Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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630 SMT / PCB Technical Articles

Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Jun 12, 2014 | Arijit Roy

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis....

Publisher: WASET - World Academy of Science, Engineering and Technology

WASET - World Academy of Science, Engineering and Technology

A scholarly open access, peer-reviewed, interdisciplinary, monthly and fully refereed journal focusing on theories, methods and applications in Science, Engineering and Technology.

Riverside, Connecticut, United States

Association, Non-Profit, Publication or Online Resource

Stencil Printing Yield Improvements

Jun 05, 2014 | Dr. Mike Bixenman, Debbie Carboni, Jason Chan

Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.

(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement....

Publisher: Kyzen Corporation

Kyzen Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, United States

Cleaning

Solder Joint Encapsulant Adhesive Pop TMV High Reliability And Low Cost Assembly Solution

Jun 02, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years....

Publisher: YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, United States

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

Microspring Characterization and Flip-Chip Assembly Reliability

May 29, 2014 | B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F. Böhringer, A. V. Krishnamoorthy, E, M. Chow

Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance (< 100 mΩ) and high compliance (> 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is < 40 mΩ. A daisy-chain test die consisting of 2844 contacts is assembled into flip-chip packages with 100% yield. Thermocycle and humidity testing suggest that packages with or without underfill can have stable resistance values and no glitches through over 1000 thermocycles or 6000 h of humidity.

This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules....

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Institute of Electrical and Electronics Engineers (IEEE)

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Piscataway, New Jersey, United States

Association, Non-Profit, Training / Education

Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system.

May 22, 2014 | A. Boulouiz, M. El Moudane, M. Mekkaoui, A. Sabbar

In this paper, the general solution model of Chou has been used to predict the integral enthalpies of mixing of liquid In-Sn-Zn ternary alloys in five selected sections, xIn/xSn = 0.15/0.85, 0.34/0.66, 0.50/0.50, 0.67/0.33 and 0.85/0.15. The other traditional models such as Kohler, Muggianu, Toop and Hillert are also included in calculations. Comparison with literature data was done and showed reasonable agreement with Toop and Hillert asymmetric models....

Publisher: Université Mohammed V-Agdal

Université Mohammed V-Agdal

Mohammed V University at Agdal offers a wide set of degrees both in the undergraduate and graduate levels.

Rabat, Morocco

Training / Education

Performance of Light Emitting Diode on Surface Machined Heat Sink

May 15, 2014 | S. Shanmugan*, D. Mutharasu, O. Zeng Yin

In the point of efficient heat removal from light emitting diode (LED) package to ambient, the surface of the heat sinks must be finished based on required condition. The surface finishing plays an important role in efficient heat dissipation. In our work, the top surface of heat sink was machined like two different shapes (slotted and 'W' shaped) and tested the thermal performance for 3W green LED. The total thermal resistance was high for 'W' shaped surface at 100 mA. Surface modification was not influenced much on the thermal resistance (Rth) value at higher operating current. Noticeable increase on junction temperature was observed for 'W' shaped surface at 100 mA than slotted surface. In optical properties, low lux values were recorded for ‘W’ shaped surface at all operating current. In addition, 'W' shaped surface showed low value in CRI than other two surfaces (plain and slotted). The observed CCT value was decreased as the measuring time increased. High value in CCT was observed for ‘W’ shaped surface at higher operating current (> 350mA). Slotted surface showed good performance on both thermal and optical properties of the given 3W green LED....

Publisher: Universiti Sains Malaysia

Universiti Sains Malaysia

USM offers courses ranging from Natural Sciences, Applied Sciences, Medical and Health Sciences, Pharmaceutical Sciences to Building Science and Technology, Social Sciences, Humanities, and Education.

Pulau, Penang, Malaysia

Training / Education

Lead-Free Soldering Guide

May 12, 2014 | AIM

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Solder Joint Encapsulant Adhesive POP Assembly Solution

May 12, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive....

Publisher: YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, United States

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

Challenges in Bare Die Mounting

May 08, 2014 | Larry Gilg, Die Products Consortium.

Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate....

1 comments.

Publisher: Die Products Consortium

Die Products Consortium

The Die Products Consortium (DPC) is a group of leading microelectronic companies collaborating to expand the market for semiconductor die products.

Austin, Texas, United States

Association, Non-Profit

Strain Solitons and Topological Defects in Bilayer Graphene

May 01, 2014 | Jonathan S. Aldena, Adam W. Tsena, Pinshane Y. Huanga, Robert Hovdena, Lola Brownb, Jiwoong Parkb,c, David A. Mullera,c, and Paul L. McEuen.

Bilayer graphene has been a subject of intense study in recent years. The interlayer registry between the layers can have dramatic effects on the electronic properties: for example, in the presence of a perpendicular electric field, a band gap appears in the electronic spectrum of so-called Bernal-stacked graphene. This band gap is intimately tied to a structural spontaneous symmetry breaking in bilayer graphene, where one of the graphene layers shifts by an atomic spacing with respect to the other. This shift can happen in multiple directions, resulting in multiple stacking domains with soliton-like structural boundaries between them...

Publisher: Cornell University

Cornell University

Cornell University's colleges, schools, and other academic units offer more than 4,000 courses, 70 undergraduate majors, 93 graduate fields of study, undergraduate and advanced degrees.

Ithaca, New York, United States

Training / Education

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