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| Library articles: All : Showing listings 451 through 460 out of 639 |
A NEW OPTION FOR MEETING THE CHALLENGES OF KNOWN GOOD DIE
Section: Papers and Articles
Credit/Source: Tessera, Inc.
Added by: Mike 
|
NOVEL USES OF FLEXIBLE CIRCUIT TECHNOLOGY IN HIGH PERFORMANCE ELECTRONIC APPLICATIONS
Section: Papers and Articles
Credit/Source: Tom Distefano and Joseph Fjelstad, Tessera, Inc.
Added by: Mike
|
STANDARDS AND APPLICATIONS FOR CHIP SCALE PACKAGING
Section: Papers and Articles
Credit/Source: Vern Solberg, Tessera, Inc.
Added by: Mike
|
ASSEMBLY PROCESS DEVELOPMENT FOR CHIP SCALE BGA DEVICES
Section: Papers and Articles
Credit/Source: Vern Solberg, Tessera, Inc.
Added by: Mike
|
MULTILYER FLEXIBLE CIRCUIT TECHNOLOGY FOR HIGH PERFORMANCE ELECTRONICS
Section: Papers and Articles
Credit/Source: Tom Distefano, Gus Karavakis and Joseph Fjelstad, Tessera, Inc.
Added by: Mike
|
Designing a Modular Chip-scale Package Assembly Line
Section: Papers and Articles
Credit/Source: By Dr. Tom DiStefano and Edwin Heacox
Added by: Mike
|
Reliability Prediction Modeling of Area Array CSPs
Section: Papers and Articles
Credit/Source: Jean-Paul Clech, Joseph Fjelstad
Added by: Mike
|
Assembly Process Development for Chip-Scale and Chip-Size m BGA�
Section: Papers and Articles
Credit/Source: Vern Solberg, Tessera, Inc.
Added by: Mike
|
Design for BGA and CSP Component Standards and PCB Design Guidelines
Section: Papers and Articles
Credit/Source: Vern Solberg,Tessera, Inc.
Added by: Mike
|
W.A.V.E.� Technology for Wafer Level Packaging of ICs
Section: Papers and Articles
Credit/Source: Joseph Fjelstad, Tessera, Inc., San Jose, CA
Added by: Mike
|
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