Thermal management is a growing challenge in the electronics industry. As the overall size of electronic devices grows smaller, the enclosed electronic assemblies operate at higher frequencies and generate more heat....

A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. ...

Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. ...

Conventional flip chip assembly usually involves reflow of solder bumped die followed by some form of underfilling operation. An alternative method of attaching flip chip die is to use anisotropically conducting materials......

Faster - smaller - cheaper are the key buzz-words that drive today�s electronic manufacturing processes from concept to reality. ...

Electronic circuit boards are being used in increasingly diverse areas. Applications in marine, automotive, avionics, and consumer electronics are growing at a high rate. Many of these applications could not be easily accomplished without a protectiv...

Throughout the electronics industry, the primary trend in product design is miniaturization. Both design engineers and manufacturing personnel are looking for ways to make products lighter, smaller, less expensive, and at the same time faster,......

As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. ...

A large number of leaded components resist the desire of the industry to fully automate their production facility. A newly introduced selective soldering system can now handle relays, connectors, switches, transformers and other leaded components whi...

The first ...