Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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686 SMT / PCB Technical Articles

Lean Kitting: A Case Study

Aug 20, 2008 | Ranko Vujosevic, Ph.D. Optimal Electronics Corporation Jose A. Ramirez, Larry Hausman-Cohen, and Srinivasan Venkataraman The University of Texas at Austin Department of Mechanical Engineering Austin, Texas

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular assembly from the stockroom and issuing the kit to the manufacturing line at the right time and in the right quantity. This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major contract manufacturer site....

Publisher: Optimal Electronics Corporation

Optimal Electronics Corporation

A global provider of innovative manufacturing execution system (MES) solutions for the electronics assembly industry.

Austin, Texas, United States

Software Manufacturer

XRF- A Reality Check

Aug 14, 2008 | Sia Afshari

The Restriction of Hazardous Substances (RoHS) regulations of the European Union, and similar regulations being enacted around the world, require the virtual elimination of lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6), polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) from electronic products. Allowable concentration levels in any homogeneous material contained within a product are extremely low: 0.01% for Cd and 0.1% for other substances by weight. The most significant issue affecting the practical validation of RoHS compliance in the day-to-day assembly environment is ensuring that no restricted substances, especially tin-lead (SnPb) materials, have inadvertently entered into the production stream....

Publisher: RMD Instruments

RMD Instruments

Manufacturer of XRF Instrumentation Devices

Watertown, Massachusetts, United States

Manufacturer of Assembly Equipment

Embedded Instrumentation Ushers in a New Era for the Test and Measurement Industry

Aug 08, 2008 | Glenn Woppman President and CEO ASSET InterTech

Non-intrusive validation, test and debug technologies have been around since the emergence of boundary scan (IEEE 1149.1 JTAG) in the mid-1990s. Over the years since then, the imperatives dictating probe-less methodologies have multiplied significant...

Publisher: ASSET InterTech, Inc.

ASSET InterTech, Inc.

ASSET InterTech is the leading supplier of open tools for embedded instrumentation to engineers doing design validation, test and debug.

Richardson, Texas, United States

Other, Software Manufacturer

Selection Of Wave Soldering Fluxes For Lead-Free Assembly

Jul 10, 2008 | Chrys Shea, Sanju Arora, Steve Brown

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Providence, Rhode Island, United States

Manufacturer of Assembly Material

Lead-Free Reliability - Building It Right The First Time

Jul 01, 2008 | Peter Biocca

As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability....

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

Printable Nanocomposites for Electronic Packaging

Jun 25, 2008 | Endicott Interconnect Technologies, Inc.

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Embedded Instrumentation: The future of advanced design validation, test and debug.

Jun 11, 2008 | ASSET InterTech, Inc.

The necessities that are driving the invention of embedded instrumentation arise from several imperatives. First, the speed and complexity of technology today, starting at the chip level, has escalated geometrically. Chip-to-chip interconnects and input/output (I/O) buses have blown past the gigabits-per-second (Gbps) and are pushing into the five to eight Gbps range. Moreover, the hundreds of millions and billions of gates now present on chips have increased the complexity of devices exceedingly....

Publisher: ASSET InterTech, Inc.

ASSET InterTech, Inc.

ASSET InterTech is the leading supplier of open tools for embedded instrumentation to engineers doing design validation, test and debug.

Richardson, Texas, United States

Other, Software Manufacturer

Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

Jun 04, 2008 | Zontec Inc.

The convergence of a wide range of global influences is having a profound effect on current-day quality in manufacturing. Today's operational strategies must take into account business cycles, risk-based management, logistics, workflows, outsourcing, regulatory issues, product development, corporate mergers and acquisitions. In this ever-changing economy it is imperative that companies compete more effectively on two fronts: by reducing costs and emphasizing quality....

Publisher: Zontec, Inc.

Zontec, Inc.

SPC software manufacturer. Our software includes such extras as defect tracking, traceability, trend and root cause analysis, overall equipment effectiveness (OEE), rolled throughput yield (RTY), equipment uptime/downtime and supplier quality management in a true real-time production-based system.

Cincinnati, Ohio, United States

Software Manufacturer

Solder Paste Inspection Technologies: 2D-3D Correlation

May 28, 2008 | Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp.

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

Flux Collection and Self-Clean Technique in Reflow Applications

May 14, 2008 | Speedline Technologies, Inc.

This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

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