Aug 25, 2011 | Dr. Randy Schueller
While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about the high reflow temperatures of SAC or relies on ODM, it is im...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
Aug 18, 2011 | Microscan
Overview of ESD, Associated Risks and Prevention Measures...
Aug 11, 2011 | Ajay Pal Singh Chauhan, Sharat Chandra Bhardwaj
(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar...
Sant Longowal Institute of Engineering and Technology is an autonomous body, fully funded by Government of India and controlled by SLIET Society.
Distt. Sangrur, Punjab, India
Aug 04, 2011 | William Edward Swaim
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and ...
Publisher: Auburn University
Jul 28, 2011 | Advanced Thermal Solutions, inc.
Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF...
Publisher: Advanced Thermal Solutions, Inc
A leading engineering and manufacturing company supplying a wide range of heat sinks and laboratory-quality thermal instrumentation, together with thermal design consulting.
Norwood, Massachusetts, USA
Jul 21, 2011 | Eric Klaver, Senior Product Manager
In high-volume production, it is the price of the end product that matters. Purchasing decisions for production equipment therefore usually boil down to price divided by output modified by some efficiency factor....
Jul 14, 2011 | R. Massey, N. Wood, J. Huang
In this paper, the concept for the next generation of resist stripper solutions is introduced, with specific emphasis upon development of new solutions targeted at the ever demanding fine line applications. The novel formulation used minimises the initial...
Jul 07, 2011 | E.Boni, D. Montanari, L. Caliari, F. Bregoli, L. Barbieri, F. Bergamaschi
The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components...
Publisher: KEMET Electronics Corporation
Jun 29, 2011 | Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address...
Publisher: Shea Engineering Services
Jun 28, 2011 | ZESTRON
ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....
Publisher: ZESTRON Corporation