Designing a ...

New methods of creating and analyzing IC package interconnections can provide the reliability demanded of today�s high-performance products. ...

This paper will review chip-scale and chip-size package variations, solder alloy options, furnish guidelines for solder stencil development and outline the actual processes used to successfully produce SMT assemblies utilizing CSP technology. ...

The following describes the industry trend in developing ball grid array devices, the evolution of package standards from JEDEC and EIAJ. In addition, examples will illustrate the impact of package size and die complexity, land pattern and......

Wide Area Vertical Expansion (W.A.V.E.) technology promises to provide a relatively easy method for cost effectively interconnecting ICs while still on the wafer. ...

The significant advantage to employing the miniature chip-scale packaging (CSP) technology is threefold; higher component density, more efficient assembly automation and enhanced product performance. ...

To secure the benefits of reflow soldering for assemblies of mixed-technology components, a special solder paste alloy and procedure for low-temperature processing is suggested. ...

With the ongoing concern regarding environmental pollutants, Iead is being targeted in the electronic assembly arena. This paper highlights lead-free solders and the different combinations of elemental makeups. ...

Successful conversion from RMAs, (rosin mildly activated) flux chemistries to no-cleans depends on the assembly and its end use. Implementing no-clean chemistries requires some fundamental, though not drastic, changes in the assembly process......

This note is an overview of the time-out feature on MX-500 power supplies with descriptions on proper operation and how to disable the feature. ...