Mar 22, 2012 | Raymond G. Clark, Joseph D. Poole, TT Electronics - IMS
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha...
Perry , Ohio, USA
Mar 15, 2012 | Nagesh Gupta
Increases in field-programmable gate array (FPGA) capabilities, combined with growing system complexity, have created many FPGA-based system design challenges. One key challenge is choosing the right FPGA for the design needs, and maximizing the use of FP...
Publisher: Cadence Design Systems, Inc.
Mar 15, 2012 | Bernd Krauss, Turck-Duotec, Grünhain-Beierfeld, Jürgen Friedrich
The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their ...
Publisher: ASYS Group
Mar 08, 2012 | John M. Radman, Renee J. Michalkiewicz and Daniel D. Phillips
You may have heard talk in the news lately regarding counterfeit electronic components making it into the US military supply chain. The U.S. Senate Armed Services Committee (SASC) recently reported in the Counterfeit Electronic Parts in the Defense Department Supply Chain hearing held on November 17, 2011, 1,800 cases of suspected counterfeit components that went into more than 1 million individual products. If you consider this number for the military, we can only imagine the number of counterfeits in our commercial yet high reliability products, such as life support or other critical systems. If you are the person within your electronics-based company who must perform risk analyses, counterfeiting is not a new concern, yet many do not realize just how good counterfeiters have become at their "trade"....
Publisher: Trace Laboratories
Mar 01, 2012 | Eric Klaver, Senior Product Manager
The struggle to survive in the world of manufacturing is prompting many volume-driven manufacturing sites in the west to specialize in small batch manufacturing. The aim is to bring value to their customers with fast-turnaround prototyping and reduced int...
Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...
Publisher: Vi TECHNOLOGY
Feb 16, 2012 | Jim Nadolny, Leon Wu
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel...
Publisher: Samtec, Inc.
Feb 09, 2012 | Curtis Smith, Huntron Technical Support
The Fundamentals of Signature Analysis Technical document discusses the basics of power-off analog signature analysis, how it relates to basic electronic devices and how it is used for circuit board troubleshooting....
Publisher: Huntron, Inc.
Feb 02, 2012 | Nicolas Lietaer, Thor Bakke, Anand Summanwar (SINTEF), Per Dalsjø, Jakob Gakkestad (Norwegian Defence Research Establishment), Frank Niklaus (KTH – Royal Institute of Technology)
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S...
Scandinavia's largest independent research organisation. Every year, SINTEF supports research and development at 2,000 or so Norwegian and overseas companies via its research and development activity.
Jan 26, 2012 | Jonathan Friedman, Newton Truong, Mani B. Srivastava
In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num...