This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages....

This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension....

With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the small...

Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head....

Non-intrusive board test (NBT) has become an increasingly critical facet of contemporary board test strategies. Recent developments in basic electronic technology as well as the evolving economics of electronic test have combined to make NBT and the ...

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but l...

The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently hi...

An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical applications. Conformal coatings have long been used to protect electronic assemblies from their operating en...

Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias [1]. ECM, also known as dendritic growth, is a critical issu...

Embedded passives account for a very large part of today’s electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more...