May 07, 2009 | Crina Rauta, Dr. Abhijit Dasgupta and Dr. Craig Hillman, DfR Solutions.
Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed....
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
Apr 30, 2009 | Protean Marketing Inc.
A brand is the most important strategic asset your business will ever possess. Yet ask even the most experienced marketer and they will struggle to communicate the concept in a single sentence. Furthermore, if you were to approach the majority of today's business-to-business organisations, they would probably tell you that branding finds little application in a market allegedly filled with dispassionate decision makers. However, an increasingly competitive market landscape is eroding this reality - if, indeed, it ever existed. B2B marketing must follow the example of its consumer-focused counterpart and embrace the notion that a strong brand has the power to differentiate, build and protect those it represents in the face of incessant commoditization....
Publisher: Protean Marketing Inc
Protean Marketing is a specialist communications agency with offices in the USA and Europe. We help companies define, plan and execute marketing communications strategies that generate increased sales, revenue and market share.
Austin, Texas, USA
Apr 30, 2009 | Kevin Knadle.
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored....
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, USA
Apr 23, 2009 | Zach Shook, Marketing Director; Count On Tools, Inc.
No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result. ...
Publisher: Count On Tools, Inc.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Gainesville, Georgia, USA
Apr 22, 2009 | P. John Shiloh, John Malboeuf.
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....
Publisher: DDM Novastar
Turnkey SMT assembly solutions, manual & automated stencil printers, manual & automatic pick & place systems with dispensers, wave solder & selective solder machines, lead free solder reflow ovens, component counters, & thru-hole
King of Prussia, Pennsylvania, USA
Apr 16, 2009 | Dr. Henry Jurgens; Valor Division of Mentor Graphics Corp.
The worldwide electronics industry has sales of $750 billion, two thirds of which is accounted for by PCB assembly. PCB manufacturing is characterised by an obsessive drive for increased productivity in the context of three significant industry drivers: shorter product lifecycles, more complexity, outsourcing...
Publisher: Mentor Graphics
Apr 09, 2009 | ECD
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life, ...
Publisher: Electronic Controls Design Inc. (ECD)
ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology. The company is a pioneer in the design, development, and manufacturing of advanced thermal profiling systems and software.
Milwaukie, Oregon, USA
Apr 09, 2009 | Tom Morris, Applications Engineering Manager; T.T. Electronics IRC Advanced Film Division.
Advances in solid state light emitting diodes (LEDs) over the last several years have opened new applications for these devices. Traditionally used only in low power, low light output applications, modern high power LEDs are finding their way into a wide variety of applications. LEDs for lighting applications offer several advantages over traditional incandescent lighting methods...
IRC has been a leader in resistor technology, including the industry's comprehensive range of current sense resistors, precision discrete and networks, integrated passive components, and specialized power resistors.
Corpus Christi, Texas, USA
Mar 27, 2009 | Dr. Benlih Huang, Dr. Hong-Sik Hwang, and Dr. Ning-Cheng Lee; Indium Corporation of America.
The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc...
Publisher: Indium Corporation
Mar 25, 2009 | Mike Weekes.
Have you ever been asked to lead a project to fix a problem, implement a new technology or some other initiative? It can be intimidating. Just because you, yourself are a good problem-solver, doesn't mean you have the capacity or drive to work with a team to achieve a goal. Often the secret to success lies in up-front preparation. Here are ten things you can do to help assure that when the project is done, it will have the effective results your leadership team is looking for....
Publisher: Whataboutquality LLC