Feb 03, 2011 | DfR Solutions
First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, United States
Jan 27, 2011 | Dr. Andy Mackie
In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.....
Publisher: Indium Corporation
Jan 20, 2011 | Yasuyuki Shinbo
This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases"....
Publisher: OKI Printed Circuits Co., Ltd.
Jan 20, 2011 | Henry Ott Consultants
PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo...
Publisher: Henry Ott Consultants
Jan 13, 2011 | Terry Munson
The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin ...
Publisher: Foresite Inc.
Jan 06, 2011 | Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar
The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ...
Dec 22, 2010 | Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich
This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, United States
Dec 16, 2010 | Jakob Dieterle
This report discusses the significance of heat management in the design of printed circuit boards (PCB). After an introduction into the basics of PCBs the crucial mechanisms of heat transfer are discussed with regard to significance and typical design par...
Publisher: Lund University, The Faculty of Engineering
Dec 09, 2010 | Cadence
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int...
Publisher: Cadence Design Systems, Inc.
Dec 02, 2010 | Barry Olney
Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...
Publisher: In-Circuit Design Pty Ltd