Oct 28, 2010 | Benson Chan, How Lin, Chase Carver, Jianzhuang Huang, Jessie Berry
Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven...
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, United States
Oct 21, 2010 | F.M. Collins, W.M. Mathias
Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab...
Oct 21, 2010 | Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling
Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects....
Publisher: Auburn University
Oct 13, 2010 | Dipl.-Ing. Hartmut Berndt
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So, it is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation will give ...
Publisher: B.E.STAT European ESD Competence Centre
Oct 07, 2010 | Ila Pal
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin...
Publisher: Ironwood Electronics
Sep 30, 2010 | Tz-Sheng Peng, Chiou-Shann Fuh
As technology is much more advanced nowadays, electronic devices are ubiquitous in our daily life. PCB (Printed Circuit Board) plays an important role in almost every modern electronic device. However, there still is not a perfect PCB manufacturing proces...
Publisher: National Taiwan University
NTU is the top-ranked university in Taiwan and placed among the best 95 universities in the world.
Sep 23, 2010 | Hana Charvátová, Dagmar Janáčová, Miloslav Fialka and Karel Kolomazník
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi...
Publisher: Acta Montanistica Slovaca
Sep 23, 2010 | Brian Toleno, Ph.D., Henkel Corporation
If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it....
Publisher: Henkel Electronic Materials
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Irvine, California, United States
Sep 16, 2010 | Evstatin Krastev, David Bernard
With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de...
Publisher: Nordson DAGE
Sep 10, 2010 | M. N. Srinivasa Prasad.
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....