Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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639 SMT / PCB Technical Articles

Characteristics of Conformal Coatings

Aug 28, 2007 | Dave Poulin, Senior Materials Engineer, EMPF.

A conformal coating is defined as a thin polymeric material which covers the surface of an electronic assembly. These coatings are used to provide an electrically insulative and environmentally protective seal or cover to a completed printed circuit board (PCB)....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, United States

Other

Boundary Scan Skews Test Coverage Tradeoffs in your Favor

Aug 23, 2007 | Dominic Plunkett, Chief Technology Officer, XJTAG, Ltd.

The complexity and programmability of modern embedded boards means that knowledge built up during debugging and testing must be regarded as Intellectual Property (IP) and therefore preserved. But many of the processes and tools used today do not provide a means to preserve or pass on this IP, and thereby forego valuable opportunities to save time and improve quality during subsequent stages of product development....

Publisher: XJTAG

XJTAG

XJTAG provides a full range of JTAG products to help you debug board designs with BGAs, test hardware that includes FPGAs, CPLDs, DSPs or microprocessors.

Cambridge, United Kingdom

Software Manufacturer

Lead-Free BGA Rework-Transition Issues

Aug 16, 2007 | Best Inc

While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

Aug 09, 2007 | Tony DeBarros and Doug Katze of Emerson and Cuming And Pericles Kondos of Universal Instruments

Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os....

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Aug 02, 2007 | Moody Dreiza, Lee Smith - Amkor Technology, Gene Dunn - Panasonic Factory Solutions, Niranjan Vijayaragavan, Jeremy Werner - Spansion.

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements....

Publisher: Amkor Technology, Inc.

Amkor Technology, Inc.

Amkor Technology is the world's largest independent supplier of outsourced packaging and test semiconductor interconnect services; with more than 33 years of continuous improvement, growth and innovation. http://www.amkor.com

Chandler, Arizona, United States

Two-Photon Polymerization: A New Approach to Micromachining

Jul 24, 2007 | Andreas Ostendorf, Boris N. Chichkov, Laser Zentrum Hannover eV.

The rapid technical development of ultrashort laser systems is creating exciting possibilities for very precise localization of laser energy in time and space. These achievements have triggered novel laser applications based on nonlinear interaction processes. A promising three-dimensional microfabrication method that has recently attracted considerable attention is based on two-photon polymerization with ultrashort laser pulses....

Publisher: Aerotech, Inc.

Aerotech, Inc.

Since 1970, Aerotech has designed and manufactured the highest performance motion control, positioning tables/stages, and positioning systems for our customers in industry, government, science, and research institutions worldwide.

Pittsburgh, Pennsylvania, United States

Manufacturer of Assembly Equipment, Assembly, Component Packaging, Inspection, Pick and Place

Reduced Oxide Soldering Activation (ROSA)

Jul 19, 2007 | Sam Pepe, Chemist, American Competitiveness Institute / EMPF

ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, United States

Other

Implementing Lead Free Soldering - European Consortium Research

Jul 12, 2007 | Dr. M. Warwick.

Over the last ten years, there have been a large number of publications describing work into lead free electronics soldering. They have come from all regions of the world and from academic organisations, individual companies and consortia. Although a number of these studies have culminated in "production trials", these have invariably been on a limited scale and they were essentially a demonstration, rather than the first step to implementation....

Publisher: Multicore Solders

Multicore Solders

Manufacturer of soldering materials, paste solder

Richardson, United Kingdom

Distributor

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

Jun 27, 2007 | Jason Higgins - Universal Instruments Corporation, Robert Hemann - Medtronic Microelectronics Center.

Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement....

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

Selective Solder Paste Deposition Reliability Test Results.

Jun 21, 2007 | Bob Wettermann.

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

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