Aug 26, 2010 | Siemens PLM Software
Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide. Recalls are costly and time-consuming events that should be avoided entirely. But without adequate process traceability and product genealogy, too many customers will get defective products and too many products will be recalled for repair or replacement even though they are not defective. Both scenarios have enormous implications for the quality-conscious manufacturer that gets rated on the number of recalls it performs - not to mention the enormous direct costs. The core issue is visibility into product quality....
Publisher: ASM Assembly Systems
Aug 26, 2010 | Murata
Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some of the challenges that may be encountered when implementing an RFID system...
Publisher: Murata Manufacturing Co., Ltd.
Aug 26, 2010 | CODICO GmbH, Yamaichi Electronics
The advantages of the Compression Mount Technology (CMT) when using AdvancedTCA and MicroTCA connectors....
Publisher: Yamaichi Electronics
Yamaichi Electronics is an international manufacturer of Memory Card connectors, test & burn-in-sockets, production sockets, test contactors, and high-density connectors.
San Jose, California, United States
Aug 19, 2010 | Dong Zhang, Meg Tredinnick, Mark Challingsworth
The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to ...
Aug 19, 2010 | Griff Derryberry
This article looks at each of the roles of the engineer and PCB designer, considers the traditional design process, and makes suggestions on how the designer can contribute significantly to improving a design’s overall signal integrity while simultaneousl...
Aug 05, 2010 | Bart O. McCoy, Robert Techentin, Benjamin Buhrow, Kevin Buchs, Dr. Barry K. Gilbert, Dr. Erik S. Daniel, How Lin
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me...
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, United States
Jul 29, 2010 | Satoshi Kataoka, Eric Klaver
The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult to see, let alone place reliably with high accuracy. Designers were reluctant to...
Jul 22, 2010 | Jens Kokott
The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic assemblies. Depending on batch size and product mixture, AOI systems as Inline integration or as a stand-alone solution benefit efficien...
Publisher: GOEPEL Electronic
Jul 15, 2010 | Bob Wettermann
When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problem...
BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.
Rolling Meadows, Illinois, United States
Jul 08, 2010 | T. Ryno, A. Kelley, J. Metzger, and D. Medlin; Department of Materials and Metallurgical Engineering, South Dakota School of Mines and Technology | C. Voyles, S. Richards; Radiance Technologies
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting....
Publisher: Radiance Technologies