Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • PCB X-ray inspection
  • PCB X-Ray Inspection
  • PCB Rework Tools
  • high speed SMT pick and place - Mirae Mx400
708 SMT / PCB Technical Articles

What is really inside your AOI?

Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun

Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...

Publisher: Vi TECHNOLOGY


Vi TECHNOLOGY is a worldwide global supplier of a wide range of innovative Automated Inspection AOI, 3D-SPI equipment and software solutions that provide real time data collection and correlation across the SMT line.

Richardson, Texas, USA

Manufacturer of Assembly Equipment

Connector Models - Are They Any Good?

Feb 16, 2012 | Jim Nadolny, Leon Wu

Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel...

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA


Fundamentals of Analog Signature Analysis

Feb 09, 2012 | Curtis Smith, Huntron Technical Support

The Fundamentals of Signature Analysis Technical document discusses the basics of power-off analog signature analysis, how it relates to basic electronic devices and how it is used for circuit board troubleshooting....

Publisher: Huntron, Inc.

Huntron, Inc.

Huntron is a supplier of tools for engineers and technicians who test, diagnose and troubleshoot printed circuit assemblies. Our popular products are Huntron Tracker and test automation platforms such as the Access Robotic Prober.

Mill Creek, Washington, USA

Inspection, OEM

Wafer-Level Packaged MEMS Switch With TSV

Feb 02, 2012 | Nicolas Lietaer, Thor Bakke, Anand Summanwar (SINTEF), Per Dalsjø, Jakob Gakkestad (Norwegian Defence Research Establishment), Frank Niklaus (KTH – Royal Institute of Technology)

A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S...

Publisher: The Foundation for Scientific and Industrial Research - SINTEF

The Foundation for Scientific and Industrial Research - SINTEF

Scandinavia's largest independent research organisation. Every year, SINTEF supports research and development at 2,000 or so Norwegian and overseas companies via its research and development activity.

Trondheim, Norway

Association, Non-Profit

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

Jan 26, 2012 | Jonathan Friedman, Newton Truong, Mani B. Srivastava

In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num...

Publisher: UCLA - Networked & Embedded Systems Laboratory

UCLA - Networked & Embedded Systems Laboratory

NESL is engaged in research on architecture, design, and tools for networked and embedded computing and communication systems.

Westwood, Los Angeles, California, USA

Training / Education

Three-Dimensional MMIC and Its Evolution to WLCSP Technology

Jan 19, 2012 | Tsuneo TOKUMITSU

The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an...

Publisher: Sumitomo Electric Industries, Ltd.

Sumitomo Electric Industries, Ltd.

Manufacturer of cable, materials & equipment for the semiconductor and opto-electronic industries; supplying telecommunications, power transmission, information technology and automotive cable markets

Osaka, Japan


Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Jan 12, 2012 | Ronak Varia, Xuejun Fan

In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi...

Publisher: Lamar University - Department of Mechanical Engineering

Lamar University - Department of Mechanical Engineering

The mission of the Department of Mechanical Engineering at Lamar University is to provide high quality education and meaningful career opportunities for its graduates.

Beaumont, Texas, USA

Training / Education

Conformal Coating Why, What, When, and How

Jan 05, 2012 | Greg Caswell

Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment

Dec 29, 2011 | Jim Hines, Adam Stanczak, David Decker, Theeraphong Kanjanupathum

2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi...

Publisher: Molex


Molex is a global leader in interconnect solutions, as well as custom user-interfaces, membrane switches and flex circuits.

Lisle, Illinois, USA

Manufacturer of Components, Components/Substrates

Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers

Dec 22, 2011 | Prawin, Paulraj , Paul, Brian K.

This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate ch...

Publisher: OSU School of Mechanical, Industrial, and Manufacturing Engineering (MIME)

OSU School of Mechanical, Industrial, and Manufacturing Engineering (MIME)

Providing an education that prepares our students as entrepreneurial, team-oriented, and work-ready graduates in mechanical, industrial, and manufacturing engineering and energy engineering management

Corvallis, Oregon, USA

Training / Education

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