Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools

837 SMT / PCB Assembly Related Technical Articles

Low Surface Energy Coatings Rewrites the Area Ratio Rules

Jun 20, 2013 | Ricky Bennett; Assembly Process Technologies, Eric Hanson; Aculon

With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process....

Publisher: Assembly Process Technologies LLC

Assembly Process Technologies LLC

With over 20 years of experience in the electronic and semiconductor assembly design, we offer rapid prototypes for R&D or New Product Introduction.

Flemington, New Jersey, USA

Service Provider

Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC: A Computational Model

Jun 13, 2013 | Wei Yao, Cemal Basaran

Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry......

Publisher: Electronic Packaging Laboratory, State University of New York

Electronic Packaging Laboratory, State University of New York

The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices.

Buffalo, New York, USA

School

Best Practices Reflow Profiling for Lead-Free SMT Assembly

Jun 05, 2013 | Ed Briggs and Ronald C. Lasky, Ph.D., PE.

The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Crimp Quality Standards Comparison and Trends

Jun 05, 2013 | Rob Boyd, Crimping Product Manager

Quality standards are getting tougher each year. In these difficult times, wire harness manufacturers are looking to expand business in their existing markets and are looking for new markets. The following article will compare and contrast the current quality standards that are most commonly used today. It will review proper measurement techniques, discuss some trends in crimp quality, and address methods to improve efficiency in quality data collection....

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, USA

Other

Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence

May 30, 2013 | Michael Haller, Volker Rößiger, Simone Dill

This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions ...

Publisher: Fischer Technology, Inc.

Fischer Technology, Inc.

A manufacturer of instruments for non-destructive coating thickness measurement, micro- and nanoindentation measurement, material testing, and material analysis including calibration standards and certification.

Windsor, Connecticut, USA

Inspection, OEM

IPC Standards and Printed Electronics Monetization

May 23, 2013 | Daniel Gamota

Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials, scalable ambient processes, and high volume manufacturing technologies lends itself to offer an opportunity for sustained manufacturing innovation. The success of introducing a new manufacturing technology is strongly dependent on the ability to achieve high final product yields at current or reduced cost. In the past, standards have been the critical vehicles to enable manufacturing success... First published in the 2012 IPC APEX EXPO technical conference proceedings....

Publisher: Printovate Technologies, Inc.

Printovate Technologies, Inc.

Providing product design, manufacturing design, and new product introduction services for clean-tech electronics products.

Palatine, Illinois, USA

Assembly, Service Provider

iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials

May 16, 2013 | John Davignon, iNEMI Chair

In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free) within the Client Market space (Desktop and Notebook computers) iNEMI initiated a HFR-Free Leadership Workgroup to evaluate the readiness of the Industry to make this transition. The HFR-Free Leadership WG concluded that the electronic industry is ready for the transition and that the key electrical and thermo-mechanical properties of the new HFR-Free laminates can meet the required criteria. The HFR-Free Leadership WG verified that the laminate suppliers can meet the capacity demands for these new HFR-Free laminates and developed a "Test Suite Methodology" (TSM) that can facilitate the comparison and choice of the right laminate to replace brominated FR4 in the Client space... First published in the 2012 IPC APEX EXPO technical conference proceedings....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

Maximize Test Coverage While Optimizing Costs

May 10, 2013 | Paul Groome

In today’s manufacturing environments, optimizing manufacturing costs and, especially Test and Inspection costs are high on most company’s agendas. Resources are tight and many employees have multiple roles to fulfill across the whole manufacturing line so, time is limited. Test suppliers need to provide a suite of tools to ensure the highest level of quality for customer shipments. ...

Publisher: Digitaltest Inc.

Digitaltest Inc.

Digitaltest is a Leading Test Equipment Supplier of; High Accuracy Flying Probe Systems. High Speed, Non-Multiplexed, In-Circiuit Test Solutions. Functional Test Solutions. CAD/CAE, SPC and CAD Translation Software.

Concord, California, USA

Manufacturer of Assembly Equipment, Test Services, OEM, Software Manufacturer

Impact of Dust on Printed Circuit Assembly Reliability

May 09, 2013 | Bo Song, Michael H. Azarian and Michael G. Pecht

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings....

Publisher: CALCE Center for Advanced Life Cycle Engineering

CALCE Center for Advanced Life Cycle Engineering

The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

College Park, Maryland, USA

Service Provider, Training Provider

Existing and Emerging Opportunities in Printed Electronics For Printers

May 02, 2013 | Don Banfield

Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing. Discussion of requirements for understanding the technology of these applications in order to capitalize on them... First published in the 2012 IPC APEX EXPO technical conference proceedings....

Publisher: Conductive Compounds, Inc.

Conductive Compounds, Inc.

Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.

Hudson, New Hampshire, USA

Manufacturer of Assembly Material, Components/Substrates

fluid dispensing pumps for integration

How FactoryLogix Helped Sparton Corp. Achieve Regulatory Compliance