With the advent of no clean flux technology, the electronics assembly industry was able to remove CFC's and ODC's from their assembly processes. However, with the new Clean Air Act, volatile organic compound (VOC) emissions has become the new......

The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries. ...

Screen Printer Selection,Screen/Stencil Selection,Stencil vs. Screen,Squeegee Selection ...

Viscosity and solderpaste is one of the most mis-understood aspects of this new and very important part of ...

Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. ...

This paper discusses the basic principles of soldering and what controls are necessary to achieve high quality and productivity....

What follows are some thoughts and comments on a few questions concerning solder balls. ...

There are many things that can go wrong when soldering to gold plate over nickel surfaces. ...

manufacturers of electronic assemblies have been investigating all means for reducing defect rates with the ultimate goal to achieve a significant cost savings and increase the overall reliability of electronic assemblies. ...

Many manufacturers have now completed the conversion to no clean solderpaste. Many factors governed this initial conversion, among those being cosmetics, solderability, and processability....