Jul 07, 2011 | E.Boni, D. Montanari, L. Caliari, F. Bregoli, L. Barbieri, F. Bergamaschi
The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components...
Publisher: KEMET Electronics Corporation
Jun 29, 2011 | Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address...
Publisher: Shea Engineering Services
Jun 28, 2011 | ZESTRON
ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....
Publisher: ZESTRON Corporation
Jun 23, 2011 | Jasbir Bath, Gordon Clark, Tim Jensen, Renee Michalkiewicz, Brian Toleno
Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free solde...
Publisher: Indium Corporation
Jun 16, 2011 | Roger Massey, Adrian Zee
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume ...
Jun 09, 2011 | Brian J. Leach
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and...
Publisher: AccuSpec Electronics, LLC
Jun 09, 2011 | Craig Leising
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla...
Jun 02, 2011 | Edward Wyrwas, Lloyd Condra, Avshalom Hava
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
May 26, 2011 | Ila Pal
The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde...
Publisher: Ironwood Electronics
May 19, 2011 | Sjef v. Gastel, Manager of Advanced Development, Assembléon
Electronic equipment manufacturers know that rework and scrap cost them money, but rarely know just how much. Calculating it is relatively straightforward knowing the production line’s First Pass Yield (FPY), though....