Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production

Add Article »

1752 SMT / PCB Assembly Related Technical Articles

Failure Analysis – Using Ion Chromatography And Ion Chromatography/Mass Spec (IC/MS)

Apr 29, 2021 | Terry Munson

Since the 1980s the electronics industry has utilized ion chromatography (IC) analysis to understand the relationship of ions, and some organics, to product reliability. From component and board fabrication to complete electronic assemblies and their end-use environment, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware....

Publisher: Foresite Inc.

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, USA

Consultant / Service Provider, Manufacturer

Operation of a Vacuum Reflow Oven with Void Reduction Data

Apr 21, 2021 | Fred Dimock

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....

Publisher: BTU International

BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

North Billerica, Massachusetts, USA

Manufacturer

Air purification and occupational health & safety in electronics production

Apr 16, 2021 | ULT

The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently....

Publisher: ULT Canada Sales Incorporated

ULT Canada Sales Incorporated

ULT is a vendor of efficient fume extraction solutions for air purification. The company's systems are utilized for the removal of laser fumes, soldering fumes, odors, vapors, gases, dusts etc. in electronics production.

Okotoks, Alberta, Canada

Consultant / Service Provider, Manufacturer

Detection of PCB Soldering Defects using Template Based Image Processing Method

Apr 15, 2021 | Şaban Öztürk, Bayram Akdemir

In this study, a predefined template-based image processing system is proposed to automatically detect of PCB soldering defects that negatively affect circuit operation. The proposed system consists of a scaled inspection structure, a camera, an image processing algorithm merged with Fuzzy and template guided inspection process. The prototype is produced using a plastic material, depending on the focal length of the camera and the PCB size. Image processing step comprises two steps. Firstly, solder joints are determined and boxed using Fuzzy C-means clustering algorithm....

Publisher: Selcuk University

Selcuk University

Selçuk University started education in the academic year of 1976-1977 with two faculties. Faculty of Science and Faculty of Literature, 7 departments, 327 students and 2 permanent lecturers. Selçuk University has significantly ...

Konya, Turkey

Research Institute / Laboratory / School

Automated Inspection Of PCB Components Using A Genetic Algorithm Template-Matching Approach

Apr 15, 2021 | A. J. Crispin & V. Rankov

Automated inspection of surface mount PCB boards is a requirement to assure quality and to reduce manufacturing scrap costs and rework. This paper investigates methodologies for locating and identifying multiple objects in images used for surface mount device inspection. One of the main challenges for surface mount device inspection is component placement inspection....

Publisher: Springer-Verlag

Springer-Verlag

Springer is a leading global scientific, technical and medical portfolio, providing researchers in academia, scientific institutions and corporate R&D departments with quality content through innovative information, products ...

LONDON, United Kingdom

Consultant / Service Provider

Automatic Visual Inspection of Printed Circuit Board for Defect Detection and Classification

Apr 15, 2021 | Vikas Chaudhary, Ishan R. Dave and Kishor P. Upla

Inspection of printed circuit board (PCB) has been a crucial process in the electronic manufacturing industry to guarantee product quality & reliability, cut manufacturing cost and to increase production. The PCB inspection involves detection of defects in the PCB and classification of those defects in order to identify the roots of defects. In this paper, all 14 types of defects are detected and are classified in all possible classes ......

Publisher: S. V. National Institute of Technology

S. V. National Institute of Technology

Sardar Vallabhbhai National Institute of Technology Surat, is a public technical university established by the Parliament of India in 1961. It is one of 31 National Institutes of Technology in India recognized by the Government ..

Surat, Gujarat, India

Research Institute / Laboratory / School

Investigation of Factors That Influence Creep Corrosion

Apr 08, 2021 | Cherie Chen

Understand the sensitivities of the identified factors to Creep Corrosion. Correlate experimental test conditions to environment classification standards....

Publisher: iNEMI (International Electronics Manufacturing Initiative)

iNEMI (International Electronics Manufacturing Initiative)

iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.

Herndon, Virginia, USA

Qualification Test Development for Creep Corrosion

Apr 08, 2021 | Prabjit Singh Simon Lee

Creep corrosion is not a new phenomenon, it has become more prevalent since the enactment of the European Union's Restriction of Hazardous Substance (RoHS) Directive on 1 July 2006. The directive bans the use of lead and other hazardous substances in products (where lead-based surface finishes offered excellent corrosion resistance). The higher melting temperatures of the lead-free solders and their poor wetting of copper metallization on PCBs forced changes to PCB laminates, surface finishes and processing temperature-time profiles. As a result, printed circuit boards might have higher risk of creep corrosion....

Publisher: iNEMI (International Electronics Manufacturing Initiative)

iNEMI (International Electronics Manufacturing Initiative)

iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.

Herndon, Virginia, USA

Creep Corrosion of PWB Final Finishes: Its Cause and Prevention

Apr 08, 2021 | C. Xu, J. Smetana, J. Franey, G. Guerra, D. Fleming, W. Reents,

As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion...

Publisher: Alcatel-Lucent

Alcatel-Lucent

Often referred to as "The Idea Factory" or "The Crown Jewel," Nokia Bell Labs has an unparalleled history of innovation output. Researchers at Nokia Bell Labs have been behind or involved in nearly every critical technological mil

New Providence, New Jersey, USA

Research Institute / Laboratory / School

Microbial Nanocellulose Printed Circuit Boards for Medical Sensing

Apr 01, 2021 | Jonathan D. Yuen, Lisa C. Shriver-Lake, Scott A. Walper, Daniel Zabetakis, Joyce C. Breger and David A. Stenger

We demonstrate the viability of using ultra-thin sheets of microbially grown nanocellulose to build functional medical sensors. Microbially grown nanocellulose is an interesting alternative to plastics, as it is hydrophilic, biocompatible, porous, and hydrogen bonding, thereby allowing the potential development of new application routes. Exploiting...

Publisher: U.S. Naval Research Laboratory

U.S. Naval Research Laboratory

The U.S. Naval Research Laboratory (NRL) is the Department of the Navy's corporate laboratory, and it reports to the Chief of Naval Research. As the corporate laboratory of the Navy, NRL is the principal in-house component in the

Washington,, District of Columbia, USA

Research Institute / Laboratory / School

Fluid Dispensing, Staking, TIM, Solder Paste
consignment program
Now Online
63
Visitors
1
Member

Who are SMTnet visitors?

Become a member now and receive the value and benefits of membership.

SMT spare parts - Qinyi Electronics
Fluid Dispensing Aerospace

pressure curing ovens