Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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589 SMT / PCB Technical Articles

Maximizing Production Productivity of Automatic Termination Machines

Nov 08, 2007 | Rob Boyd.

ways to increase machine utilization and productivity for automatic termination machines. This article will discuss just a few of the basic concepts. For some, this may seem academic, but going over the basics is a good reminder so we don’t overlook best practices. So, how do we get more products out the door every day?...

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Making A Case for Continuous Furnaces

Nov 08, 2007 | Fred Dimock

A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....

Publisher: BTU International

BTU International

North Billerica, Massachusetts, United States

Manufacturer of Assembly Equipment

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

Nov 01, 2007 | Rabindra N. Das, Konstantinos I. Papathomas, John M. Lauffer and Frank D. Egitto

This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,...

Publisher: Endicott Interconnect Technologies

Endicott Interconnect Technologies

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Providing customers with solutions in Information Technology, Communications, Instrumentation, Simulation, Medical, Aerospace/Defense and Automotive industries

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Oct 25, 2007 | Michael J. Rowlands, Rabindra Das.

More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing precise structures and making a reliable finished product. A new substrate technology is presented that addresses these challenges....

Publisher: Endicott Interconnect Technologies

Endicott Interconnect Technologies

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Providing customers with solutions in Information Technology, Communications, Instrumentation, Simulation, Medical, Aerospace/Defense and Automotive industries

A Practical Guide to Achieving Lead-Free Electronics Assembly

Oct 18, 2007 | Karl Seelig, David Suraski

To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains to considerations regarding design, components, PWBs, solder alloys, fluxe s, printing, reflow, wave soldering, rework, cleaning, equipment wear & tear and inspection....

Publisher: AIM Solder

AIM Solder

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Maximizing Process Control with Controlled Convection Rates

Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.

Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....

Publisher: BTU International

BTU International

North Billerica, Massachusetts, United States

Manufacturer of Assembly Equipment

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

RF Packaging Advancements for Navy Applications

Oct 02, 2007 | Fred Verdi, EMPF Technical Director

The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share of the electronics market driven by Department of Defense (DoD) applications has created a niche market for RF qualified devices. The DoD, with its emphasis on COTS (Commercial Off The Shelf) and "Open" systems, is beginning to become more interested in using commercially oriented RF devices for military applications as a means to leverage the volumes and innovations of the commercial world....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

Philadelphia, Pennsylvania, United States

Other

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards

Sep 27, 2007 | Jay B. Hinerman, DEK Inc; K. Srihari, Ph.D., Department of Systems Science and Industrial Engineering State University of New York; George R. Westby, Director - SMT Laboratory, Universal Instruments Corporation.

Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering....

Publisher: Universal Instruments

Universal Instruments

Conklin, New York, United States

Manufacturer of Assembly Equipment

Provider of circuit, semiconductor, back-end assembly technologies and equipment, as well as integrated system solutions to manufacturers in various sectors of the electronics industry.

Laser Solder Reflow: A Process Solution Part II

Sep 13, 2007 | John Vivari; EFD, Inc., Alex Kasman, Leister Technologies USA

With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space. Where technique comes in is choosing where and for how long to apply that light along with the application of accessory equipment to optimize solder paste reflow. This presentation covers the specifics of how to determine which process choices are the right process choices based on the needs of your product to maximize yield and throughput....

Publisher: Nordson EFD

Nordson EFD

East Providence, Rhode Island, United States

Adhesives/Dispensing

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

Laser Solder Reflow: A Process Solution Part I

Sep 06, 2007 | John Vivari; EFD, Inc., Alex Kasman, Leister Technologies USA

EFD Inc. and Leister USA have collaborated to bust the myth that you cannot perform laser reflow with solder paste. Using Leister diode lasers, EFD has formulated solder pastes that survive the rapid reflow cycle typical of laser heating. These solder pastes reflow and wet well, without spatter, even when heating is accomplished in less than half a second. The flux core in wire solders cannot boast such flux spatter resistance in such an aggressive heating environment....

Publisher: Nordson EFD

Nordson EFD

East Providence, Rhode Island, United States

Adhesives/Dispensing

The world's leading designer and manufacturer of precision dispensing systems that apply accurate, consistent amounts of the adhesives, sealants, lubricants and other assembly fluids used in virtually every manufacturing process.

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