Electronics Manufacturing Technical Articles

Dec 06, 2007

BTU International

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consume...

Nov 29, 2007

Universal Instruments Corporation

High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts are focussed on the optimized routing of signal, power and ground connections. More often overlooked are some o...

Nov 21, 2007

Endicott Interconnect Technologies

This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol-gel thin films. In particular, recent developments on high capacitance, large area, and thin flexible embedded capacitors are highlighted....

Nov 15, 2007

Peter Biocca, Carlos Rivas

At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave solderin...

Nov 08, 2007

Schleuniger, Inc.

In the past, it was typical to see production batch sizes for automatic termination machines between 1000 and 5000 pieces or more. Most companies would simply make a large batch of parts and stock the parts until they were needed. Because of lean m...

Nov 08, 2007

BTU International

A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the vari...

Nov 01, 2007

Endicott Interconnect

This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,...

Oct 25, 2007

Endicott Interconnect Technologies

More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing prec...

Oct 18, 2007

AIM

To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains...

Oct 10, 2007

BTU International

Today�s convection ovens are equipped with several key control elements. One is temperature, obviously. Another is belt speed. A third is the gaseous atmosphere used. Convection control is an additional, albeit optional, means of control that directl...