Apr 29, 2010 | Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints....
Publisher: Flex (Flextronics International)
Apr 22, 2010 | Ronald C. Lasky, Ph.D., PE, Professor Daryl Santos, Ph.D., Joseph R. Cloyd
It is now widely accepted that using designed experiments is the most effective way to optimize surface mount technology (SMT) processes. This situation begs the question "what is an effective strategy in implementing this powerful tool?" This paper will present such a strategy that incorporates Taguchi's approach for screening, full factorial analysis for optimization and central composite design for precise modeling. We will present these techniques using MINITABTM Release 13 statistical software and printed circuit board industry applications....
Publisher: Indium Corporation
Apr 22, 2010 | Subrat Prajapati
Current situation: Present Rejection = 18%.
Sigma Level = 2.42
Scope of Project: Vendor PCB Assembly to Functional Testing of PCBA...
Apr 15, 2010 | Michael D. Frederickson, EMPF Director; Barry Thaler, Ph.D. EMPF Technical Director Empfasis Technical Editor; Paul Bratt, Empfasis Editor.
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages....
The EMPF serves as a corporate residence of expertise in electronics manufacturing.
Philadelphia, Pennsylvania, USA
Apr 15, 2010 | Lynne Dellis, M S Chan, Tom Dueber, Shane Fang, John Summers; DuPont Electronic Technologies
The high level of current interest in embedded passives in printed circuit boards is driven by the tremendous pressure to pack more circuitry into smaller spaces. However, adoption has been limited due to design, prototyping and infrastructure issues, as well as the stability and tolerances necessary for widespread replacement of discretes. The focus of this work has been to develop a polymer thick film resistor technology to incorporate reliable organic resistors inside printed wiring boards using standard PWB processing....
Apr 07, 2010 | Microscan
For effective machine vision, the first step in devising a vision system should be the lighting. This paper reviews important criteria for setting up an effective lighting system....
Mar 30, 2010 | Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J.Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger.
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board....
Publisher: Flex (Flextronics International)
Mar 25, 2010 | Subrat Prajapati; Process Engineering Larsen & Toubro Limited, Medical Equipment and Systems (EBG)
The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects....
Mar 23, 2010 | Cuong Tran, Process Engineer
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology...
IPC is the trade association for the printed wiring board and electronics assembly industries.
Bannockburn, Illinois, USA
Mar 18, 2010 | Renee Michalkiewicz, Gaylon Morris; Trace Laboratories, Inc., Simin Bagheri; Celestica, Inc.
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used....
Publisher: Trace Laboratories