Electronics Manufacturing Technical Articles

Dec 04, 2006

Subahu D. Desai

This paper will explore how test can be an integral part of manufacturing to assure High Reliability Products. We will discuss how test parameters and test techniques are effective in finding time zero vs. time dependent defects. Understanding of ma...

Nov 14, 2006

David Alcoe, Kim Blackwell and Irving Memis, Endicott NY

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ...

Nov 01, 2006

Glenn O. Dearing, Paul J. Hart

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment....

Oct 26, 2006

EFD Solder

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning....

Oct 19, 2006

EFD Inc.

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Th...

Oct 03, 2006

Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste....

Oct 02, 2006

Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste....

Oct 02, 2006

Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste. Four different leadless CSP designs were studied and each was ev...

Sep 18, 2006

Peter DiLeo, Marketing Director

May 3, 2006, Norwalk, CT � Assembly Technology Expo, the nation�s largest �all assembly� trade event, will feature a keynote address by syndicated cartoonist Scott Adams. Adams is best known as the creator of Dilbert, the immensely popular comic crea...

Sep 06, 2006

Binghamton University

Transition to lead free solder stations in electronics packaging has raised issues regarding process, metallurgy and reliability m assemblies. In regards to soldering, lead has been used for thousands of years in a wide range of applications. Conven...