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Technical Library articles |
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Cleaning Process for SMT Adhesive Stencils
Published: |
Jul 20, 1999 |
Author: |
Kathleen Crocker and Drew Kissinger |
Abstract: |
Today's integrated circuit board manufacturers are increasingly moving toward double sided surface mount boards (SMT Surface Mount Technology). These boards offer great advantages over single sided boards in miniaturization, but have their own assoc... |
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The Best Way to Clean Water-Soluble Fluxes
Published: |
Jul 20, 1999 |
Author: |
Rick Roney |
Abstract: |
One logical approach to eliminating chloroflurocarbons is to use water-soluble solder pastes. For years, electronic assembly houses have used aqueous cleaning for removing the water-soluble fluxes...... |
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Process Control Diagnostics for Direct Chip Attach
Published: |
Jul 20, 1999 |
Author: |
Cameron E. Presley |
Abstract: |
In today's market, there is an increased initiative toward electronics miniaturization. This will only be achieved by the continuance of bare-die assembly. Technologies such as flip-chip on board (FCOB), flip-chip........ |
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MCM-L Warpage Due to Encapsulant
Published: |
Jul 20, 1999 |
Author: |
Marnie Knadler, Joe Harris, Cheryl Kromis |
Abstract: |
The increased circuit density and improved circuit performance characteristic of multichip modules (MCMs) has not only heightened industry demand for them, but also prompted the development of an infrastructure...... |
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Closing The Loop on Solvent Cleaning Systems
Published: |
Jul 20, 1999 |
Author: |
Jose A. Berbel, Steve Stach, Dr. Hugh Cole |
Abstract: |
The development of a closed-loop cleaning system with advanced process and statistical control for PCBs and other electronic assemblies has been recently made possible by a combination of separation techniques,...... |
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How to DeSolder Surface Mount Components
Published: |
Jul 20, 1999 |
Author: |
Mark Neff |
Abstract: |
I've used several different techniques for removing flat packs, all with varying degrees of success. The most obvious is to use a temperature controlled iron, solder-wick as much solder as you can off the pins, and then heat each pin...... |
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How to Select a Heat Sink
Published: |
Jul 20, 1999 |
Author: |
Aavid Thermal Products |
Abstract: |
Abstract
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management becomes a more and more important...... |
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Colder electronic circuitry is less reliable
Published: |
Jul 20, 1999 |
Author: |
Dan Shelikoff , Honeywell Fort Washington, Pa |
Abstract: |
Those who install or use process control equipment should be aware that colder is not always better. Improper cooling reduces reliability not only in severely contaminated locations but also in ... |
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Construction of the VT84 PC board
Published: |
Jul 20, 1999 |
Author: |
Mechatronics |
Abstract: |
This section covers the construction of the VT84 prototyping board. The VT84 is a versatile development system for the Microchip PIC16C84 processor. Its capabilities include:
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Circuits Cost Cutting Tips
Published: |
Jul 20, 1999 |
Author: |
Murrietta Circuits |
Abstract: |
What affects the price of boards?
Number of layers: Limit the number of layers as much as possible. If higher quantities are anticipated, spend the extra time and money in engineering to minimize layer count....... |
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