Nov 12, 2010 | Sjef v. Gastel, Manager of Advanced Development, Assembléon
Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyo...
Nov 06, 2010 | Tsun-kit Chin
An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on ...
Publisher: Samtec, Inc.
Nov 04, 2010 | Dr. Ken Gilleo
Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab...
Publisher: Cookson Electronics
Oct 28, 2010 | Benson Chan, How Lin, Chase Carver, Jianzhuang Huang, Jessie Berry
Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven...
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, United States
Oct 21, 2010 | F.M. Collins, W.M. Mathias
Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab...
Oct 21, 2010 | Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling
Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects....
Publisher: Auburn University
Oct 13, 2010 | Dipl.-Ing. Hartmut Berndt
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So, it is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation will give ...
Publisher: B.E.STAT European ESD Competence Centre
Oct 07, 2010 | Ila Pal
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin...
Publisher: Ironwood Electronics
Sep 30, 2010 | Tz-Sheng Peng, Chiou-Shann Fuh
As technology is much more advanced nowadays, electronic devices are ubiquitous in our daily life. PCB (Printed Circuit Board) plays an important role in almost every modern electronic device. However, there still is not a perfect PCB manufacturing proces...
Publisher: National Taiwan University
NTU is the top-ranked university in Taiwan and placed among the best 95 universities in the world.
Sep 23, 2010 | Hana Charvátová, Dagmar Janáčová, Miloslav Fialka and Karel Kolomazník
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi...
Publisher: Acta Montanistica Slovaca