Jan 12, 2012 | Ronak Varia, Xuejun Fan
In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi...
The mission of the Department of Mechanical Engineering at Lamar University is to provide high quality education and meaningful career opportunities for its graduates.
Beaumont, Texas, USA
Jan 05, 2012 | Greg Caswell
Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
Dec 29, 2011 | Jim Hines, Adam Stanczak, David Decker, Theeraphong Kanjanupathum
2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi...
Dec 22, 2011 | Prawin, Paulraj , Paul, Brian K.
This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate ch...
Providing an education that prepares our students as entrepreneurial, team-oriented, and work-ready graduates in mechanical, industrial, and manufacturing engineering and energy engineering management
Corvallis, Oregon, USA
Dec 15, 2011 | I.Zednickova, M.Biler, J.Petrzilek, T.Zednicek
manganese dioxide or conductive polymer cathode. Higher stability is achieved by placement of the capacitor into an SMD case filled by an inert atmosphere and hermetically sealed. The long term stability testing performed on such hermetically sealed capac...
Publisher: AVX Corporation
A leading international electronic supplier of components and connectors with worldwide manufacturing facilities, offering the world's broadest selection of passive electronic components.
Fountain Inn, South Carolina, USA
Dec 08, 2011 | Chrys Shea - Shea Engineering Services, Ray Whittier - Vicor Corporation
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c...
Publisher: Shea Engineering Services
Dec 01, 2011 | Dr Ronald C. Lasky
Are electronics any “greener” than before RoHS? It is a fair question to ask. With the advent of RoHS on July 1, 2006, and more recently REACH, one might be inclined to answer that it is greener than it was. We will take a look at this question in several...
Publisher: Indium Corporation
Nov 25, 2011 | Norocel Codreanu, Radu Bunea, Paul Svasta
The article presents virtual and real investigations related to current capacity and fusing of PCB traces in high power applications and is based on a scientific paper delivered by authors at SIITME 2010 in Romania. The reason of performing the research a...
CETTI offers a substantial support in electronic packaging activities for innovative SMEs, and sustains training for continuing education of the human resource involved in electronics industry.
Nov 16, 2011 | Dave Becker
Flexible Circuits are proven, reliable interconnect solutions for many of today's electronic packages. This article gives some general guidelines in terms of "dos" and "don'ts" that will help the engineer or designer make better decisions when using flex...
Publisher: All Flex Flexible Circuits, LLC
Nov 10, 2011 | John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity ...
iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.
Herndon, Virginia, USA