Electronics Manufacturing Technical Articles
Papers and articles related to SMT, PCB & EMS industry.
- Technical Library
850 SMT / PCB Assembly Related Technical Articles
Apr 24, 2017 | Tuan Tran
The process of taking a design from schematic to actual working prototype is a complex one, however, and proper documentation is the best way to simplify it....
Publisher: Power Design Services
Apr 20, 2017 | Innovative Sensor Technology
IST AG thin film mass flow sensors offer solutions for a wide variety of flow applications. The thin film and membrane technologies incorporate highly accurate temperature sensors and heaters as core elements of the sensors. IST AGs flow sensors are applicable in gas (liquids upon request), have an operating temperature range of -30 °C to +450 °C, and can measure low rate and direction from 0.0001 m/s (microflowSens) to 100 m/s (respectively from 1 mL/min to 10 L/min). In addition to measuring flow rates, our sensors can detect the presence of a liquid, biofilm or bubbles as well as indicate liquid level. Development channels guarantee the best possible adaptation of our sensors, whether in terms of dynamic range, response time, directional detection or ambient conditions. ...
Publisher: Innovative Sensor Technology USA Division
Apr 20, 2017 | Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)
This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability....
Apr 15, 2017 | Tuan Tran
Few things are more exciting to manufacturers than new product ideas. New designs, engineering challenges and the ability to deliver a new user experience are all rewarding hallmarks of innovation. However, the road that separates conceptualization and commercialization is riddled with tight turns and obstacles. Fast, efficient prototyping is one of the best ways to prepare yourself for the journey....
Publisher: Power Design Services
Apr 14, 2017 | catherine
RFID tags and labels have been used around in our life with rising trend, no matter where you go, RFID may used there. But someone still have such questions, where RFID tags are used? what are RFID tags used for? why use RFID tags? And where can I buy RFID tags? If you have such questions, congratulation! You come to the right place!...
A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste
Apr 13, 2017 | Karl Seelig, Tim O'Neill
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.
As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.
The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs....
Publisher: AIM Solder
Apr 13, 2017 | Soraya Terrab
Parylene has been used for decades as a barrier layer to protect critical devices and components. The parylene deposition process typically requires an adhesion promotion step to make sure the parylene adheres well to the base substrate. Typical adhesion methods don't work well on Kapton and Polyamide, until VSI Parylene came up with a solution....
Publisher: VSI Parylene
VSI Parylene specializes in conformal coating services that deliver consistent, repeatable and high-quality molecular protection. Our proven process ensures personal attention, rapid development, and precise coatings.
Broomfield, Colorado, USA
Apr 06, 2017 | Wim Bogaerts, Pieter Dumon, Martin Fiers; Luceda Photonics, Jeff Miller; Mentor Graphics
Silicon photonics is an IC technology where data is transferred using light that is routed on the chip using optical waveguides (Figure 1). Silicon photonics is best known as a method to solve problems with high input/output bandwidth applications. For example, because of ever-growing bandwidth requirements in datacenters, the optical transmit and receive heads are being placed closer and closer to the board and the IC. But, designers also apply this technology to biosensors, medical diagnostics, and environmental monitoring. Regardless of the application, photonic ICs always need integration to electronic circuits and this results in unique challenges....
Publisher: Mentor Graphics
Mar 30, 2017 | Bob Wettermann, BEST Inc. MIT
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail....
Publisher: BEST Inc.
BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.
Rolling Meadows, Illinois, USA
Mar 22, 2017 | Tony Lentz
Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.
This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies....
Publisher: FCT ASSEMBLY, INC.