Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Submit & read papers and articles related to SMT, PCB & EMS electronics manufacturing.


828 SMT / PCB Technical Articles

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Laser Solder Reflow: A Process Solution Part II

Published:

Sep 13, 2007

Author:

EFD, Inc.

Abstract:

With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space....

Glenrothes, Scotland

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Laser Solder Reflow: A Process Solution

Published:

Sep 06, 2007

Author:

EFD, Inc.

Abstract:

EFD Inc. and Leister USA have collaborated to bust the myth that you cannot perform laser reflow with solder paste. Using Leister diode lasers, EFD has formulated solder pastes that survive the rapid reflow cycle typical of laser heating....

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Characteristics of Conformal Coatings

Published:

Aug 28, 2007

Author:

American Competitiveness Institute / EMPF

Abstract:

A conformal coating is defined as a thin polymeric material which covers the surface of an electronic assembly. These coatings are used to provide an electrically insulative and environmentally protective seal or cover to a completed printed circuit ...

Glenrothes, Scotland

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Boundary Scan Skews Test Coverage Tradeoffs in your Favor

Published:

Aug 23, 2007

Author:

ASSET InterTech, Inc.

Abstract:

The complexity and programmability of modern embedded boards means that knowledge built up during debugging and testing must be regarded as Intellectual Property (IP) and therefore preserved. But many of the processes and tools used today do not prov...

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Lead-Free BGA Rework-Transition Issues

Published:

Aug 16, 2007

Author:

Best Inc

Abstract:

While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" and "graininess and lack of shinine...

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Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

Published:

Aug 09, 2007

Author:

Universal Instruments Corporation

Abstract:

Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered p...

Glenrothes, Scotland

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Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Published:

Aug 02, 2007

Author:

Amkor Technology, Inc.

Abstract:

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR). (BLR is also referred to as second level or solder ...

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Two-Photon Polymerization: A New Approach to Micromachining

Published:

Jul 24, 2007

Author:

Aerotech

Abstract:

Femtosecond lasers enable microfabrication with resolution beyond the diffraction limit....

Glenrothes, Scotland

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Reduced Oxide Soldering Activation (ROSA)

Published:

Jul 19, 2007

Author:

American Competitiveness Institute / EMPF

Abstract:

ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory chan...

Glenrothes, Scotland

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Drying & Storage of Moisture Sensitive Devices MSD

Published:

Jul 19, 2007

Author:

X-TREME SERIES AUTO DRY CABINETS

Abstract:

Drying & Storage of Moisture Sensitive Devices getting more and more important. With its reliable design and leading specifications, X-TREME Series auto dry cabinets are suitable for almost all dehumidification applications. ...

Glenrothes, Scotland

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