Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • PCB X-Ray Inspection
  • PCB Rework Tools
739 SMT / PCB Technical Articles

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

Sep 20, 2012 | Khaw Mei Ming, Andrey Lee

First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin...

5 comments.

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer of Assembly Equipment

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Sep 13, 2012 | Ward Gatza; Agilent Technologies, Inc., Tom Evans; Thomas C. Evans Consulting

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor...

2 comments.

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer of Assembly Equipment

Pad Cratering - The Invisible Threat to the Electronics Industry

Sep 06, 2012 | Chris Hunrath

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pad Cratering opens circuits. This occurs when the resin crack (fracture) migrates through a copper trace or via. This happens at assembly, in service or during handling. When com...

6 comments.

Publisher: Integral Technology, Inc

Integral Technology, Inc

Manufacturer and distributor of HDI electronic materials for the printed circuit board industry

Lake Forest, California, USA

Laminates, Manufacturer of Assembly Material

Inclusion Voiding in Gull Wing Solder Joints

Aug 30, 2012 | T.L. Lewis, C.O. Ndiaye, J.R. Wilcox

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications....

1 comments.

Publisher: IBM Corporation

IBM Corporation

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Other, Software Manufacturer

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Aug 23, 2012 | Susan D. Landry

First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res...

Publisher: Albemarle Corporation

Albemarle Corporation

Albemarle is a leading specialty chemical company providing innovative chemistry solutions to customers in over 100 countries around the world.

Baton Rouge, Louisiana, USA

Components/Substrates

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

Aug 16, 2012 | David M. Lee, Lesly A. Piñol, PhD

First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu...

1 comments.

Publisher: Johns Hopkins Applied Physics Laboratory

Johns Hopkins Applied Physics Laboratory

The Applied Physics Laboratory (APL) is a not-for-profit center for engineering, research, and development.

Laurel, Maryland, USA

Association, Non-Profit, Training / Education

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments

Aug 09, 2012 | Mustafa Özkök, Joe McGurran, Hugh Roberts. Kenneth Lee, Guenter Heinz

First published in the 2012 IPC APEX EXPO technical conference proceedings. Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field failures and huge losses, which annually total several bi...

7 comments.

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Components/Substrates, Manufacturer of Assembly Material, Manufacturer of Components

An Investigation of Whisker Growth on Tin Coated Wire and Braid

Aug 02, 2012 | Dave Hillman, Tim Pearson, Thomas Lesniewski

First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o...

Publisher: Rockwell Collins

Rockwell Collins

Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.

Cedar Rapids, Iowa, USA

Manufacturer of Assembled PCBs, Other

Minimizing Voiding In QFN Packages Using Solder Preforms

Jul 27, 2012 | Seth J. Homer, Ronald C. Lasky, PhD, PE

First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

New Developments in PCB Laminates

Jul 19, 2012 | Dean Hattula, John Coonrod

First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high...

Publisher: Rogers Corporation, Advanced Circuit Materials Division

Rogers Corporation, Advanced Circuit Materials Division

A global technology leader in the development of high performance printed circuit materials for use in markets, including portable communications, communications infrastructure, aerospace and defense.

Chandler, Arizona, USA

Laminates, Manufacturer of Assembly Material

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