Electronics Manufacturing Technical Articles
Papers and articles related to SMT, PCB & EMS industry.
- Technical Library
836 SMT / PCB Assembly Related Technical Articles
Feb 23, 2017 | PTC
Managing the environmental performance of products is an increasingly complicated challenge for manufacturers today. These companies face a complex tangle of requirements and mandates from regulators, consumers and customers to manage the toxicity, recycleability and overall environmental impact of their products. Not only have governments, business-to-business customers and consumers demonstrated a clear preference for better environmentally performing and "greener" brands, but investors are now pressuring manufacturers, as well. For example, the Dow Jones Sustainability Index identifies and tracks leading sustainability-driven companies around the world.
This paper focuses on the challenges companies face and the best practices they can employ when collecting substance, material and compliance data from their suppliers and supply chain....
Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders
Feb 16, 2017 | Thomas Sanders, Sivasubramanian Thirugnanasambandam and John Evans, Ph.D., Michael Bozack, Ph.D., Jeff Suhling, Ph.D. - Auburn University, Wayne Johnson, Ph.D. - Tennessee Tech University
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.
This paper was originally published by SMTA in the Proceedings of SMTA International....
Publisher: Auburn University
Feb 09, 2017 | Eric Bastow
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.
But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question....
Publisher: Indium Corporation
Feb 01, 2017 | Bob Wettermann
BGA Rework Course encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. There should be 'one-stop' solution, that offers a wide range of ball grid array rework and repair services....
Publisher: BEST Inc.
BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.
Rolling Meadows, Illinois, USA
Jan 31, 2017 | DPL Industri A/S Denmark
Compared with general Mercury Lamp, normal LED can only provide a very narrow band. See the left side figure, which compare the output of a multi-wavelength( 365nm-410nm) LED lamp with traditional mercury lamp. At the same wavelength 365nm,LED lamp can output much more energy than traditional mercury lamp, means LED lamp can provide more high energy output in UV-A range. DPL eAsycure LED curing system use the latest LED technology on LED chip combination to reach high Joule Energy (DOSIS Energy), so it can easily cure UV ink in UVA range instead of single wavelength LED ink. According to our client’s ink performance, DPL LED Curing system can setup different output energy at different wavelength. If you have any question,please contact with our service team at email@example.com or visit our website: www.dpl.dk...
Jan 31, 2017 | DPL Industri A/S Denmark
DPL LED Easycure LED system is base on the latest LED curing technology, which combine with a high effective and smart construction ensure a stable and perfect curing quality for different types of coating, printing, bonding application. DPL LED curing system series is build up with length from 82mm to 2240mm. We also provide customer design service. FEATURE : High UV curing energy output: with our special construction of LED Chips, DPL LED curing system can reach 146w/cm, output energy up to 650mj/cm2 by 100m/min printing speed, Peak energy up to 26w/cm2. Long lifetime: with high effective water chill construction, DPL LED curing system can reach more than 20.000 hours by 100% Radiation. Suitable for LED or mercury UV ink: DPL LED curing system provide high Joule energy (DOSIS ENERGY) with wave length from 365-395nm. “Plus & Play” smart system: DPL LED Curing system is smart system with “plus &play” design, easy to operation and suitable to install in existing machine....
Jan 24, 2017 | Dora Yang
Basic performance of PCB (Printed Circuit Board) depends on the performance of substrate material. In order to improve the performance of PCB, you have to increase the performance of PCB substrate material first. This article introduces how to chose PCB substrate material for your custom PCB project from multiple perspectives....
PCBCart, a highly skilled PCB Fab, Parts Sourcing & Assembly services provider for global companies, fabricates 23k+ different PCB designs each year, and are committed on the quality & performance of every circuit board it printed
Jan 23, 2017 | Connie Miede
"Water is not a problem of the future, but a key issue of our time for businesses: In the future, urgent water risks will increase in many areas of the world. A growing population, a changing consumer behavior and climate change will have an immediate impact on the availability and quality of water and thus build further pressure on governments, businesses and societies." (Quote from the summary of the 2014 WWF study "The imported risk. Germany's water risk in the age of globalization.")...
Publisher: Kolb Cleaning Technology USA LLC
Jan 19, 2017 | Benjamin Jordan
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.
Rigid-Flex circuit boards require additional cutting and lamination stages, and more exotic materials in manufacturing and therefore the cost of re-spins and failures are very much higher than traditional rigid boards. To reduce the risk and costs associated with rigid-flex design and prototyping, it is desirable to model the flexible parts of the circuit in 3D CAD to ensure correct form and fit. In addition it is necessary to provide absolutely clear documentation for manufacturing to the fabrication and assembly houses....
Jan 05, 2017 | Mitch Holtzer, Steve Brown - Alpha, Marcus Reichenberger - Technische Hochschule Nürnberg
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.
The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used....