Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Inline SMT Stencil Printers
  • Electronics manufacturing training materials - IPC, solder
  • PCB X-Ray Inspection
  • PCB Rework Tools
774 SMT / PCB Technical Articles

Lead-free SMT Soldering Defects How to Prevent Them

Oct 23, 2012 | Peter Biocca, Senior Development Engineer

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003....

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Oct 18, 2012 | Julie Silk, Jianbiao Pan, Mike Powers

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish....

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer of Assembly Equipment

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Oct 11, 2012 | Mustafa Özkök, Joe McGurran, Dieter Metzger, Hugh Roberts

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Components/Substrates, Manufacturer of Assembly Material, Manufacturer of Components

Reliability of BGA Solder Joints after Re-Balling Process

Oct 04, 2012 | M.H. Biglaria, A. Nazariana, R. Denteneera, M. Biglari, Jra, A.A. Kodentsov

First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t...

2 comments.

Publisher: Mat-tech

Mat-tech

Mat-tech is your specialist in high-tech soldering & brazing. Whether it's developing a new product or improving an existing product, we provide the perfect joint.

Eindhoven, Noord-Brabant, Netherlands

Service Provider, Soldering

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

Sep 27, 2012 | Jie Wan, Junqi Tang, Xianping Zeng

First published in the 2012 IPC APEX EXPO technical conference proceedings. Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembl...

2 comments.

Publisher: Shengyi Technology Co., Ltd.

Shengyi Technology Co., Ltd.

Shengyi is the biggest manufacturer of copper clad laminates in China. Its products are used for making single side, double side, and multilayer printed circuits boards.

Dongguan, Guangdong, China

Laminates, Manufacturer of Assembly Material

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

Sep 20, 2012 | Khaw Mei Ming, Andrey Lee

First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin...

5 comments.

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer of Assembly Equipment

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Sep 13, 2012 | Ward Gatza; Agilent Technologies, Inc., Tom Evans; Thomas C. Evans Consulting

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor...

2 comments.

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer of Assembly Equipment

Pad Cratering - The Invisible Threat to the Electronics Industry

Sep 06, 2012 | Chris Hunrath

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pad Cratering opens circuits. This occurs when the resin crack (fracture) migrates through a copper trace or via. This happens at assembly, in service or during handling. When com...

6 comments.

Publisher: Integral Technology, Inc

Integral Technology, Inc

Manufacturer and distributor of HDI electronic materials for the printed circuit board industry

Lake Forest, California, USA

Laminates, Manufacturer of Assembly Material

Inclusion Voiding in Gull Wing Solder Joints

Aug 30, 2012 | T.L. Lewis, C.O. Ndiaye, J.R. Wilcox

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications....

1 comments.

Publisher: IBM Corporation

IBM Corporation

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Other, Software Manufacturer

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Aug 23, 2012 | Susan D. Landry

First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res...

Publisher: Albemarle Corporation

Albemarle Corporation

Albemarle is a leading specialty chemical company providing innovative chemistry solutions to customers in over 100 countries around the world.

Baton Rouge, Louisiana, USA

Components/Substrates

per page.

SP700avi inline stencil printer

PCB Soldering Tools