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Technical Library articles |
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CIM Global Joint Guidance for 300 mm Semiconductor Factories: Release Four
Published: |
Aug 05, 1999 |
Author: |
I300I;J300 |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]This document was assembled by the International 300 mm Initiative (I300I) and Japan 300 mm Semiconductor Technology Conference (J300) consortia to provide joint consensus for and to semiconductor industries an... |
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Guide for the Design of Semiconductor Equipment to Meet Voltage Sag Immunity Standards
Published: |
Aug 05, 1999 |
Author: |
Stephens, Mark;Johnson, Dennis;Soward, John;Ammenheuser, Jim |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]
This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage ... |
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Design Guide for Flip Chip and Chip Scale Technology Implementation
Published: |
Aug 05, 1999 |
Author: |
Poon, Tze W. |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]Through joint industry effort, a document entitled ... |
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Evaluation of Valves Used for Delivering Semiconductor Process Chemicals
Published: |
Aug 05, 1999 |
Author: |
Grant, Don;Kelly, Wayne |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]This document provides the results of a study that evaluated the long-term reliability and particle cleanliness of the fluoropolymer valves of three commercial manufacturers.
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Evaluating Automated Wafer Measurement Instruments
Published: |
Aug 05, 1999 |
Author: |
Eastman, Steven A. |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and foc... |
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Guidelines for Manufacturing Equipment Reference Manuals
Published: |
Aug 05, 1999 |
Author: |
Pruett, Victoria J.;Serda, Julian;Shifley, Darin |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on i... |
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The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization
Published: |
Aug 05, 1999 |
Author: |
Miller, Dwight |
Abstract: |
[PDF FILE REQUIRES ADOBE ACROBAT READER]
This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on... |
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PROPERTIES AND PERFORMANCE OF HYBRID ALUMINUM ELECTROLYTIC / ELECTROCHEMICAL CAPACITORS
Published: |
Aug 05, 1999 |
Author: |
John R. Miller, JME, Inc. & David A. Evans, Evans Company |
Abstract: |
Test data was recently presented for a hybrid electrolytic/ electrochemical capacitor having sintered tantalum anodes and RuO2 cathodes. A 50-V, 18-mF capacitor of this design had electrical performance that was comparable to an advanced aluminum ele... |
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IP Switching: ATM Under IP
Published: |
Aug 05, 1999 |
Author: |
Peter Newman, Greg Minshall, and Tom Lyon |
Abstract: |
IP traffic on the Internet and private enterprise networks has been growing exponentially for some time. This growth is beginning to stress the traditional, processor based design of current day routers. Switching technology offers much higher aggreg... |
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Paradigm Shift in SMD Rework
Published: |
Jul 22, 1999 |
Author: |
John F. Dwinell, Sr. |
Abstract: |
A paradigm shift is urgently required within the global electronic production industry to address the unacceptable equipment and methods now commonplace where rework and repair is concerned. While the response to the challenge presented by....... |
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