Sep 22, 2011 | Ruben Burga, Dr. Mohammed Saad
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens)....
Sep 15, 2011 | Vern Solberg, Wael Zohni
The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new generations of processors to reach their performance potential many manufacturers have developed interface formats to enable greater memory bandwidth. To ensure that the memory functions are able to support the increased signal speed, package developers are relying more and more on innovative 3D package assembly techniques and process refinement....
Publisher: Invensas Corporation
Sep 08, 2011 | Miyachi Europe GmbH
Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly used for connecting displays to pcb’s using anisotropic conductive adhesive and flex foils. For successful implementation there are a few basic constraints. If these are followed, display connection is a simple and reliable process, giving top quality connections. Heat-Sealing can be done in any factory and can be introduced in a few months, from start of design to mass productions...
Publisher: MIYACHI EUROPE GmbH
Sep 02, 2011 | Alison Falco, president; Dynamic Systems Inc.
Too often the manufacturers will implement technology for financial reporting purposes but overlook efficiencies that can generate cash flow and reduce costs on the manufacturing floor. Accurate information that provides a business owner or manager the ability to make immediate decisions about his/her operation resulting in a boost to profitability is crucial during an economic downturn. If revenue is down and the market mood does not permit price increases, then profitability can only be realized by reducing costs. So you must ask yourself "What prevents me from 100% efficiency?"...
Publisher: Dynamic Systems, Inc.
Sep 01, 2011 | Harold Hyman
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons....
Publisher: VJ Electronix
Rework and X-ray Inspection solutions for a variety of applications. VJ integrates proven industrial X-ray expertise with advanced SRT automation and NIS X-ray electronics inspection expertise.
Bohemia, New York, United States
Aug 25, 2011 | Dr. Randy Schueller
While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about the high reflow temperatures of SAC or relies on ODM, it is im...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, United States
Aug 18, 2011 | Microscan
Overview of ESD, Associated Risks and Prevention Measures...
Aug 11, 2011 | Ajay Pal Singh Chauhan, Sharat Chandra Bhardwaj
(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar...
Sant Longowal Institute of Engineering and Technology is an autonomous body, fully funded by Government of India and controlled by SLIET Society.
Distt. Sangrur, Punjab, India
Aug 04, 2011 | William Edward Swaim
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and ...
Publisher: Auburn University
Jul 28, 2011 | Advanced Thermal Solutions, inc.
Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF...
Publisher: Advanced Thermal Solutions, Inc
A leading engineering and manufacturing company supplying a wide range of heat sinks and laboratory-quality thermal instrumentation, together with thermal design consulting.
Norwood, Massachusetts, United States