oct 08, 2020 | Xiyuan Chen, Loic Maxwell, Franklin Li , Amrita Kumar, Elliot Ransom, Tanay Topac, Sera Lee, Mohammad Faisal Haider , Sameh Dardona and Fu-Kuo Chang

This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication....

Publisher: Stanford University

Stanford University

Life. Energy. Environment. This triad of engineering priorities is perhaps unmatched in its potential for improving the quality of life for all inhabitants of planet Earth. And at the heart of all three is chemical engineering.

Stanford, California, USA

Research Institute / Laboratory / School

Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies

Sep 30, 2020 | Carlos Montemayor

Introduction •Market trend: Smaller, more efficient, more powerful, run faster •ICs and other sophisticated electronic components typically operate efficiently only under a certain range of temperatures •Operational temperatures must be kept within a suitable range • Excessive heat can damage performance and can even cause system failure...

Publisher: Dow Electronic Materials

Dow Electronic Materials

DEM develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain.

Marlborough, Massachusetts, USA

Manufacturer

High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly

Sep 30, 2020 | Taro Kenmochi

There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices. The applications can be lens bonding, waveguide imprinting, or other applications where the adhesive is in the optical pathway. To support these various optical applications, new materials with tailorable optical properties are required. There is often a mismatched refractive index between plastic lenses such as PC (Poly Carbonate), COP (Cyclo Olefin Polymer), COC (Cyclo Olefin Copolymer), PMMA (Poly Methyl Methacrylate), and UV curable liquid adhesive. A UV curable liquid adhesive is needed where you can alter the refractive index from 1.470 to 1.730, and maintain high optical performance as yellowness index, haze, and transmittance. This wide range of refractive index possibilities provides optimized optical design. Using particular plastic lens must consider how chemical attack is occurring during the process. Another consideration is that before the UV curable liquid adhesive is cured, chemical raw component can attack the plastic lens which then cracks and delaminates. We will also show engineering and reliability data which defined root cause and provided how optical performance is maintained under different reliability conditions....

Publisher: Kyoritsu Chemical & Co., Ltd

Kyoritsu Chemical & Co., Ltd

Research, development, manufacturing and marketing of sophisticated chemical products developed by applying fine chemicals and nano-technologies in cutting-edge fields such as home information appliances, IT, semiconductors, batte

Tokyo, Japan

Manufacturer

Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages

Sep 23, 2020 | Keith Sweatman

The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined....

Publisher: Nihon Superior Co. Ltd

Nihon Superior Co. Ltd

Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc) Sales of nonferrous metal Export-import business

Osaka, Japan

Manufacturer

Low Temperature SMT Solder Evaluation

Sep 23, 2020 | Howard "Rusty" Osgood, David Geiger, Robert Pennings, Christian Biederman, Jie Jiang, Jon Bernal

The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional Sn3Ag0.5Cu (SAC305) solder. The many possible advantages and some disadvantages / challenges are discussed. Until recently, the use of Sn/Bi based materials has been investigated with negative consequences for high strain rate (drop-shock) applications and thus, these alloys have been avoided. Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. We tested the manufacturability and reliability of three low-temperature and one SAC-305 (used as a control) solder paste materials. Two of these materials are doped Sn/Bi/Ag and one is just Sn/Bi/Ag1%. We will discuss the tests and related results. And lastly, we will discuss the prospects, applications and possible implications (based on this evaluation) of these materials together with future actions....

Publisher: Flextronics International

Flextronics International

Flex Ltd. is an American Singaporean-domiciled multinational electronics contract manufacturer. It is the third-largest global electronics manufacturing services, original design manufacturer company by revenue, behind only ...

Milpitas, California, USA

Manufacturer

Approaches for additive manufacturing of 3D electronic applications

Sep 16, 2020 | Hoerber, J.; Glasschroeder, J.; Pfeffer, M.; Schilp, J.; Zaeh, M.; Franke, J.

Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates....

Publisher: Institute for Factory Automation and Production Systems (FAPS)

Institute for Factory Automation and Production Systems (FAPS)

At the Technical Faculty (TF) of the Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU) more than 20 engineering and computer science courses are offered. The TF has an excellent reputation in science and business.

Nuremberg, Germany

Research Institute / Laboratory / School

Additive manufacturing frontier: 3D printing electronics

Sep 16, 2020 | Bingheng Lu, Hongbo Lan and Hongzhong Liu

3D printing is disrupting the design and manufacture of electronic products. 3D printing electronics offers great potential to build complex object with multiple functionalities. Particularly, it has shown the unique ability to make embedded electronics, 3D structural electronics, conformal electronics, stretchable electronics, etc. 3D printing electronics has been considered as the next frontier in additive manufacturing and printed electronics. Over the past five years, a large number of studies and efforts regarding 3D printing electronics have been carried out by both academia and industries. In this paper, a comprehensive review of recent advances and significant achievements in 3D printing electronics is provided. Furthermore, the prospects, challenges and trends of 3D printing electronics are discussed. Finally, some promising solutions for producing electronics with 3D printing are presented....

Publisher: Xian Jiaotong University

Xian Jiaotong University

Xi'an Jiaotong University is a C9 League university with strengths in engineering, technology, management, and life sciences located in Xi'an, Shaanxi, China. It is a Chinese Ministry of Education Class A Double First Class Univ.

Xi'an, Shaanxi, China

Research Institute / Laboratory / School

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