Paper covers techniques to characterize and control wave soldering process parameters. Also discusses the problems (defects) caused by out-of-control parameters....

Description of a technique used by Radisys to maintain In-Circuit test fixtures in a controlled manner....

I have nominated Cunli for this year's SMTA Founder's Award, to be given at SMTA International in September. Following is a copy of the nomination, in both html and Word, for anyone who would like to second it. ...

This is a study concerning the environmental impacts that the alternative solders will pose....

Flexible circuits have been used to solve many unusual electronic packaging problems since their introduction. The innate advantages of thin flexible films have been exploited to create a seemingly endless parade of visually fanciful yet highly......

Once again the industry is facing the age-old problem of needing to implement a new system with old technology, in order to meet the unrelenting demands of cost and time-to-market for commercial introduction. ...

Reviewed here are some of the more novel uses of the flex circuit for high performance electronic interconnection. ...

Companies developing and manufacturing electronic products are challenged by a growing market demand for smaller, more efficient and, a higher performance product. The current trend toward miniaturization is driven to an extent by......

Chip Scale Packaging (CSP) is considered by many as a reliable answer to those seeking a smaller product size. And with shorter signal paths between the smaller chip-scale device outlines, improved functionality and performance is achievable as well....

This paper will discuss the special advantages of programmable laminate substrates in terms of their design and manufacture. In addition, data will be presented on the performance of such substrates relative to alternative existing approaches. ...