Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...
Publisher: Vi TECHNOLOGY
Feb 16, 2012 | Jim Nadolny, Leon Wu
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel...
Publisher: Samtec, Inc.
Feb 09, 2012 | Curtis Smith, Huntron Technical Support
The Fundamentals of Signature Analysis Technical document discusses the basics of power-off analog signature analysis, how it relates to basic electronic devices and how it is used for circuit board troubleshooting....
Publisher: Huntron, Inc.
Feb 02, 2012 | Nicolas Lietaer, Thor Bakke, Anand Summanwar (SINTEF), Per Dalsjø, Jakob Gakkestad (Norwegian Defence Research Establishment), Frank Niklaus (KTH – Royal Institute of Technology)
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S...
Scandinavia's largest independent research organisation. Every year, SINTEF supports research and development at 2,000 or so Norwegian and overseas companies via its research and development activity.
Jan 26, 2012 | Jonathan Friedman, Newton Truong, Mani B. Srivastava
In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num...
Jan 19, 2012 | Tsuneo TOKUMITSU
The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an...
Publisher: Sumitomo Electric Industries, Ltd.
Jan 12, 2012 | Ronak Varia, Xuejun Fan
In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi...
The mission of the Department of Mechanical Engineering at Lamar University is to provide high quality education and meaningful career opportunities for its graduates.
Beaumont, Texas, USA
Jan 05, 2012 | Greg Caswell
Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
Dec 29, 2011 | Jim Hines, Adam Stanczak, David Decker, Theeraphong Kanjanupathum
2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi...
Dec 22, 2011 | Prawin, Paulraj , Paul, Brian K.
This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate ch...
Providing an education that prepares our students as entrepreneurial, team-oriented, and work-ready graduates in mechanical, industrial, and manufacturing engineering and energy engineering management
Corvallis, Oregon, USA