Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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624 SMT / PCB Technical Articles

The Proximity of Microvias to PTHs And Its Impact On The Reliability

May 09, 2007 | Anthony Primavera Manager - CSP Consortium Universal Instruments Corporation, Jaydutt Joshi, Package Development Engineer - Conexant Systems Inc.

High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies....

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

A Study of Lead-Free Wave Soldering

May 02, 2007 | David Suraski.

This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Real-Time Yield Monitoring Through ERP Systems

Apr 25, 2007 | P. Bhargava, J. Sturek, J. Peck, R. Murcko, K. Srihari

Globalization and increased competition requires an enterprise to focus on cost reduction, improved manufacturing processes and higher standards of quality. Effective yield management using Enterprise Resource Planning (ERP) systems is crucial for the success of any manufacturing organization. An ERP system provides the infrastructure for consolidating all business operations by integrating the information flow across functions, including production planning and control....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Fragility of Pb-free Solder Joints

Apr 18, 2007 | Universal Instruments Corporation

Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service....

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

A Case Study in Troubleshooting Shop Floor Rework Difficulties

Apr 05, 2007 | Martin Hogner; Martin Rework and Dispense Technic, Wessling/Munich, Germany, and Allen Sirois; Web Administrator, Manncorp Inc., USA.

Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints....

Publisher: MARTIN (a Finetech company)

MARTIN (a Finetech company)

Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Effects of Assebly Process Variables on Voiding at a Thermal Interface.

Apr 04, 2007 | Muffadal Mukadam, Jeff Schake, Peter Borgesen, Krishnaswami Srihari.

The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature....

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

Lead-free Rework Process For Chip Scale Packages

Mar 28, 2007 | Arun Gowda and K. Srihari, Ph.D. - Electronics Manufacturing Research and Services, Anthony Primavera, Ph.D. Consortium Manager - Universal Instruments Corporation

Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging....

Publisher: Universal Instruments

Universal Instruments

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment

Are You Becoming E-Wasted?

Mar 13, 2007 | Jim Usery

This article gives an explanation of what e-waste is and states the regulations on how it can be disposed of. It also tells what some companies are doing to help the consumer get rid of it....

Publisher: Innovative Circuits Inc.

Innovative Circuits Inc.

The people to see for all of your electronic design and manufacturing needs.

Alpharetta, Georgia, United States

Manufacturer of Assembled PCBs

Prototyping Your New Electronic Product Idea

Mar 13, 2007 | Jim Usery, Sales and Marketing Director, Innovative Circuits Inc.

This article outlines the minimum tasks needed to send your new electronic product idea out for prototyping. It lists and defines the minimums to either perform your self or to have subcontracted....

Publisher: Innovative Circuits Inc.

Innovative Circuits Inc.

The people to see for all of your electronic design and manufacturing needs.

Alpharetta, Georgia, United States

Manufacturer of Assembled PCBs

I Have an Idea for a New Product, but Now What?

Mar 13, 2007 | Jim Usery

Do you have an idea for an electronic product, the next must-have gadget, music or video system, time saver, or the greatest problem-solving device that was ever invented? Before you begin designing the product, there are a number of tasks that you must complete and issues that you must resolve before you have an actual product design that can be produced, marketed, and sold. This article will provide you with some guidelines to assist you in getting your idea turned into a successful design. Other issues, such as whether or not to apply for a patent for your product idea and in detail how a particular product should be advertised or marketed will not be addressed in this article....

Publisher: Innovative Circuits Inc.

Innovative Circuits Inc.

The people to see for all of your electronic design and manufacturing needs.

Alpharetta, Georgia, United States

Manufacturer of Assembled PCBs

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