Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • PCB X-ray inspection
  • Aegis Industrial Software
  • PCB X-Ray Inspection
  • PCB Rework Tools
  • high speed SMT pick and place - Mirae Mx400
675 SMT / PCB Technical Articles

PCB Stack-Up

Jan 20, 2011 | Henry Ott Consultants

PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo...

Publisher: Henry Ott Consultants

Henry Ott Consultants

A consulting and training organization specializing in the field of Electromagnetic Compatibility (EMC) and Signal Integrity (SI).

Livingston, New Jersey, United States

Training / Education

Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)

Jan 13, 2011 | Terry Munson

The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin ...

Publisher: Foresite Inc.

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, United States

Cleaning, Test Services, Publication or Online Resource, Service Provider, Training / Education

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Jan 06, 2011 | Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar

The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ...

Publisher: KIC

KIC

KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.

San Diego, California, United States

Software Manufacturer

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Dec 22, 2010 | Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Heat Management in Printed Circuit Boards

Dec 16, 2010 | Jakob Dieterle

This report discusses the significance of heat management in the design of printed circuit boards (PCB). After an introduction into the basics of PCBs the crucial mechanisms of heat transfer are discussed with regard to significance and typical design par...

Publisher: Lund University, The Faculty of Engineering

Lund University, The Faculty of Engineering

The Faculty of Engineering at Lund University is among the leading engineering faculties in Europe, with more than 7000 undergraduates and 800 postgraduates.

Lund, Sweden

Training / Education

3D ICs With TSVs - Design Challenges And Requirements

Dec 09, 2010 | Cadence

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int...

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, United States

Design

Multilayer PCB Stackup Planning

Dec 02, 2010 | Barry Olney

Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Service Provider

Dynamic Imaging Technology - Improved Solution for 3D Solder Paste Inspection (SPI) Technology

Dec 02, 2010 | Lynn Parker

The purpose of this white paper is to provide an overview of solder paste inspection (SPI) and to introduce dynamic image technology which is an improved solution for SPI optical inspection. Dynamic imaging measures surface profiles of solder paste for pr...

Publisher: TRI - Test Research, Inc.

TRI - Test Research, Inc.

The leading brand in the global automated inspection and testing equipment market. AOI, AXI, In-Circuit Testers, Board Testers, Solder-Paste Inspection, Manufacturing Defects Analyzers & Integrated Circuit Testers.

Taipei, Taiwan

Inspection

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Nov 24, 2010 | Bob Wettermann

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap...

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

A High Performance and Cost Effective Molded Array Package Substrate

Nov 18, 2010 | Philip Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa

In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is...

Publisher: EoPlex Technologies, Inc.

EoPlex Technologies, Inc.

Advanced materials company that builds small devices to generate and manage energy for various manufacturing components.

Redwood City, California, United States

Subcontractor

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SMT Equipment

FPC - Fluid Pressure Control