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Technical Library articles |
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Reliable Interconnection of Fine Pitch Devices Using Kester R-229-25 Solderpaste
Published: |
May 07, 1999 |
Author: |
Kester Solder |
Abstract: |
The use of fine pitch devices, those components with 25 mil center to center lead spacing or less, is becoming a common occurrence in today's electronic assembly. Currently, two major problems may be encountered...
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A Reaction Mechanism and Process Application for Copper Protective Coatings
Published: |
May 07, 1999 |
Author: |
T.R. Gibbs, Kester Solder Division |
Abstract: |
The most effective passivating agents for protecting bare copper boards are the heterocyclic nitrogen compounds. These modified azole complexes have been found to be the most effective of these oxidation inhibitors for bare copper boards.... |
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Solder Paste
Published: |
May 07, 1999 |
Author: |
Kester Solder |
Abstract: |
This data sheet supplement includes test methods used to generate information on the Kester RHEOMET data sheets along with comments on the validity and relevance of those test performed.... |
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KESTER SOLDERPASTE Handling and Storage Recommendations
Published: |
May 07, 1999 |
Author: |
Kester Solder |
Abstract: |
Kester packs solderpaste in styrofoam coolers containing dry ice whenever there is a chance of high temperatures in transit. This type of packaging ensures that the solderpaste will maintain temperatures less than 100�F for a minimum of four days.... |
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Profiling Infra-Red Reflow Ovens for Kester Solderpaste
Published: |
May 07, 1999 |
Author: |
Kester Solder |
Abstract: |
There are a variety of reflow ovens being used in the electronic assembly industry. Although they have different features and capabilities, the profile requirements of solderpastes used in them remains constant.
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The Nature of White Residue on Printed Circuit Assemblies
Published: |
May 07, 1999 |
Author: |
Dennis F. Bernier, Kester Solder |
Abstract: |
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions.... |
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Multi-Pass Processing of Bare Copper Boards Using No-Clean Technology
Published: |
May 07, 1999 |
Author: |
Kester Solder Division |
Abstract: |
New developments in organic metal selective copper protection systems are allowing the use of advanced no-clean solder pastes and wave soldering fluxes in multiple heating operations with virtually no effect on process yield.... |
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Lead Free Alloy Position Paper
Published: |
May 07, 1999 |
Author: |
Kester Solder Division |
Abstract: |
Kester has just formed a joint research project for lead-free alloys development, under non-disclosure agreement, with a major Asian electronics manufacturer to further accelerate these efforts and better study the reliability aspects on developed...... |
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In-Coming Quality Control of Kester Solder Paste
Published: |
May 07, 1999 |
Author: |
Eric Slezak, Kester Engineered Products |
Abstract: |
One of the best ways to build confidence in a chosen solder paste supplier is to do a survey of their production, quality control, technical and safety support. ... |
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The Effect Of Metallic Impurities On The Wetting Properties Of Solder
Published: |
May 07, 1999 |
Author: |
Dennis Bernier, Kester Solder Company |
Abstract: |
This paper is a report of a continuing extensive study made to determine the maximum allowable impurities in solder used for wave soldering applications. ... |
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