Technical Library articles |
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2001 Dummy Components Product Guide
Published: |
Nov 13, 2000 |
Author: |
TopLine Dummy Components |
Abstract: |
Free 64 page book describes 1000 different SMD component packages. Easy-to-read format. Shows standard quantity in tubes, trays and in reels. Also includes components available Bulk Chip Feeder Cassesttes for chip shooters. A valuable reference.... |
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Quick Study Guide to Dummy Components
Published: |
Nov 13, 2000 |
Author: |
TopLine Dummy Components |
Abstract: |
Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components.
It's not just for dummies.... |
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Dummy Components Part Numbering System
Published: |
Nov 13, 2000 |
Author: |
TopLine Dummy Components |
Abstract: |
Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips. A must have for your reference library. ... |
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Quick Guide to Daisy Chain
Published: |
Nov 13, 2000 |
Author: |
TopLine |
Abstract: |
Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more. Excellent reference guide for your test vehicles.... |
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SMD Nomenclature - in Plain English
Published: |
Nov 13, 2000 |
Author: |
TopLine Dummy Components |
Abstract: |
Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included.... |
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Autorouting Techniques for Multichip Modules
Published: |
Nov 08, 2000 |
Author: |
John Cofield |
Abstract: |
Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the
technology. While the design process is very much the same, MCM manufacturing processes vary
dramatically. ... |
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Stencil Cleaner Meets Stringent EPA Rules
Published: |
Jul 14, 2000 |
Author: |
U.S. Tech |
Abstract: |
The U.S. Environmental Protection Agency has verified the superior efficacy of the Smart Sonic Stencil Cleaning Process and the EPA has certified it to be both environmentally safe and user safe. No other stencil cleaning process has met these stric... |
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Reflow Profiling: The Benefits of Implementing a Ramp-to-Spike Profile
Published: |
Jun 27, 2000 |
Author: |
AIM |
Abstract: |
This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile.... |
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Environmentally Certified Technologies: A Case Study
Published: |
Jun 21, 2000 |
Author: |
SMT Magazine, July 1999 |
Abstract: |
Stencil cleaning is potentially the most hazardous process associated with SMT assembly. Many cleaning agents are known carcinogens or cause fetal disorders. Flammable solvents such as alcohol and terpines are known to explode in batch cleaner opera... |
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QuoteWin Upgrades Reinforce Continued Market Leadership for PolyDyne Software Inc.
Published: |
May 10, 2000 |
Author: |
PolyDyne Software |
Abstract: |
April 2000; Austin, Texas: Supply chain management solution provider PolyDyne Software Inc. (PolyDyne) has released a new version of QuoteWin, the market-leading quote processing tool for contract manufacturers.
QuoteWin 5.0 is the latest versi... |
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