Electronics Manufacturing Technical Articles

Jan 17, 2007

Cherie Winner, WSU News Service

PULLMAN,Wash.-Researchers at Washington State University have created design guidelines for new molecules that could enhance the speed of internet communications and other optical technologies....

Jan 10, 2007

Earl Moon

As with all other F/A processes, PCB�s occasionally need a little help from them. The following, just as the component process in Section previous, has been condensed from so many involvements over the past 35 years, I cannot remember - nor should I ...

Jan 03, 2007

John Vivari / EFD Inc.

This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits....

Dec 18, 2006

John Vivari / EFD Inc.

Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and...

Dec 04, 2006

Subahu D. Desai

This paper will explore how test can be an integral part of manufacturing to assure High Reliability Products. We will discuss how test parameters and test techniques are effective in finding time zero vs. time dependent defects. Understanding of ma...

Nov 14, 2006

David Alcoe, Kim Blackwell and Irving Memis, Endicott NY

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ...

Nov 01, 2006

Glenn O. Dearing, Paul J. Hart

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment....

Oct 26, 2006

EFD Solder

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning....

Oct 19, 2006

EFD Inc.

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Th...

Oct 03, 2006

Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062� immersion Ag plated printed circuit boards (PCB) using Pbfree solder paste....