Dec 09, 2010 | Cadence
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int...
Publisher: Cadence Design Systems, Inc.
Dec 02, 2010 | Barry Olney
Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...
Publisher: In-Circuit Design Pty Ltd
Dec 02, 2010 | Lynn Parker
The purpose of this white paper is to provide an overview of solder paste inspection (SPI) and to introduce dynamic image technology which is an improved solution for SPI optical inspection. Dynamic imaging measures surface profiles of solder paste for pr...
Publisher: TRI - Test Research, Inc.
Nov 24, 2010 | Bob Wettermann
As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap...
Publisher: BEST Inc.
Nov 18, 2010 | Philip Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa
In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is...
Publisher: EoPlex Technologies, Inc.
Nov 16, 2010 | Chris Carlson
The Net Tie is a component type which allows for shorting together various nets in a design. The graphic for the symbol can be as simple as two component pins representing a virtual component between nets or as complex as mutipul pins (as many as desired)...
Nov 12, 2010 | Sjef v. Gastel, Manager of Advanced Development, Assembléon
Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyo...
Nov 06, 2010 | Tsun-kit Chin
An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on ...
Publisher: Samtec, Inc.
Nov 04, 2010 | Dr. Ken Gilleo
Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab...
Publisher: Cookson Electronics
Oct 28, 2010 | Benson Chan, How Lin, Chase Carver, Jianzhuang Huang, Jessie Berry
Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven...
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, USA