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Technical Library articles |
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Understanding SP440 Heating & Vacuum Functions
Published: |
May 09, 1999 |
Author: |
LEO HUERTA, TECHNICAL SERVICES ENGINEER |
Abstract: |
This Technical Note addresses operational issues regarding SP440 desoldering use.
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Replacing Surface Mount Components With the
Published: |
May 09, 1999 |
Author: |
N/A |
Abstract: |
This application note outlines how to use the Mini-Hoof (SMTC-x167) cartridge to replace surface mount components.
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Replacing Chip Caps With The Metcal Talon
Published: |
May 09, 1999 |
Author: |
RON LaVALLEY, PROJECT MANAGER |
Abstract: |
A small note explaining the best way to remove and replace chip caps using Metcal's TALON tweezer tool.
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Surface Mount Techniques Using Metcal's Knife Tip Cartridge
Published: |
May 09, 1999 |
Author: |
RAYMOND LUI, APPLICATIONS ENGINEER, Metcal |
Abstract: |
A step-by-step guide detailing how to use Metcal's new Knife Tip Cartridge to simplify the replacement of tightly packed J-leaded components. Included also is discussion about removing shorts from J-leaded components.
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Surface Mount Rework Techniques
Published: |
May 09, 1999 |
Author: |
BRIAN MOYLAN, WESTERN REGIONAL MANAGER, Metcal |
Abstract: |
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures.... |
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Conduction Rework Technology And Techniques
Published: |
May 09, 1999 |
Author: |
RON LaVALLEY, PROJECT MANAGER, Metcal |
Abstract: |
No rework technology is ideal for all situations. In choosing a rework tool, one must evaluate not just the tool itself, but the total interplay between operator, tool, and task requirements. The key evaluation criteria are product damage, speed...... |
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Metcal Application Solutions Group Report #1
Published: |
May 09, 1999 |
Author: |
Metcal |
Abstract: |
a Solutions Report prepared for a large computer manufacturer who had variety of issues including QFP and Large QFP Rework, Two-Sided Gull-Wing Component Rework, PLCC Rework, SOJ Rework, and PLCC Socket Rework. ... |
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Soldering SMD's Without Solder Paste
Published: |
May 09, 1999 |
Author: |
by Werner Maiwald - BuS Electronik |
Abstract: |
SIPAD circuit boards with preformed solder deposits now make it possible to solder ICs with high pin counts and small pitches reliably and economically without solder paste. SIPAD also improves the overall board quality of even the smallest batches. ... |
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Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.
Published: |
May 09, 1999 |
Author: |
William G. Kenyon, President, Global Center for Process Change Inc. |
Abstract: |
The crash drive to remove ozone layer depleting substances from electronics accelerated the trend to fully integrated process and material requirements and documents.
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Water Soluble and No-Clean Technologies for DOD Manufacturing
Published: |
May 07, 1999 |
Author: |
David Scheiner, Kester Solder Division |
Abstract: |
As a result of the Montreal Protocol and the elimination of ozone depleting chemicals, DOD manufacturers have been given the opportunity to institute water clean and no-clean technologies in the manufacture printed circuit assemblies.... |
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