Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
625 SMT / PCB Technical Articles

Case study: Improving PCBA Yield

Apr 22, 2010 | Subrat Prajapati

Current situation: Present Rejection = 18%.

Sigma Level = 2.42

Scope of Project: Vendor PCB Assembly to Functional Testing of PCBA...

Publisher: Larsen Toubro Medical Equipment & Systems Ltd

Larsen Toubro Medical Equipment & Systems Ltd

Medical Equipment Design and manufacturing

Mysore, , India

OEM

Ceramic to Plastic Packaging

Apr 15, 2010 | Michael D. Frederickson, EMPF Director; Barry Thaler, Ph.D. EMPF Technical Director Empfasis Technical Editor; Paul Bratt, Empfasis Editor.

As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, United States

Other

Thick Film Polymer Resistors Embedded in Printed Circuit Boards

Apr 15, 2010 | Lynne Dellis, M S Chan, Tom Dueber, Shane Fang, John Summers; DuPont Electronic Technologies

The high level of current interest in embedded passives in printed circuit boards is driven by the tremendous pressure to pack more circuitry into smaller spaces. However, adoption has been limited due to design, prototyping and infrastructure issues, as well as the stability and tolerances necessary for widespread replacement of discretes. The focus of this work has been to develop a polymer thick film resistor technology to incorporate reliable organic resistors inside printed wiring boards using standard PWB processing....

Publisher: DuPont

DuPont

World's most dynamic science company, creating sustainable solutions for a better, safer and healthier life.

Wilmington, Delaware, United States

Manufacturer of Assembly Material, Components/Substrates, Laminates

Shedding Light on Machine Vision

Apr 07, 2010 | Microscan

For effective machine vision, the first step in devising a vision system should be the lighting. This paper reviews important criteria for setting up an effective lighting system....

Publisher: Microscan Systems Inc

Microscan Systems Inc

Microscan focuses on technologies of automatic identification, machine vision, and illumination with application solutions ranging from basic barcode reading up to complex machine vision inspection, gauging, and measurement.

Renton, Washington, United States

Other, Inspection

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Mar 30, 2010 | Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J.Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger.

This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board....

Publisher: Flextronics International

Flextronics International

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Manufacturer's Rep

Stencil Design Using Regression:Following IPC 7525 a Way Better

Mar 25, 2010 | Subrat Prajapati; Process Engineering Larsen & Toubro Limited, Medical Equipment and Systems (EBG)

The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects....

Publisher: Larsen Toubro Medical Equipment & Systems Ltd

Larsen Toubro Medical Equipment & Systems Ltd

Medical Equipment Design and manufacturing

Mysore, , India

OEM

SMT Stencil Design And Consideration Base on IPC

Mar 23, 2010 | Cuong Tran, Process Engineer

This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology...

Publisher: IPC

IPC

IPC is the trade association for the printed wiring board and electronics assembly industries.

Bannockburn, Illinois, United States

Association, Non-Profit, Training / Education, Trade Show Organizer

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods.

Mar 18, 2010 | Renee Michalkiewicz, Gaylon Morris; Trace Laboratories, Inc., Simin Bagheri; Celestica, Inc.

Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used....

Publisher: Trace Laboratories

Trace Laboratories

An internationally accredited, full service testing and analysis company providing design studies, failure analyses, product/material qualifications, safety inspections, and consulting services

Hunt Valley, Maryland, United States

Test Services

Screening for Counterfeit Electronic Components

Mar 11, 2010 | Stephen Schoppe, Glenn Robertson - SMTAI Proceedings

Counterfeit products have been a growing problem worldwide, and the electronics industry has been no exception. Authentication of electronic components by electrical and physical testing can provide a cost-effective means of risk management, aimed at keeping counterfeits out of the supply chain. In this presentation, we will review sources of counterfeit components, and discuss the capabilities and limitations of test processes used for authentication. We will then present examples of component authentication using these tools....

Publisher: Process Sciences, Inc.

Process Sciences, Inc.

Service company for laboratory, training and component repair

Leander, Texas, United States

Service Provider

Aiming for High First-pass Yields in a Lead-free Environment

Mar 04, 2010 | Mario Scalzo Senior Technical Support Engineer CSMTPE, Six Sigma Black Belt, Indium

While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

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