Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Soldering Robots
  • Electronics manufacturing training materials - IPC, solder
  • PCB X-Ray Inspection
  • PCB Rework Tools
766 SMT / PCB Technical Articles

Inclusion Voiding in Gull Wing Solder Joints

Aug 30, 2012 | T.L. Lewis, C.O. Ndiaye, J.R. Wilcox

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications....

1 comments.

Publisher: IBM Corporation

IBM Corporation

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Other, Software Manufacturer

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Aug 23, 2012 | Susan D. Landry

First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res...

Publisher: Albemarle Corporation

Albemarle Corporation

Albemarle is a leading specialty chemical company providing innovative chemistry solutions to customers in over 100 countries around the world.

Baton Rouge, Louisiana, USA

Components/Substrates

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

Aug 16, 2012 | David M. Lee, Lesly A. Piñol, PhD

First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu...

1 comments.

Publisher: Johns Hopkins Applied Physics Laboratory

Johns Hopkins Applied Physics Laboratory

The Applied Physics Laboratory (APL) is a not-for-profit center for engineering, research, and development.

Laurel, Maryland, USA

Association, Non-Profit, Training / Education

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments

Aug 09, 2012 | Mustafa Özkök, Joe McGurran, Hugh Roberts. Kenneth Lee, Guenter Heinz

First published in the 2012 IPC APEX EXPO technical conference proceedings. Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field failures and huge losses, which annually total several bi...

7 comments.

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Components/Substrates, Manufacturer of Assembly Material, Manufacturer of Components

An Investigation of Whisker Growth on Tin Coated Wire and Braid

Aug 02, 2012 | Dave Hillman, Tim Pearson, Thomas Lesniewski

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o...

Publisher: Rockwell Collins

Rockwell Collins

Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.

Cedar Rapids, Iowa, USA

Manufacturer of Assembled PCBs, Other

Minimizing Voiding In QFN Packages Using Solder Preforms

Jul 27, 2012 | Seth J. Homer, Ronald C. Lasky, PhD, PE

First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

New Developments in PCB Laminates

Jul 19, 2012 | Dean Hattula, John Coonrod

First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high...

Publisher: Rogers Corporation, Advanced Circuit Materials Division

Rogers Corporation, Advanced Circuit Materials Division

A global technology leader in the development of high performance printed circuit materials for use in markets, including portable communications, communications infrastructure, aerospace and defense.

Chandler, Arizona, USA

Laminates, Manufacturer of Assembly Material

Thermal Characteristics of PCB Laminates used in High Frequency Applications

Jul 11, 2012 | John Coonrod

As technology advances, understanding thermal management issues of high frequency PCB's increases. There are many different aspects to consider for PCB thermal management. This paper will investigate thermal management issues of high frequency PCB's as it...

Publisher: Rogers Corporation, Advanced Circuit Materials Division

Rogers Corporation, Advanced Circuit Materials Division

A global technology leader in the development of high performance printed circuit materials for use in markets, including portable communications, communications infrastructure, aerospace and defense.

Chandler, Arizona, USA

Laminates, Manufacturer of Assembly Material

Hot Nitrogen For Wave Soldering

Jul 05, 2012 | Laurent Coudurier, Fernand Heine, Didier Orlhac

First published in the 2012 IPC APEX EXPO technical conference proceedings. A new innovation for increasing quality & productivity of wave soldering machines....

Publisher: Air Liquide

Air Liquide

Air Liquide is the world leader in gases for industry, health and the environment. We produce air gases (oxygen, nitrogen, argon, rare gases, etc.) and many other gases, including hydrogen.

Paris, France

Other

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

Jun 27, 2012 | Chu-tien Chia, Richard Kunze, David Boggs, Margaret Cromley

First published in the 2012 IPC APEX EXPO technical conference proceedings. Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high speed channel performance. Determining and controlling PCB inser...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

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