Dec 15, 2011 | I.Zednickova, M.Biler, J.Petrzilek, T.Zednicek
manganese dioxide or conductive polymer cathode. Higher stability is achieved by placement of the capacitor into an SMD case filled by an inert atmosphere and hermetically sealed. The long term stability testing performed on such hermetically sealed capac...
Publisher: AVX Corporation
A leading international electronic supplier of components and connectors with worldwide manufacturing facilities, offering the world's broadest selection of passive electronic components.
Fountain Inn, South Carolina, USA
Dec 08, 2011 | Chrys Shea - Shea Engineering Services, Ray Whittier - Vicor Corporation
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c...
Publisher: Shea Engineering Services
Dec 01, 2011 | Dr Ronald C. Lasky
Are electronics any “greener” than before RoHS? It is a fair question to ask. With the advent of RoHS on July 1, 2006, and more recently REACH, one might be inclined to answer that it is greener than it was. We will take a look at this question in several...
Publisher: Indium Corporation
Nov 25, 2011 | Norocel Codreanu, Radu Bunea, Paul Svasta
The article presents virtual and real investigations related to current capacity and fusing of PCB traces in high power applications and is based on a scientific paper delivered by authors at SIITME 2010 in Romania. The reason of performing the research a...
CETTI offers a substantial support in electronic packaging activities for innovative SMEs, and sustains training for continuing education of the human resource involved in electronics industry.
Nov 16, 2011 | Dave Becker
Flexible Circuits are proven, reliable interconnect solutions for many of today's electronic packages. This article gives some general guidelines in terms of "dos" and "don'ts" that will help the engineer or designer make better decisions when using flex...
Publisher: All Flex Flexible Circuits, LLC
Nov 10, 2011 | John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity ...
iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.
Herndon, Virginia, USA
Nov 03, 2011 | Anupam Seth, Diego Klabjan, Placid M. Ferreira
This paper presents the development of a novel vehicle-routing-based algorithm for optimizing component pick-up and placement on a collect-and-place type machine in printed circuit board manufacturing. We present a two-phase heuristic that produces soluti...
Publisher: Mechanical Science and Engineering at UIUC
Oct 27, 2011 | Cheryl Tulkoff, Greg Caswell
Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
Oct 20, 2011 | Oldŕich Šuba, Libuše Sýkorová, Štépán Šanda, Michal Stanék
Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters....
Publisher: Tomas Bata University
Oct 13, 2011 | Eric Klaver, Senior Product Manager, Assembléon. Patrick Huberts, Product Manager Semicon Market.
Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placement are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders....