Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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625 SMT / PCB Technical Articles

Performance of Light Emitting Diode on Surface Machined Heat Sink

May 15, 2014 | S. Shanmugan*, D. Mutharasu, O. Zeng Yin

In the point of efficient heat removal from light emitting diode (LED) package to ambient, the surface of the heat sinks must be finished based on required condition. The surface finishing plays an important role in efficient heat dissipation. In our work, the top surface of heat sink was machined like two different shapes (slotted and 'W' shaped) and tested the thermal performance for 3W green LED. The total thermal resistance was high for 'W' shaped surface at 100 mA. Surface modification was not influenced much on the thermal resistance (Rth) value at higher operating current. Noticeable increase on junction temperature was observed for 'W' shaped surface at 100 mA than slotted surface. In optical properties, low lux values were recorded for ‘W’ shaped surface at all operating current. In addition, 'W' shaped surface showed low value in CRI than other two surfaces (plain and slotted). The observed CCT value was decreased as the measuring time increased. High value in CCT was observed for ‘W’ shaped surface at higher operating current (> 350mA). Slotted surface showed good performance on both thermal and optical properties of the given 3W green LED....

Publisher: Universiti Sains Malaysia

Universiti Sains Malaysia

USM offers courses ranging from Natural Sciences, Applied Sciences, Medical and Health Sciences, Pharmaceutical Sciences to Building Science and Technology, Social Sciences, Humanities, and Education.

Pulau, Penang, Malaysia

Training / Education

Lead-Free Soldering Guide

May 12, 2014 | AIM

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

Solder Joint Encapsulant Adhesive POP Assembly Solution

May 12, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive....

Publisher: YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, United States

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

Challenges in Bare Die Mounting

May 08, 2014 | Larry Gilg, Die Products Consortium.

Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate....


Publisher: Die Products Consortium

Die Products Consortium

The Die Products Consortium (DPC) is a group of leading microelectronic companies collaborating to expand the market for semiconductor die products.

Austin, Texas, United States

Association, Non-Profit

Strain Solitons and Topological Defects in Bilayer Graphene

May 01, 2014 | Jonathan S. Aldena, Adam W. Tsena, Pinshane Y. Huanga, Robert Hovdena, Lola Brownb, Jiwoong Parkb,c, David A. Mullera,c, and Paul L. McEuen.

Bilayer graphene has been a subject of intense study in recent years. The interlayer registry between the layers can have dramatic effects on the electronic properties: for example, in the presence of a perpendicular electric field, a band gap appears in the electronic spectrum of so-called Bernal-stacked graphene. This band gap is intimately tied to a structural spontaneous symmetry breaking in bilayer graphene, where one of the graphene layers shifts by an atomic spacing with respect to the other. This shift can happen in multiple directions, resulting in multiple stacking domains with soliton-like structural boundaries between them...

Publisher: Cornell University

Cornell University

Cornell University's colleges, schools, and other academic units offer more than 4,000 courses, 70 undergraduate majors, 93 graduate fields of study, undergraduate and advanced degrees.

Ithaca, New York, United States

Training / Education

Expectations for Companies' Conflict Minerals Reporting

Apr 24, 2014 | Darren Fenwick, Patricia Jurewicz.

By May 31, 2014, it is expected that companies, officially known as issuers, will be required to take the unprecedented step of submitting their first conflict minerals disclosures to the Securities and Exchange Commission, or SEC. This paper is intended to describe the content that certain sustainable and responsible investors, or SRIs, and nongovernmental organizations, or NGOs, expect to see in an issuer's Specialized Disclosure, or Form SD, and Conflict Minerals Report, or CMR, if a CMR is deemed necessary....

Publisher: Responsible Sourcing Network

Responsible Sourcing Network

RSN champions human rights with vulnerable communities in the mining and harvesting of raw materials found in products we use every day.

Oakland, California, United States

Association, Non-Profit

A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill

Apr 11, 2014 | Dr. Mary Liu and Dr. Wusheng Yin

In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for use in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable....

Publisher: YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, United States

Manufacturer of Assembly Material, Components/Substrates, Contract Manufacturer

Solar Panel Design Decision and General Information Sheet

Apr 10, 2014 | Alexander L Carrere.

This paper is meant to be a guide and a reference to new and old members alike who wish to know about, understand, and improve on the decisions made and processes implemented to build the current solar panels. The following paragraphs in the introduction will lay out background information on solar panels and cube satellites. This entire document was written with the idea that the reader will be able to follow the decisions made to construct the solar panels and then with this knowledge find areas of the project for improvement....

Publisher: iSAT Group

iSAT Group

We are a student group at Brown University working to build a low-cost, open-source CubeSat, EQUiSat.

Providence, Rhode Island, United States


A System Level Electrostatic Discharge Protection Modeling Methodology for Time Domain Analysis.

Apr 03, 2014 | Nicolas Monnereau, Fabrice Caignet, David Trémouilles, Nicolas Nolhier, Marise Bafleur.

A system level modeling methodology is presented and validated on a simple case. It allows precise simulations of electrostatic discharge (ESD) stress propagation on a printed circuit board (PCB). The proposed model includes the integrated circuit (IC) ESD protection network, IC package, PCB lines, passives components, and externals elements. The impact of an external component on the ESD propagation paths into an IC is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between all the elements of an operating PCB. A precise measurement technique was designed and used to compare with the simulation results. The model proposed in this paper is able to predict, with good accuracy, the propagation of currents and voltages into the whole system during ESD stress. It might be used to understand why failures occur and how to fix them with the most suitable solution....

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Institute of Electrical and Electronics Engineers (IEEE)

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Piscataway, New Jersey, United States

Association, Non-Profit, Training / Education

Cleaning PCB's in Electronics - Understanding Today's Needs.

Mar 27, 2014 | P.J. Duchi, Anne-Marie Laugt, Marie Verdier, G.Aabidh.

Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices....

Publisher: Inventec Performance Chemicals

Inventec Performance Chemicals

Inventec, one of Europe's leading Performance Chemicals companies, is the high-tech industries business of the Dehon Group

Vincennes , France

Manufacturer of Assembly Material

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