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Technical Library articles |
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Dross Characteristics
Published: |
May 07, 1999 |
Author: |
David Scheiner, Kester Solder Company |
Abstract: |
Dross consists of tin oxide and lead oxide. These oxides are generated by the high heat associated with soldering.... |
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Kester Solder Alternatives to Solvent Cleanable Solderpaste
Published: |
May 07, 1999 |
Author: |
Kester Solder |
Abstract: |
Today, because of the uncertain future of solvent cleaning, solderpaste vendors are looking at significantly different formulations.
... |
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Accepting Environmental Responsibility in the Electronic Assembly Industry
Published: |
May 07, 1999 |
Author: |
Kester Solder |
Abstract: |
As pressure becomes greater to emit less pollutants, the companie at accept and implement an environmentally friendly strategy early on will find a path of least resistance in the future.
... |
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ELECTRICAL TESTING INTERFERENCE CAUSED BY USE OF
Published: |
May 07, 1999 |
Author: |
Brian Deram, Kester Solder |
Abstract: |
Most high volume production facilities rely on fast testing of the final soldered assembly. One of the most popular methods used is ... |
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Implementation of a High-Quality Dolby* Digital Decoder Using MMX� Technology
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
Dolby* Digital is a high-quality audio compression format widely used in feature films and, more recently, on DVD1. PCs now offer DVD drives, and providing a Dolby Digital decoder in software allows decoding of Dolby Digital to become a baseline...... |
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MMX� Microarchitecture of Pentium� Processors With MMX Technology and Pentium� II Microprocessors
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
The MMX� technology is an extension to the Intel Architecture (IA) aimed at boosting the performance of multimedia applications. This technology is the most significant IA extension since the introduction of the Intel386� microprocessor. ... |
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MMX� Technology Architecture Overview
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
Media (video, audio, graphics, communication) applications present a unique opportunity for performance boost via use of Single Instruction Multiple Data (SIMD) techniques. ... |
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A PROM Element Based on Salicide Agglomeration of Poly Fuses in a CMOS Logic Process
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
A novel programmable element has been developed and evaluated for state of the art CMOS processes. This element is based on agglomeration of the Ti-silicide layer on top of poly fuses. ... |
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Redundancy and High-Volume Manufacturing Methods
Published: |
May 07, 1999 |
Author: |
Intel Corp. |
Abstract: |
This paper will describe practical aspects of a redundancy implementation on a high-volume cache memory product.... |
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Redundancy Yield Model for SRAMS
Published: |
May 07, 1999 |
Author: |
Nermine H. Ramadan, STTD Integration/Yield, Hillsboro, OR, Intel Corp. |
Abstract: |
This paper describes a model developed to calculate the number of redundant good die per wafer. ... |
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