Mar 18, 2010 | Renee Michalkiewicz, Gaylon Morris; Trace Laboratories, Inc., Simin Bagheri; Celestica, Inc.
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used....
Publisher: Trace Laboratories
Mar 11, 2010 | Stephen Schoppe, Glenn Robertson - SMTAI Proceedings
Counterfeit products have been a growing problem worldwide, and the electronics industry has been no exception. Authentication of electronic components by electrical and physical testing can provide a cost-effective means of risk management, aimed at keeping counterfeits out of the supply chain. In this presentation, we will review sources of counterfeit components, and discuss the capabilities and limitations of test processes used for authentication. We will then present examples of component authentication using these tools....
Publisher: Process Sciences, Inc.
Mar 04, 2010 | Mario Scalzo Senior Technical Support Engineer CSMTPE, Six Sigma Black Belt, Indium
While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects...
Publisher: Indium Corporation
Feb 25, 2010 | Cadence
This paper will focus on two challenges: building differentiated products, which can enable systems companies to quickly penetrate a market, take a leadership position, and effectively counter or displace any competition; and build them faster. Clear differentiation also allows a superior value proposition, which will enable a stronger position on pricing with less need to circum to eroding ASPs. Differentiation can involve many factors, but this paper will focus on those related to the technology impact/usage that directly enables the design of products with shorter, more predictable design cycles compared to the competition....
Publisher: Cadence Design Systems, Inc.
Feb 18, 2010 | Best Inc
This paper describes a new rework process for leadless devices where the devices can be manually placed without relying on capital equipment....
Publisher: BEST Inc.
Feb 10, 2010 | Phil Kinner; HumiSeal Europe
The electronics industry has recently undertaken the transition to lead-free processing as a direct consequence of the RoHS directive, which came into force in July 2006. However, this is unlikely to be the last transition required since the European Solvent Emissions Directive, 1999 is starting to be implemented and enforced by national governments. This is resulting in pressure on larger manufacturers, currently emitting more than 5 tonnes of solvent vapour per annum to take steps to limit and reduce their emissions....
Publisher: Chase Electronic Coatings
HumiSeal is manufactured by Chase Electronic Coatings, an operating division of Chase Corporation and produces conformal coatings from all chemistries, including acrylics, urethanes and silicones, both water based and UV curable.
Westwood, Massachusetts, USA
Feb 03, 2010 | OCM Manufacturing
This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals....
Publisher: OCM Manufacturing
Jan 27, 2010 | Valor Computerized Systems
This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of the electronics industry – The PCB Design Grid System...
Publisher: Valor Computerised Systems Ltd
Valor develops software solutions for electronics product design analysis, simulation and optimisation of PCB assembly, and manufacturing operations management to increase productivity, yield and quality and accelerate product innovation.
Yavne , Israel
Jan 19, 2010 | François Monette, Cogiscan Inc. and Matt Van Bogart, Microscan Systems, Inc.
Learn how Trace, Track and Control (TTC) solutions help manufacturers cut cost, cut waste, automate critical manufacturing processes, and increase yields—all critical elements in today’s economic environment....
Jan 13, 2010 | Bob Wettermann
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations....
Publisher: BEST Inc.