Dec 03, 2009 | R. R. Madsen
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension....
Publisher: Texas Instruments
Dallas, Texas, United States
category: Manufacturer of Components
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. T
Nov 24, 2009 | Assembléon
With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift in the technology? At what point is solder paste no longer viable? How small of a feature can be printed with solder paste, and can this process be implemented into a production environment?...
Nov 18, 2009 | Gerry Padnos Director of Technology, Juki Automation Systems.
Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link....
Publisher: Juki Automation Systems
Morrisville , North Carolina, United States
category: Manufacturer of Assembly Equipment
Juki Automation Systems, Inc., the exclusive partner of Tokyo-based Juki Corporation, is a leading supplier of SMT automated assembly equipment to the printed circuit board assembly market.
Nov 11, 2009 | Alan Sguigna Vice President Sales and Marketing ASSET InterTech, Inc.
Non-intrusive board test (NBT) has become an increasingly critical facet of contemporary board test strategies. Recent developments in basic electronic technology as well as the evolving economics of electronic test have combined to make NBT and the test technologies that comprise it, such as boundary-scan test, processor-controlled test (PCT) and built-in self test (BIST), a necessity....
Publisher: ASSET InterTech, Inc.
Nov 05, 2009 | Karl F. Seelig.
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress....
Publisher: AIM Solder
Oct 29, 2009 | Reiner Zoch, Product Manager Christian Ott, Sales and Project Manager SEHO Systems GmbH
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is already unacceptable due to the required quality and the reproducibility of the whole manufacturing process....
Publisher: SEHO Systems GmbH
Oct 22, 2009 | Phil Kinner
An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical applications. Conformal coatings have long been used to protect electronic assemblies from their operating environment but can vary hugely in their protective performance. It is the objective of this article to explain in detail why it is important to qualify coating products to the relevant standards and how different coating types affect performance....
Oct 14, 2009 | Elissa Bumiller and Dr. Craig Hillman
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)...
Publisher: DfR Solutions
College Park, Maryland, United States
category: Service Provider
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
Oct 08, 2009 | Rabindra N. Das, Konstantinos I. Papathomas, Steven G. Rosser, Tim Antesberger, John M. Lauffer, Mark D. Poliks and Voya R. Markovich.
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described....
Publisher: Endicott Interconnect Technologies
Endicott, New York, United States
Providing customers with solutions in Information Technology, Communications, Instrumentation, Simulation, Medical, Aerospace/Defense and Automotive industries
Sep 30, 2009 | Aqueous Technologies Corporation
Being involved in the electronics assembly industry for more than 23 years, specifically in the field of defluxing and cleanliness testing, I have seen my share of environmental regulations. Long before the debate over lead-free alloys, there was the Montreal Protocol....
Publisher: Aqueous Technologies Corporation