Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production

Add Article »

1754 SMT / PCB Assembly Related Technical Articles

Potential for Multi-Functional Additive Manufacturing Using Pulsed Photonic Sintering

Nov 03, 2021 | Sourav Das, Denis Cormier, and Scott Williams

This paper proposes the integration of pulsed photonic sintering into multi-material additive manufacturing processes in order to produce multifunctional components that would be nearly impossible to produce any other way. Pulsed photonic curing uses high power Xenon flash lamps to thermally fuse printed nanomaterials such as conductive metal inks. To determine the feasibility of the proposed integration, three different polymer additive manufacturing materials were exposed to typical flash curing conditions using a Novacentrix Pulseforge 3300 system. FTIR analysis revealed virtually no change in the polymer substrates, thus indicating that the curing energy did not damage the polymer. Next, copper traces were printed on the same substrate, dried, and photonically cured to establish the feasibility of thermally fusing copper metal on the polymer additive manufacturing substrates. Although drying defects were observed, electrical resistivity values ranging from 0.081 to 0.103 Ω/sq. indicated that high temperature and easily oxidized metals can be successfully printed and cured on several commonly used polymer additive manufacturing materials. These results indicate that pulsed photonic curing holds tremendous promise as an enabling technology for next generation multimaterial additive manufacturing processes....

Publisher: Rochester Institute of Technology

Rochester Institute of Technology

Rochester Institute of Technology is a private research university in the town of Henrietta in the Rochester, New York metropolitan area. The university offers undergraduate and graduate degrees, including doctoral and professiona

Rochester, New York, USA

Research Institute / Laboratory / School

Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

Nov 03, 2021 | Gari Arutinov, Jeroen van den Brand, Rob Hendriks

Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse....

Publisher: NovaCentrix

NovaCentrix

With decades of combined experience, our science and engineering leadership team is dedicated to creating industry-changing technologies, including our PulseForge® tools and Metalon® conductive inks.

Austin, Texas, USA

Manufacturer

Reflow Soldering Method With Gradient Energy Band Generated By Optical System

Nov 03, 2021 | Yongqian Chen, Guangzhi Zhu,* Yebo Zhou, Mu Wang, Xianshi Jia, and Xiao Zhu

Laser reflow soldering is an important technology in electronic components processing. In this paper, we presented a simple but efficient method to achieve reflow soldering process with gradient energy band created by just two parallel mirrors. The detailed influence of the variety of optical parameters on the soldering process has been analyzed by using the finite element method. And the modulation of the optical parameters on reflow soldering parameters also has been demonstrated. In our experiment, one HR mirror and one-mirror with transmissivity of 10% have been used to create a gradient energy band with an incident laser power of 50W. In summary, both the simulations and the experiments show that the typical reflow soldering profile has been acquired by the optical system. The high quality joints on both the front and rear surface of the capacitor can be acquired by just one surface radiation of the optical system....

Publisher: Huazhong University of Science and Technology

Huazhong University of Science and Technology

Huazhong University of Science and Technology is a public research university located in Guanshan Subdistrict, Hongshan District, Wuhan, Hubei province, China. As a national key university directly affiliated to the Ministry of ..

Wuhan, Hubei, China

Research Institute / Laboratory / School

How to Test a Mass Flow Sensor?

Oct 27, 2021 | markee

The mass flow sensor, or air flow sensor is one of the important sensors of the electronic fuel injection engine. It is installed between the air filter and the intake hose to measure the intake volume of the engine cylinder and adjust the fuel ratio according to it. The mass flow sensor converts the inhaled air flow into electrical signals and sends them to the electronic control unit (ECU). As one of the basic signals to determine the fuel injection, it is a sensor that measures the air flow of the suction engine. So if you want to test it, how should you do? Let's start it....

Publisher: OKmarts Industrial Parts Mall

OKmarts Industrial Parts Mall

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Equipment Dealer / Broker / Auctions

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

Oct 20, 2021 | A. Siewiorek, A. Kudyba, N. Sobczak, M. Homa, Z. Huber, Z. Adamek, and J. Wojewoda-Budka

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy....

Publisher: Foundry Research Institute

Foundry Research Institute

Łukasiewicz - Kraków Institute of Technology was established on April 1, 2020 as a result of the merger of two Kraków institutes that are part of the Łukasiewicz Research Network.

Cracow, Poland

Research Institute / Laboratory / School

PCB Surface Finishes & The Cleaning Process - A Compatibility Study

Oct 20, 2021 | Umut Tosun, Naveen Ravindran

All PCBs that are manufactured require a surface finish to protect exposed copper on the surface which if left unprotected, can oxidize, rendering the board unusable. To address this issue, it is common to surface treat the PCB prior to assembly and reflow. The surface finish not only prevents oxidation of the underlying copper, but guarantees a solderable surface. A cost effective and widely used approach to PCB surface finish is HASL (Hot Air Solder Leveling). However, as circuit complexity and component density have increased, HASL has reached its limitations, necessitating the need for thinner coatings. Thus, coatings such as Immersion Tin (ImSn), Immersion Silver (ImAg), Organic Solderability Preservatives (OSP), and Electroless Nickel Immersion Gold (ENIG) are becoming more widely used....

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

Counterfeit Detection Strategies: When to Do It / How to Do It

Oct 12, 2021 | Greg Caswell

Counterfeit components have been defined as a growing concern in recent years as demand increases for reducing costs. In fact the Department of Commerce has identified a 141% increase in the last three years alone. A counterfeit is any item that is not as it is represented with the intention to deceive its buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component could cause catastrophic failure at a critical moment....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Advanced Physical Inspection Methods for Counterfeit IC Detection

Oct 12, 2021 | Sina Shahbazmohamadi, Domenic Forte, and Mark Tehranipoor

The remarkable increase in counterfeit parts (a factor of 4 since 2009) [1] is a huge reliability and security concern in various industries ranging from automotive electronics to sensitive military applications increasing the possibility of premature failure in critical systems [2-5]. Counterfeit parts can also incur a great financial loss to legitimate electronics companies [6]. The issue is even more alarming as the counterfeiters use more sophisticated methods making counterfeit detection a much harder task [7-8]. Therefore, it is reasonable to develop more advanced counterfeit detection methods targeting a more efficient detection of sophisticated counterfeited parts....

Publisher: University of Connecticut

University of Connecticut

The University of Connecticut is a public land-grant research university in Storrs, Connecticut. It was founded in 1881. The primary 4,400-acre campus is in Storrs, Connecticut, approximately a half hour's drive from Hartford and

Storrs, Connecticut, USA

Research Institute / Laboratory / School

A Novel Authentication Methodology to Detect Counterfeit PCB Using PCB Trace-Based Ring Oscillator

Oct 12, 2021 | Dongrong Zhang, Qiang Ren, Donglin Su

The existence of counterfeit products, e.g., integrated circuits (ICs) and printed circuit boards (PCBs), in the modern semiconductor supply chain has seriously jeopardized the security and reliability of electronic systems, and has also caused the loss of suppliers' profit and reputation. Most of existing research papers prevent or detect counterfeit IC and PCB substrate separately, without testing the PCB as a whole, and often require the assistance of external equipment. In this article, a novel ring oscillator- based PCB authentication (ROPA) methodology to detect counterfeit PCB through supply chain is proposed, which ......

Publisher: Beihang University

Beihang University

Beihang University is designated as an eminent key university ( literally a "first-rate university" of type-A[3] ) by China's Ministry of Education Class A . It was one of China's key universities subsidized by "Project 985" fundi

Beijing, China

Research Institute / Laboratory / School

The Effects of Plasma Treatment Prior to Conformal Coating

Oct 06, 2021 | John D. Vanderford, Ann E. Paxton, and Dave Selestak

The corrosion of Nickel-Palladium-Gold (Ni-Pd-Au) finish terminals in humid environments is known to be reduced with the application of a conformal coating such as acrylic. Corrosion has a higher rate of occurrence around the terminal 'knee' of a surface mount component, which may be reduced with the application of conformal coatings. Although radio frequency (RF) plasma processing is generally known to enhance conformity of conformal coating to surfaces through ionic bombardment, the effect on the functionality of assembled printed circuit boards (PCB) is not as well known. The purpose of this study is to assess whether RF plasma processing can enhance the adhesive and coverage qualities of an acrylic conformal coating on PCBs...

Publisher: MARCH Products | Nordson Electronics Solutions

MARCH Products | Nordson Electronics Solutions

MARCH Products is the global leader in plasma cleaning equipment and plasma processing technology for PCB manufacturing and semiconductor packaging. The company has designed and manufactured plasma equipment for 35+ years.

Carlsbad, California, USA

Manufacturer

SMT fluid dispensing
Sell Used SMT & Test Equipment
Now Online
38
Visitors
0
Member

Who are SMTnet visitors?

Become a member now and receive the value and benefits of membership.

Fixate labor costs with selective soldering solutions
Jetting Pump for Integration

Software for SMT