Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • PCB X-ray inspection
  • Solder Assembly Materials for the Electronics Industry
655 SMT / PCB Technical Articles

Backplane Architecture High-Level Design

Mar 16, 2011 | Lambert Simonovich

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane ...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Practical Fiber Weave Effect Modeling

Mar 16, 2011 | Lambert Simonovich

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Mar 10, 2011 | Neil Poole, Ph.D. and Brian Toleno, Ph.D.

History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead...

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, United States

Manufacturer of Assembly Material

A New (Better) Approach to Tin Whisker Mitigation

Mar 03, 2011 | Craig Hillman, Gregg Kittlesen, and Randy Schueller

Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures (see nepp.nasa.gov/whisker/ for a list longer than you need). But, with all of this knowledge, the industry is still struggling on how to predict and prevent these "Nefarious Needles of Pain"....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, United States

Service Provider

Dross and the Selective Soldering Process

Feb 24, 2011 | Alan Cable

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must ...

Publisher: ACE Production Technologies

ACE Production Technologies

Manufacturer of Selective Soldering Machines, Lead Tinning Machines and related products.

Spokane Valley, Washington, United States

Soldering

Ground Pours - To Pour Or Not To Pour?

Feb 17, 2011 | Barry Olney

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Service Provider

Novel Transmission Line for 40 GHz PCB Applications

Feb 10, 2011 | Jamal S. Izadian, Ph.D. - RFCONNEXT, Inc., Julian Ferry, Justin McAllister - Samtec, Inc.

In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz....

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, United States

Subcontractor

0201 and 01005 Adoption in Industry

Feb 03, 2011 | DfR Solutions

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, United States

Service Provider

Dispelling 10 Myths About Nitrogen Reflow

Jan 27, 2011 | Dr. Andy Mackie

In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Development of Ultra-Multilayer Printed Circuit Board

Jan 20, 2011 | Yasuyuki Shinbo

This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases"....

Publisher: OKI Printed Circuits Co., Ltd.

OKI Printed Circuits Co., Ltd.

OKI Printed Circuits is engaged in design, manufacturing and sales of high-end multi-layer printed circuit boards.

Tokyo, Japan

Contract Manufacturer

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