Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Europlacer SMT Pick & Place Machines
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
614 SMT / PCB Technical Articles

Design Environment ROI: How Design Teams On A Budget Can Build A Best In Class Design Environment

Apr 22, 2008 | Nolan Johnson

Design workflow is the core to your design team's competitive advantage; it’s the conduit by which you turn your team's expertise and ideas into manufacturable products. And yet, all engineering teams face the challenge of maximizing their productivity within limited financial resources. How can the less-capitalized teams develop a design workflow that competes with the highly-capitalized teams? Simple: open tools....

Publisher: Sunstone Circuits

Sunstone Circuits

Sunstone Circuits offers a family of PCB Services to meet all of your PCB needs from design to delivery! We are trusted innovators in the marketing and manufacture of quickturn PCBs, design-checked boards, and design software.

Mulino, Oregon, United States

Manufacturer of Assembled PCBs

Laser Direct Imaging of Tracks on PCB Covered With Laser Photoresist

Apr 15, 2008 | R. Barbucha, M. Kocik, J. Mizeraczyk , 2, G. Kozioł, and J. Borecki, Polish Academy of Sciences

The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges....

Publisher: Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...

Warsaw, Poland


Strength of Lead-free BGA Spheres in High Speed Loading

Apr 08, 2008 | Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension....

Publisher: Nihon Superior Co., Ltd.

Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Osaka, Japan

Manufacturer of Assembly Material, Soldering

High Reliability Lead-free Solder SN100C?Sn-0.7Cu-0.05Ni?Ge?

Mar 31, 2008 | Satoshi Mizuta

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C....

Publisher: Nihon Superior Co., Ltd.

Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Osaka, Japan

Manufacturer of Assembly Material, Soldering

Embedded Thermoelectric Cooling

Mar 25, 2008 | Jesko von Windheim, Nextreme Thermal Solutions

Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surface mount approaches. In order to take advantage of these unique characteristics, thin film thermoelectric devices need to be designed for the appropriate thermal and form-factor environments, with system-level constraints carefully considered as an integral part of the overall design process....

Publisher: Nextreme Thermal Solutions, Inc.

Nextreme Thermal Solutions, Inc.

Nextreme designs and manufactures manufactures micro-scale electronics cooling and energy harvesting solutions for telecommunications, semiconductor, consumer, medical, aerospace and government markets.

Durham, North Carolina, United States


Pin in Paste Stencil Design for Notebook Mainboard

Mar 18, 2008 | Atilim Demirtas, Vestel Digital

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles....

Publisher: Vestel Electronic

Vestel Electronic

Presently,Vestel is the biggest TV manufacturer in Europe and increasing it's capacity year by year. As a OEM and ODM,we export our product every continent in the world.

Manisa, Turkey


Comparing Techniques for Temperature-Dependent Warpage Measurement

Mar 13, 2008 | Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer, Akrometrix.

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique....

Publisher: Akrometrix


Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, United States

OEM, Service Provider

Fundamentals of Solder Paste Technology

Mar 03, 2008 | Dosten Baluch, Gerard Minogue.

Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands on materials and processes in SMT, requiring materials and process engineers to adopt to lead free whilst ensuring process yields stay at the highest possible levels. Key is the solder paste, a material of great complexity involving engineering sciences, metallurgy, chemistry and physics. This article helps those working with solder pastes improve their understanding of this key material....

Publisher: BizEsp Ltd.

BizEsp Ltd.

The company is currently in liquidation.

Oxford, United Kingdom


Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Feb 26, 2008 | Michael J. Rowlands, Rabindra N. Das

More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Placement Optimisation in a Lean Manufacturing Environment

Feb 20, 2008 | Pierre Chatain, Europlacer Limited, Dorset, UK

Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques....



Europlacer designs and manufactures a comprehensive range of highly flexible SMT pick and place equipment for the global electronics industry, with a network of distributors across the globe.

Poole Dorset, United Kingdom

Manufacturer of Assembly Equipment, Pick and Place

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